Plating device and plating formation method

Abstract

A plating device of the present invention includes a cell including a porous body surrounding a metal component and impregnated with a plating solution, and a plating electrode surrounding the porous body, in which a distance between the plating electrode and a surface of the metal component is substantially uniform.

What is claimed is: 
     
         1 . A plating device comprising
 a cell including   a porous body surrounding a metal component and impregnated with a plating solution, and   a plating electrode surrounding the porous body, wherein   a distance between the plating electrode and a surface of the metal component is substantially uniform.   
     
     
         2 . The plating device according to  claim 1 , further comprising a vibration generator that vibrates the cell. 
     
     
         3 . The plating device according to  claim 1  comprising:
 a tank that stores a plating solution to be supplied to the porous body; 
 a tube that circulates the plating solution between the tank and the cell; 
 a pump that circulates the plating solution; 
 a filter that filters the plating solution; and 
 a plating power source that supplies electric energy to an inside of the cell. 
 
     
     
         4 . The plating device according to  claim 1 , wherein the plating electrode has a shape formed to surround the metal component, and
 the porous body is positioned between the plating electrode and the metal component.   
     
     
         5 . The plating device according to  claim 1 , wherein the porous body is formed of one material selected from polyolefin, polyurethane, polyvinyl chloride, polyethylene, and an ethylene copolymer,
 the porous body has a pore structure of continuous pores, the porous body has a porosity of 70% or more, and the porous body has a thickness of 10 mm or less.   
     
     
         6 . The plating device according to  claim 1 , wherein the plating electrode is an insoluble plating electrode containing one material selected from platinum, iridium oxide, and ruthenium, and has a mesh structure having a thickness of 0.5 mm or less or a wire diameter of 0.5 mm or less. 
     
     
         7 . The plating device according to  claim 1 , further comprising:
 a resistance value measurement unit that measures an electrical resistance value between the plating electrode and the metal component via the porous body; and   a porous body replacement period prediction unit that predicts a replacement period of the porous body based on an increase rate of the electrical resistance value.   
     
     
         8 . The plating device according to  claim 3 , further comprising:
 a reference electrode immersed in the plating solution in the tank;   a potential difference measurement unit that measures a potential difference between the plating electrode and the reference electrode; and   a plating electrode replacement period prediction unit that predicts a replacement period of the plating electrode based on an increase rate of the potential difference.   
     
     
         9 . A plating formation method using the plating device according to  claim 1 , the plating formation method comprising:
 disposing the plating electrode surrounding the metal component via the porous body having a constant thickness disposed so as to surround the metal component; and   forming plating on a surface of the metal component by supplying electric energy so as to reduce a metal ion in a plating solution while supplying the plating solution to the porous body.   
     
     
         10 . The plating formation method according to  claim 9 , further comprising predicting a replacement period of the porous body. 
     
     
         11 . The plating formation method according to  claim 9 , further comprising predicting a replacement period of the plating electrode.