Packaging body

Abstract

A packaging body that can be carried without contents leaking after the contents are heated by a microwave oven. The packaging body includes a container having an accommodation space accommodating the contents and a lid attached to the container. The lid is attached to the container so as to close the accommodation space and includes a lid member in which a steam release port is formed to discharge steam generated by heating and a label stuck to the lid member. The label is peeled from the lid member before the contents are heated so that a stuck state remains partially, to expose the steam release port, maintains a state in which the steam release port is exposed while the contents are heated, and is capable of being re-stuck to the lid member to cover the steam release port after the contents are heated.

What is claimed is: 
     
         1 . A packaging body that has an accommodation space accommodating contents to be heated by a microwave oven, the packaging body comprising:
 a container accommodating the contents and a lid attached to the container, wherein   the lid is attached to the container so as to close the accommodation space and includes a lid member in which a steam release port is formed to discharge steam generated by heating and a label stuck to the lid member so as to close the steam release port, and   the label is peeled from the lid member before the contents are heated so that a stuck state remains partially, to expose the steam release port, maintains a state in which the steam release port is exposed while the contents are heated, and is capable of being re-stuck to the lid member so as to cover the steam release port after the contents are heated.   
     
     
         2 . The packaging body of  claim 1 , wherein
 the label includes an innermost layer configured by an adhesive layer to be stuck to the lid member, an intermediate layer laminated on the innermost layer, and an outermost layer laminated on the intermediate layer and configured by a heat-shrinkable film.   
     
     
         3 . The packaging body of  claim 2 , wherein
 a thermal shrinkage percentage of the heat-shrinkable film configuring the outermost layer is 5% to 50% in MD and TD after heating at 100° C. for 30 minutes.   
     
     
         4 . The packaging body of  claim 2 , wherein a thickness of the heat-shrinkable film configuring the outermost layer is 12 μm to 30 μm. 
     
     
         5 . A packaging body that accommodates contents to be heated by a microwave oven, the packaging body comprising:
 a sheet having a plurality of sheet parts and a seal part that seals the plurality of sheet parts so as to form an accommodation space that accommodates the contents,   wherein a steam release port for discharging steam generated by heating is formed to any one of the plurality of sheet parts, and a label is provided which is stuck to the any one of the sheet parts formed to the steam release port so as to close the steam release port, and   wherein the label is peeled from the any one of the sheet parts before the contents are heated so that a stuck state remains partially, to expose the steam release port, maintains a state in which the steam release port is exposed while the contents are heated, and is capable of being re-stuck to the any one of the sheet parts so as to cover the steam release port after the contents are heated.   
     
     
         6 . The packaging body of  claim 5 , wherein
 the label includes an innermost layer configured by an adhesive layer to be stuck to the any one of the sheet parts, an intermediate layer laminated on the innermost layer, and an outermost layer laminated on the intermediate and configured by a heat-shrinkable film.   
     
     
         7 . The packaging body of  claim 6 , wherein
 a thermal shrinkage percentage of the heat-shrinkable film configuring the outermost layer is 5% to 50% in MD and TD after heating at 100° C. for 30 minutes.   
     
     
         8 . The packaging body of  claim 6 , wherein a thickness of the heat-shrinkable film configuring the outermost layer is 12 μm to 30 μm.