Substrate processing apparatus and method of processing substrate using the same

Abstract

A substrate processing apparatus includes a platen that supports a polishing pad and rotates about a first axis extending in a first direction, a polishing head supporting a substrate and disposed on the platen, and a slurry arm capable of supplying slurry onto the platen, wherein the slurry arm includes a slurry arm body disposed on the platen and extending in a second direction perpendicular to the first direction, a steam bar combined with the slurry arm body and capable of spraying water vapor, and a steam bar power supply capable of applying a voltage to the steam bar such that the steam bar has an electric charge, and the steam bar includes a steam nozzle spraying the water vapor and extending to the platen.

What is claimed is: 
     
         1 . A substrate processing apparatus comprising:
 a platen configured to support a polishing pad, the platen configured to rotate about an axis of the platen, the axis extending in a first direction which is perpendicular to a surface of the platen;   a polishing head configured to support a substrate and disposed on the platen; and   a slurry arm configured to supply a slurry onto the platen, the slurry arm including:
 a slurry arm body disposed on the platen and extending in a second direction perpendicular to the first direction; 
 a steam bar combined with the slurry arm body and configured to spray steam, the steam bar including a steam nozzle configured to spray the steam, the steam bar extending to the platen; and 
   a steam bar power supply configured to apply a voltage to the steam bar to electrically charge the steam bar.   
     
     
         2 . The substrate processing apparatus of  claim 1 , further comprising a slurry arm driver configured to rotate the slurry arm or adjust a height of the slurry arm. 
     
     
         3 . The substrate processing apparatus of  claim 1 , wherein the steam bar further includes a filter connected to a lower end of the steam nozzle to protect the steam nozzle from the slurry. 
     
     
         4 . The substrate processing apparatus of  claim 3 , wherein the filter includes one of polyamide, polyester, and polypropylene. 
     
     
         5 . The substrate processing apparatus of  claim 1 , wherein the steam bar further includes a steam bar body supporting the steam nozzle,
 wherein an axis of the steam nozzle aligns with a rotation direction of the platen with respect to a top down view, and   wherein an angle formed between the steam nozzle and the surface of the platen is greater than 30° and less than 90° with respect to a side view.   
     
     
         6 . The substrate processing apparatus of  claim 1 ,
 wherein the slurry arm further includes a plate-shaped shutter and configured to spray steam at an angle with respect to the surface of the platen,   wherein one side of the shutter is connected to the steam bar and fixed to the steam bar, and   wherein another side of the shutter is configured to move away from the steam bar toward the platen.   
     
     
         7 . The substrate processing apparatus of  claim 6 , wherein the angle with respect to the surface of the platen is greater than 0° and less than 90°. 
     
     
         8 . The substrate processing apparatus of  claim 1 , wherein the steam bar power supply includes:
 a power source configured to supply power; and   a connector connecting the power source and the steam bar and including a conductor, and   wherein the voltage that the steam bar power supply applies to the steam bar is in a range of −1500V to 1500V.   
     
     
         9 . The substrate processing apparatus of  claim 1 , further comprising:
 a controller electrically connected to the steam bar power supply and configured to control the voltage of the steam bar power supply; and   a surface potential meter connected to the controller and configured to measure a surface potential of the polishing pad supported by the platen,   wherein the controller is configured to provide feedback to the steam bar power supply based on data obtained from the surface potential meter.   
     
     
         10 . The substrate processing apparatus of  claim 2 , further comprising:
 a controller that drives the slurry arm driver; and   a surface potential meter configured to measure a surface potential of the polishing pad supported by the platen,   wherein the controller is electrically connected to the slurry arm driver, and   wherein the controller is configured to operate the slurry arm driver based on data obtained from the surface potential meter.   
     
     
         11 . The substrate processing apparatus of  claim 2 , further comprising a cleaning sprayer configured to spray a cleaning liquid from underneath the steam bar toward a lower surface of the steam bar,
 wherein the slurry arm is configured to be rotationally moved out of the platen by the slurry arm driver and disposed on the cleaning sprayer.   
     
     
         12 . A substrate processing apparatus comprising:
 a platen rotatable about an axis extending in a first direction;   a polishing head disposed on the platen and configured to rotate; and   a slurry arm extending in a second direction perpendicular to the first direction and configured to supply a slurry onto the platen,   wherein the slurry arm includes:
 a slurry arm body disposed on the platen; 
 a steam bar combined with the slurry arm body and configured to spray steam; and 
 a steam bar power supply configured to apply a voltage to the steam bar and charge the steam bar with a charge of the same type as the slurry, 
   wherein the steam bar includes a steam nozzle configured to spray the steam toward the platen.   
     
     
         13 . The substrate processing apparatus of  claim 12 , wherein the slurry arm body includes a pad sprayer configured to spray inert gas or ultrapure water to cool a polishing pad supported by the platen. 
     
     
         14 . The substrate processing apparatus of  claim 12 , wherein an axis of the steam nozzle aligns with a rotation direction of the platen with respect to a top down view, and
 wherein an angle formed between the steam nozzle and a surface of the platen is greater than 300 and less than 90° with respect to a side view.   
     
     
         15 . The substrate processing apparatus of  claim 12 , further comprising a plate-shaped shutter connected to a lower surface of the steam bar and configured to change a spraying direction of the steam,
 wherein the shutter includes:
 a first shutter region connected to the steam bar and extending in the second direction; and 
 a second shutter region spaced apart from the first shutter region in a third direction perpendicular to the first direction and the second direction and movable between the steam bar and the platen. 
   
     
     
         16 . The substrate processing apparatus of  claim 15 , wherein a level of the lower surface of the steam nozzle is higher than a level of an upper surface of the shutter, and
 wherein the shutter is configured to spray the steam in an angle greater than 0° and less than 900 with respect to a surface of the platen.   
     
     
         17 . The substrate processing apparatus of  claim 12 , further comprising:
 a controller electrically connected to the steam bar power supply; and   a surface potential meter configured to measure a surface potential of a polishing pad supported by the platen or the slurry,   wherein the surface potential meter is configured to transmit a surface potential data of the polishing pad or the slurry to the controller, and   wherein the controller configured to control the steam bar power supply by using the surface potential data received from the surface potential meter.   
     
     
         18 . A substrate processing apparatus comprising:
 a disc-shaped polishing pad configured to polish the substrate and rotate about an axis extending in a first direction;   a polishing head supporting the substrate and positioned on the polishing pad; and   a slurry arm configured to supply a slurry onto the polishing pad, the slurry arm including:
 a slurry arm body disposed on the polishing pad and extending in a horizontal direction, wherein the slurry arm body includes a slurry nozzle configured to spray a slurry; 
 a steam bar combined with the slurry arm body and including a steam nozzle configured to spray steam; 
 a steam bar power supply electrically connected to the steam bar; and 
 a plate-shaped shutter connected to the bottom of the steam bar, 
 wherein one side of the shutter is connected to the steam bar and fixed to the steam bar, and 
 wherein another side of the shutter is configured to move away from the steam bar. 
   
     
     
         19 . The substrate processing apparatus of  claim 18 , wherein an angle formed between the steam nozzle and a surface of the disc-shaped polishing pad is greater than 300 and less than 90° with respect to a side view, and
 wherein a rotation direction of the polishing pad is the same as a direction of the steam sprayed by the steam nozzle. 
 
     
     
         20 . The substrate processing apparatus of  claim 18 , wherein the substrate processing apparatus further includes a slurry arm driver configured to move the slurry arm.