Integrated liquid-cooled temperature equalization module

Abstract

An integrated liquid-cooled temperature equalization module includes a top cover and a temperature equalization plate. The top cover includes a first flow channel, a second flow channel, a passage connecting the first and second flow channels, an inlet connecting the first flow channel for coolant flowing into the top cover, and an outlet connecting the second flow channel for coolant flowing out of the top cover. The temperature equalization plate includes a main body having a cooling zone, a tin soldering surface, and a protrusion; a first heat sink unit mounted on the cooling zone and accommodated in the first flow channel; a second heat sink unit mounted on the cooling zone and accommodated in the second flow channel; and an internal support structure accommodated in the protrusion. Accordingly, heat dissipation efficiency of the present disclosure is improved and made more uniform.

What is claimed is: 
     
         1 . An integrated liquid-cooled temperature equalization module, comprising:
 a top cover including a first flow channel, a second flow channel, a passage communicating with the first flow channel and the second flow channel, an inlet communicating with the first flow channel for allowing a coolant to flow into the top cover, and an outlet communicating with the second flow channel for allowing the coolant to flow out of the top cover;   a temperature equalization plate including a main body, a first heat sink unit, a second heat sink unit, and an internal support structure, wherein the main body has a cooling zone, a tin soldering surface, and a protrusion, wherein the first heat sink unit is mounted on the cooling zone of the main body and is accommodated in the first flow channel of the top cover, wherein the second heat sink unit is mounted on the cooling zone of the main body and is accommodated in the second flow channel of the top cover, wherein the first heat sink unit and the second heat sink unit correspond to the protrusion, and wherein the internal support structure is accommodated in the protrusion of the main body and located beneath the first heat sink unit and the second heat sink unit.   
     
     
         2 . The integrated liquid-cooled temperature equalization module as claimed in  claim 1 , wherein the top cover includes an upper part, a surrounding part located around the upper part, and a separating part disposed on the upper part and located within the surrounding part, wherein the passage is located between the separating part and the surrounding part, and wherein the surrounding part and the separating part define the first flow channel and the second flow channel. 
     
     
         3 . The integrated liquid-cooled temperature equalization module as claimed in  claim 2 , wherein each of the first heat sink unit and the second heat sink unit has a plurality of fins and each fin is arranged parallel to the separating part. 
     
     
         4 . The integrated liquid-cooled temperature equalization module as claimed in  claim 1 , wherein the first heat sink unit has a plurality of fins integrally mounted on the cooling zone of the main body, and the second heat sink unit has a plurality of fins integrally mounted on the cooling zone of the main body. 
     
     
         5 . The integrated liquid-cooled temperature equalization module as claimed in  claim 1 , wherein the protrusion of the temperature equalization plate has a heat source contact surface. 
     
     
         6 . The integrated liquid-cooled temperature equalization module as claimed in  claim 1 , further comprising a base plate having a welding surface welded to the tin soldering surface of the temperature equalization plate. 
     
     
         7 . The integrated liquid-cooled temperature equalization module as claimed in  claim 6 , wherein the base plate has a through hole for accommodating the protrusion of the temperature equalization plate. 
     
     
         8 . The integrated liquid-cooled temperature equalization module as claimed in  claim 7 , wherein the protrusion of the temperature equalization plate has a heat source contact surface, and the base plate has a locking surface substantially coplanar with the heat source contact surface of the temperature equalization plate. 
     
     
         9 . The integrated liquid-cooled temperature equalization module as claimed in  claim 7 , wherein the base plate has a plurality of positioning pillars located around the through hole. 
     
     
         10 . The integrated liquid-cooled temperature equalization module as claimed in  claim 7 , wherein the base plate has a plurality of screw holes located around the through hole.