Liquid Cooling Using PCB Through Holes

Abstract

Described herein are devices, systems, methods, and processes for an efficient liquid cooling system for electronic components mounted on a printed circuit board (PCB). The system utilizes PCB through holes to carry a liquid coolant. The cooling system includes a coolant loop through which a pump circulates the coolant. A cooling sub-assembly includes a cooling channel thermally coupled to the component to be cooled. The cooling sub-assembly further includes a coolant supply PCB through hole that carries the cooled coolant from a supply manifold on the bottom side of the PCB to the cooling channel on the top side of the PCB and a coolant return PCB through hole that carries the heated coolant from the cooling channel to the return manifold on the bottom side of the PCB. The cooling system includes a control system for coolant distribution that can react to component temperatures.

What is claimed is: 
     
         1 . A system, comprising:
 a printed circuit board (PCB) comprising:
 a plurality of coolant through holes; 
 a top side; and 
 a bottom side; and 
   a manifold component comprising:
 a PCB connection port configured to couple with at least one coolant through hole; and 
 a coolant conduit, 
   wherein the manifold component is disposed on a side of the PCB, such that a first coolant through hole of the plurality of coolant through holes is coupled with the PCB connection port.   
     
     
         2 . The system of  claim 1 , wherein the manifold component further comprises a plurality of fastening receptacles, and a plurality of fastener connectors coupled to the plurality of fastening receptacles and the PCB is utilized to couple the manifold component to the side of the PCB. 
     
     
         3 . The system of  claim 1 , wherein solder is utilized to couple the manifold component to the side of the PCB. 
     
     
         4 . The system of  claim 1 , wherein glue is utilized to couple the manifold component to the side of the PCB. 
     
     
         5 . The system of  claim 1 , wherein the manifold component is disposed on the bottom side of the PCB. 
     
     
         6 . The system of  claim 5 , further comprising:
 an electronic component;   a heat-spreading member included in or coupled to the electronic component; and   a cooling channel,   wherein the electronic component is disposed on the PCB, and the electronic component is thermally coupled to the heat-spreading member and the cooling channel.   
     
     
         7 . The system of  claim 6 , wherein the cooling channel is formed within the heat-spreading member. 
     
     
         8 . The system of  claim 6 , wherein:
 the top side of the PCB further comprises a first groove,   the heat-spreading member further comprises a second groove, and   the cooling channel is formed based on joining the first groove and the second groove.   
     
     
         9 . The system of  claim 8 , wherein the PCB further comprises a solder mask, and the first groove corresponds to a cutout portion in the solder mask. 
     
     
         10 . The system of  claim 6 , further comprising:
 a first manifold component, comprising:
 a first PCB connection port configured to couple with at least one coolant through hole; and 
 a first coolant conduit, 
 wherein the first manifold component is disposed on the bottom side of the PCB, such that the first coolant through hole of the plurality of coolant through holes is coupled with the first PCB connection port. 
   
     
     
         11 . The system of  claim 10 , wherein the manifold component and the first manifold component create a closed coolant circulation system when disposed on the bottom side of the PCB and coupled to at least the coolant through hole and the first coolant through hole. 
     
     
         12 . The system of  claim 11 , wherein the closed coolant circulation system further comprises the coolant conduit, the coolant through hole, the cooling channel, the first coolant through hole, and the first coolant conduit. 
     
     
         13 . The system of  claim 11 , wherein the closed coolant circulation system further comprises a coolant pump and a heat exchanger. 
     
     
         14 . The system of  claim 10 , wherein the electronic component further comprises an electrical terminal, the electrical terminal is electrically coupled to the heat-spreading member and the cooling channel, and the cooling channel is coupled to at least one of the coolant through hole or the first coolant through hole via a dual-purpose electrical and coolant connection. 
     
     
         15 . The system of  claim 14 , wherein the PCB further comprises a conducting plane, and at least one of the coolant through hole or the first coolant through hole is a plated coolant through hole that is electrically coupled to the cooling channel and the conducting plane. 
     
     
         16 . The system of  claim 6 , wherein the manifold component further comprises:
 a first PCB connection port configured to couple with at least one coolant through hole; and   a first coolant conduit,   wherein the manifold component is disposed on the bottom side of the PCB, such that the first coolant through hole of the plurality of coolant through holes is coupled with the first PCB connection port, and the manifold component creates a closed coolant circulation system when disposed on the bottom side of the PCB and coupled to at least the coolant through hole and the first coolant through hole.   
     
     
         17 . The system of  claim 1 , wherein the least one coolant through hole is coupled with the PCB connection port via at least one of glue, epoxy, a gasket, an O-ring, or solder. 
     
     
         18 . The system of  claim 1 , wherein the manifold component is disposed on the top side of the PCB. 
     
     
         19 . A manifold component, comprising:
 a printed circuit board (PCB) connection port configured to couple with at least one through hole of a PCB; and   a coolant conduit;   wherein the manifold component is configured to be disposed on the PCB, such that the PCB connection port is coupled with a through hole of the PCB.   
     
     
         20 . A method for mounting an electronic component on a printed circuit board (PCB), comprising:
 placing the electronic component on a PCB, the electronic component being thermally coupled to a cooling channel, wherein each of two ends of the cooling channel is aligned with a respective coolant through hole of the PCB;   creating a liquid-tight coolant connection between each of the two ends of the cooling channel and the respective coolant through hole of the PCB; and   creating an electrical connection between an electrical terminal of the electronic component and a connection pad on a top side of the PCB.