Method and apparatus for synthesizing metal thin film for display

Abstract

The present invention relates to an electroplating apparatus and an electroplating method, and more specifically, to an electroplating apparatus and an electroplating method, which can plate a target on one side of a substrate while moving an anode horizontally, and consistently maintain the concentration of iron ions in a plating solution through the injection of inert gas when the plating solution is supplied during the plating process, thereby providing excellent plating quality.

1 . An electroplating apparatus comprising:
 a tank unit having an open top and an internal accommodation space;   an electroplating unit installed in the tank unit to plate a target object arranged inside the tank unit depending on power supplied from a power supply unit;   a plating solution supply unit supplying plating solution to the electroplating unit and circulating the plating solution by receiving the plating solution from the tank unit; and   a gas supply unit supplying inert gas to the electroplating unit,   wherein the electroplating unit sprays the supplied plating solution and inert gas onto the target object.   
     
     
         2 . The electroplating apparatus according to  claim 1 , wherein the electroplating unit comprises:
 an anode part electrically connected to a positive electrode of the power supply unit and emitting ions toward the target object in the tank unit;   a cathode part electrically connected to a negative electrode of the power supply unit and supporting the target object within the tank unit; and   a first supply nozzle and a second supply nozzle respectively installed on one side and the other side of the anode part, and spraying the plating solution and inert gas together toward the target object.   
     
     
         3 . The electroplating apparatus according to  claim 2 , wherein the first supply nozzle and the second supply nozzle are formed such that spray holes of the first supply nozzle and the second supply nozzle are inclined downward toward the underside of the anode part. 
     
     
         4 . The electroplating apparatus according to  claim 3 , wherein the first supply nozzle and the second supply nozzle include a main supply pipe, and a first branch supply pipe and a second branch supply pipe branching from the main supply pipe, such that the plating solution and the inert gas supplied to the main supply pipe are selectively supplied to the first supply nozzle and the second supply nozzle via the first branch supply pipe and the second branch supply pipe. 
     
     
         5 . The electroplating apparatus according to  claim 1 , wherein the inert gas is compressed nitrogen. 
     
     
         6 . The electroplating apparatus according to  claim 5 , wherein the compressed nitrogen is sprayed at a speed sufficient to maintain a supersaturated state in the plating solution to block oxygen inflow. 
     
     
         7 . The electroplating apparatus according to  claim 6 , wherein the compressed nitrogen is supplied at a rate of 0.1 l to 1.0 l per minute based on 100 l of plating solution. 
     
     
         8 . An electroplating method for plating a target object in a tank unit using an electroplating unit positioned above the tank unit, comprising:
 spraying plating solution and inert gas onto the target object through a supply nozzle of the electroplating unit.   
     
     
         9 . The electroplating method according to  claim 8 , wherein the inert gas is compressed nitrogen. 
     
     
         10 . The electroplating method according to  claim 9 , wherein the compressed nitrogen is sprayed at a speed sufficient to maintain a supersaturated state in the plating solution to block oxygen inflow. 
     
     
         11 . The electroplating method according to  claim 10 , wherein the compressed nitrogen is supplied at a rate of 0.1 l to 1.0 l per minute based on 100 l of plating solution.