Plating apparatus and plating method

Abstract

A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tank 410 for housing a plating solution, an anode 430 arranged in the plating tank 410 , a substrate holder 440 for holding a substrate Wf with a surface to be plated facing downward, a rotation mechanism 447 for rotating the substrate holder 440 , and a shielding mechanism 460 moving a shielding member 482 between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

What is claimed is: 
     
         1 . A plating apparatus comprising:
 a plating tank for housing a plating solution;   an anode arranged in the plating tank;   a substrate holder for holding a substrate with a surface to be plated facing downward;   a rotation mechanism for rotating the substrate holder; and   a shielding mechanism configured to move a shielding member into between the anode and the substrate depending on a rotation angle of the substrate holder, wherein   the shielding mechanism includes a linear motion drive mechanism configured to linearly move the shielding member between a shielding position and a retracted position, the shielding position being between the anode and the substrate, the retracted position being apart from between the anode and the substrate.   
     
     
         2 . The plating apparatus according to  claim 1 , wherein
 the shielding member includes a mask member having an arc shape corresponding to a part of a peripheral edge portion of an arc-shaped substrate.   
     
     
         3 . The plating apparatus according to  claim 1 , wherein
 the linear motion drive mechanism includes a linear motion motor.   
     
     
         4 . The plating apparatus according to  claim 1 , further comprising:
 an ionically resistive element including a plate-shaped member having a plurality of holes, the ionically resistive element being disposed between the substrate holder and the anode;   wherein the shielding member is disposed between the substrate holder and the ionically resistive element.   
     
     
         5 . The plating apparatus according to  claim 1 , further comprising:
 a film thickness sensor configured to measure a plating film thickness at a peripheral edge portion on the substrate.   
     
     
         6 . The plating apparatus according to  claim 5 , wherein
 the shielding mechanism is configured to move the shielding member to the shielding position based on the plating film thickness of the substrate measured by the film thickness sensor.   
     
     
         7 . The plating apparatus according to  claim 5 , wherein
 in a case where an area having a thicker plating film than other areas exists in distribution of the plating film thickness at the peripheral edge portion of the substrate, the shielding mechanism is configured to move the shielding member to the retracted position when the area having a thicker plating film thickness lies outside the predetermined angle range.   
     
     
         8 . The plating apparatus according to  claim 5 , wherein
 in a case where an area having a thicker plating film than other areas exists in distribution of the plating film thickness at the peripheral edge portion of the substrate, the shielding mechanism is configured to move the shielding member to the shielding position when the area having a thicker plating film thickness lies within the predetermined range.