US2025236553A1PendingUtilityA1
Method of improving dielectric performance of alumino-borosilicate glass
Est. expiryMar 29, 2042(~15.7 yrs left)· nominal 20-yr term from priority
C03C 2204/00C03C 3/11C03C 3/093C03C 3/091C03B 32/00C03C 4/16
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Claims
Abstract
A method of improving dielectric performance of alumino-borosilicate glass includes heating the glass to a heated temperature of at least 400° C. and less than 1200° C. keeping the glass at the heated temperature for at least 30 minutes, followed by cooling the glass to a cooled temperature of 40° C. over at least 2 hours. In terms of constituents, the glass includes SiO2, Al2O3, B2O3, MgO, and CaO. After the cooling. the glass has a dielectric loss tangent no greater than 0.0020.
Claims
exact text as granted — not AI-modified1 . A method of improving dielectric performance of alumino-borosilicate glass, comprising:
heating the glass to a heated temperature of at least 400° C., wherein the heated temperature is less than 1200° C., and wherein, in terms of as-analyzed constituents, the glass comprises:
at least 60 mol % to 75 mol % SiO 2 ;
at least 2 mol % to 9 mol % Al 2 O 3 ;
at least 15 mol % to 25 mol % B 2 O 3 ;
at least 1 mol % to 6 mol % MgO; and
at least 1 mol % to 5 mol % CaO; and
keeping the glass at the heated temperature for at least 30 minutes; and cooling the glass from the heated temperature to a cooled temperature of 40° C., over at least 2 hours.
2 . The method of claim 1 , wherein after the cooling, the glass has a Df no greater than 0.0020.
3 . The method of claim 1 , wherein the heated temperature is at least 600° C.
4 . The method of claim 1 , wherein the cooling occurs over at least 4 hours, and wherein the keeping is for at least 2 hours.
5 . The method of claim 1 , wherein, prior to the heating, the glass has been formed as a sheet.
6 . A method of improving dielectric performance of alumino-borosilicate glass, comprising:
forming the glass into a sheet; wherein, in terms of as-analyzed constituents, the glass of the sheet comprises:
at least 60 mol % to 75 mol % SiO 2 ;
at least 2 mol % to 9 mol % Al 2 O 3 ;
at least 15 mol % to 25 mol % B 2 O 3 ;
at least 1 mol % to 6 mol % MgO; and
at least 1 mol % to 5 mol % CaO; and
keeping the sheet at the heated temperature for at least 30 minutes; and cooling the sheet from a heated temperature to a cooled temperature of 40° C., over at least 2 hours, and wherein the heated temperature is at least 400° C.
7 . The method of claim 6 , further comprising bonding electronics to the sheet.
8 . The method of claim 7 , wherein the bonding is after the cooling.
9 . The method of claim 6 , wherein after the cooling, the sheet has a Df no greater than 0.0020.
10 . The method of claim 6 , wherein the heated temperature is at least 600° C.
11 . The method of claim 10 , wherein the heated temperature is less than 1000° C.
12 . The method claim 6 , wherein the cooling occurs over at least 4 hours, and wherein the keeping is for at least 2 hours.
13 . A method of improving dielectric performance of alumino-borosilicate glass, comprising:
forming a glass into a sheet, wherein, in terms of as-analyzed constituents, the glass comprises:
at least 60 mol % to 75 mol % SiO 2 ;
at least 2 mol % to 9 mol % Al 2 O 3 ;
at least 15 mol % to 25 mol % B 2 O 3 ;
at least 1 mol % to 6 mol % MgO; and
at least 1 mol % to 5 mol % CaO;
heating the sheet to a heated temperature of at least 400° C., wherein the heated temperature is less than 1200° C.; and cooling the sheet from the heated temperature to a cooled temperature of 40° C.
14 . The method of claim 13 , wherein the glass more specifically comprises less than 7.5 mol % Al 2 O 3 , greater than 16 mol % B 2 O 3 , and less than 5.5 mol % MgO.
15 . The method of claim 13 , wherein after the cooling, the sheet has a Df no greater than 0.0020.
16 . The method of claim 13 , wherein the heated temperature is at least 600° C.
17 . The method of claim 13 , wherein the cooling occurs over at least 4 hours.
18 . A method of improving dielectric performance of alumino-borosilicate glass, comprising:
heating the glass to a heated temperature of at least 400° C., wherein the heated temperature is less than 1200° C., and wherein, in terms of as-analyzed constituents, the glass comprises SiO 2 , Al 2 O 3 , B 2 O 3 , MgO; and CaO; keeping the sheet at the heated temperature for at least 30 minutes; and cooling the glass from the heated temperature to a cooled temperature of 40° C. over at least 2 hours, wherein after the cooling, the glass has a Df no greater than 0.0020.
19 . The method of claim 18 , wherein, prior to the heating, the glass has been formed as a sheet.
20 . The method of claim 19 , further comprising bonding electronics to the sheet after the cooling.Join the waitlist — get patent alerts
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