Substrate lapping apparatus and substrate lapping method using the same

Abstract

Disclosed is substrate lapping apparatuses and methods. The substrate lapping apparatus comprises a disk-shaped platen and a switch dam associated with the platen. The platen includes a plurality of grooves downwardly recessed from a top surface of the platen and a liquid receiving space. Each of the plurality of grooves straightly extends in a horizontal direction. The liquid receiving space is downwardly recessed from the top surface of the platen and connected to an edge of the platen. The switch dam vertically moves to be associated with the edge of the platen so as to open and close the liquid receiving space.

What is claimed is: 
     
         1 . A substrate lapping apparatus, comprising:
 a disk-shaped platen; and   a switch dam associated with the platen,   wherein the platen includes:
 a plurality of grooves downwardly recessed from a top surface of the platen; and 
 a liquid receiving space, 
   wherein each of the plurality of grooves extends straight in a horizontal direction,   wherein the liquid receiving space is downwardly recessed from the top surface of the platen and connected to an edge of the platen, and   wherein the switch dam vertically moves to be associated with the edge of the platen so as to open and close the liquid receiving space.   
     
     
         2 . The apparatus of  claim 1 , wherein the platen further provides a supply hole that downwardly extends from a bottom surface that defines the liquid receiving space. 
     
     
         3 . The apparatus of  claim 1 , wherein a depth of the liquid receiving space is greater than a depth of each of the plurality of grooves. 
     
     
         4 . The apparatus of  claim 1 ,
 wherein the liquid receiving space has a circular sector shape, and   wherein the switch dam has an arc shape.   
     
     
         5 . The apparatus of  claim 1 , wherein the platen includes metal. 
     
     
         6 . The apparatus of  claim 1 ,
 wherein each of the plurality of grooves passes through a center of the platen, and   wherein the plurality of grooves are arranged in a circumferential direction.   
     
     
         7 . The apparatus of  claim 1 , further comprising:
 a rotating member associated with a bottom surface of the platen, the rotating member configured to rotate the platen,   wherein a central axis of the rotating member is spaced apart in the horizontal direction from a central axis of the platen.   
     
     
         8 . The apparatus of  claim 1 ,
 wherein the liquid receiving space is a plurality of liquid receiving spaces, and   wherein the plurality of liquid receiving spaces are spaced apart from each other in the horizontal direction.   
     
     
         9 . The apparatus of  claim 8 , wherein the plurality of liquid receiving spaces include:
 a first receiving space; and   a second receiving space spaced apart from the first receiving space,   wherein an area of the first receiving space is different from an area of the second receiving space.   
     
     
         10 . A substrate lapping apparatus, comprising:
 a disk-shaped platen; and   a polishing head on the platen, the polishing head supporting a substrate,   wherein the platen includes:
 a groove downwardly recessed from a top surface of the platen, the groove straightly running across the platen; 
 a liquid receiving space downwardly recessed from the top surface of the platen; and 
 a supply hole that downwardly extends from a bottom surface that defines the liquid receiving space, 
   wherein the liquid receiving space is connected to an edge of the platen.   
     
     
         11 . The apparatus of  claim 10 , further comprising:
 a liquid supply device,   wherein the liquid supply device is connected to the supply hole to supply a polishing liquid through the supply hole to the liquid receiving space.   
     
     
         12 . The apparatus of  claim 11 , wherein the liquid supply device includes a temperature adjustment device configured to adjust a temperature of the polishing liquid supplied to the liquid receiving space. 
     
     
         13 . The apparatus of  claim 10 , further comprising a switch dam that is associated with the edge of the platen and is vertically movable to open and close the liquid receiving space. 
     
     
         14 . The apparatus of  claim 10 , further comprising:
 a rotating mechanism that rotates the platen; and   a rotating member that is associated with a bottom surface of the platen and connects the platen to the rotating mechanism,   wherein a central axis of the rotating member is spaced apart in a horizontal direction from a central axis of the platen.   
     
     
         15 . The apparatus of  claim 10 , further comprising a slurry nozzle upwardly spaced apart from the top surface of the platen so as to supply slurry to the top surface of the platen. 
     
     
         16 . The apparatus of  claim 10 , further comprising:
 a polishing pad on the platen,   wherein the polishing pad provides an exposure hole that vertically penetrates the polishing pad to expose the liquid receiving space.   
     
     
         17 . The apparatus of  claim 10 , wherein a diameter of the platen is in a range of about 300 mm to about 800 mm. 
     
     
         18 . The apparatus of  claim 1 , further comprising a polishing head on the platen, the polishing head supporting a substrate. 
     
     
         19 . The apparatus of  claim 1 , further comprising:
 a liquid supply device,   wherein the liquid supply device is connected to a supply hole to supply a polishing liquid through the supply hole to the liquid receiving space.   
     
     
         20 . The apparatus of  claim 19 , wherein the liquid supply device includes a temperature adjustment device configured to adjust a temperature of the polishing liquid supplied to the liquid receiving space.