Method to produce a board element and a panel

Abstract

A method to produce a board element, including extruding a substrate including one or more substrate layers through a die, laminating a thermoplastic film to a first surface of the substrate after the substrate has passed the die, printing by a digital printing device a décor on a surface of the thermoplastic film when the thermoplastic film has been laminated to the substrate, and applying a coating directly on the printed thermoplastic film after printing. Also, a panel, such as a building panel, including a mechanical locking system.

1 - 29 . (canceled) 
     
     
         30 . A method to produce a board element, comprising:
 extruding a substrate comprising one or more substrate layers through a die,   laminating a thermoplastic film to a first surface of the substrate after the substrate has passed the die,   printing by a digital printing device a décor on a surface of the thermoplastic film when the thermoplastic film has been laminated to the substrate, and   applying a coating directly on the printed thermoplastic film after printing.   
     
     
         31 . The method according to  claim 30 , wherein the thermoplastic film is laminated to the substrate by heat and pressure. 
     
     
         32 . The method according to  claim 30 , wherein the thermoplastic film is laminated to the substrate at least partly by heat from the extruded substrate. 
     
     
         33 . The method according to  claim 30 , wherein the thermoplastic film is pigmented. 
     
     
         34 . The method according to  claim 30 , wherein the thermoplastic film is laminated to the substrate as a continuous web. 
     
     
         35 . The method according to  claim 30 , wherein the substrate is in continuous form when the thermoplastic film is laminated to the substrate. 
     
     
         36 . The method according to  claim 30 , wherein a temperature on the first surface of the substrate is 120-240° C. when the thermoplastic film is laminated to the first surface of the substrate. 
     
     
         37 . The method according to  claim 30 , wherein a thickness of the thermoplastic film is or exceeds 0.05 mm. 
     
     
         38 . The method according to  claim 30 , wherein the substrate comprises at least one substrate layer being laminated to the substrate after extrusion, such that the substrate comprises one or more extruded substrate layers and at least one laminated substrate layer. 
     
     
         39 . The method according to  claim 30 , wherein the thermoplastic film comprises less than 50 phr plasticizer. 
     
     
         40 . The method according to  claim 30 , wherein the thermoplastic film comprises at least one filler. 
     
     
         41 . The method according to  claim 30 , wherein the digital printing device is an inkjet printer. 
     
     
         42 . The method according to  claim 30  wherein printing further comprising digitally printing an embossed structure on the thermoplastic film when the thermoplastic film has been laminated to the substrate. 
     
     
         43 . The method according to  claim 30 , further comprising, after the thermoplastic film has been laminated to the substrate, dividing the board element into board element members or panels and providing the panels with a mechanical locking system. 
     
     
         44 . The method according to  claim 30 , further comprising conveying the substrate between at least two rollers after the substrate has passed the die. 
     
     
         45 . The method according to  claim 44 , wherein the thermoplastic film is laminated to the substrate by at least one of said rollers. 
     
     
         46 . The method according to  claim 44 , wherein a temperature on the first surface of the substrate is 130-220° C. when the thermoplastic film is laminated to the substrate. 
     
     
         47 . The method according to  claim 30 , further comprising conveying the substrate through at least one cooling zone. 
     
     
         48 . The method according to  claim 47 , wherein the thermoplastic film is laminated to the substrate by at least one roller, prior or after the cooling zone. 
     
     
         49 . The method according to  claim 47 , wherein a temperature on the first surface of the substrate is 120-180° C. when the thermoplastic film is laminated to the substrate.