Semiconductor processing device and polishing device

Abstract

A semiconductor processing device according to the disclosure is a semiconductor processing device that includes a first rod-shaped member, a first member to which the first rod-shaped member is fixed, a second member in which a first hole is formed, and a first elastic member. The first rod-shaped member is inserted into the first hole, and the first elastic member is configured to surround an outer circumferential surface of the first rod-shaped member inside the first hole.

What is claimed is: 
     
         1 . A semiconductor processing device, comprising:
 a first rod-shaped member;   a first member to which the first rod-shaped member is fixed;   a second member in which a first hole is formed; and   a first elastic member,   wherein the first rod-shaped member is inserted into the first hole, and   the first elastic member is configured to surround an outer circumferential surface of the first rod-shaped member inside the first hole.   
     
     
         2 . The semiconductor processing device according to  claim 1 , wherein
 the second member is not fixed to the first member by a screw.   
     
     
         3 . The semiconductor processing device according to  claim 1 , further comprising:
 a vibration source for vibrating the first member.   
     
     
         4 . The semiconductor processing device according to  claim 1 , comprising:
 a second rod-shaped member fixed to the first member and extending parallel to the first rod-shaped member; and   a second elastic member,   wherein a second hole is formed in the second member,   the second rod-shaped member is inserted into the second hole, and   the second elastic member is configured to surround an outer circumferential surface of the second rod-shaped member inside the second hole.   
     
     
         5 . The semiconductor processing device according to  claim 4 , wherein
 the first rod-shaped member and the second rod-shaped member extend in a horizontal direction, and   the second rod-shaped member is positioned vertically below the first rod-shaped member.   
     
     
         6 . The semiconductor processing device according to  claim 1 , comprising:
 a wall restricting, by contacting the second member, movement of the second member in a first direction, which is a direction in which the first rod-shaped member extends and a direction in which the second member moves away from the first member.   
     
     
         7 . The semiconductor processing device according to  claim 6 , wherein
 in the semiconductor processing device,   the second member comprises:
 a main body; 
 a first cushion member contacting the wall and pressing the main body in a second direction opposite to the first direction; and 
 a second cushion member positioned between the main body and the first member and pressing the main body in the first direction. 
   
     
     
         8 . The semiconductor processing device according to  claim 1 , comprising:
 a base located at a lower portion of the second member,   wherein the second member comprises:
 a main body; and 
 a lower side cushion member contacting the base and supporting the main body from below. 
   
     
     
         9 . The semiconductor processing device according to  claim 8 , wherein
 the base is formed with a drain hole for flowing liquid to a drain piping.   
     
     
         10 . The semiconductor processing device according to  claim 3 , wherein
 the vibration source is a rotary joint,   the rotary joint has a connection port on a side surface to which a piping is connected, and supports a shaft configured to be rotatable about a rotating shaft extending in a vertical direction,   a lower end of the second member is positioned below the connection port, and   the second member is a cover that surrounds at least a part around the rotating shaft.   
     
     
         11 . The semiconductor processing device according to  claim 10 , comprising:
 a third member,   wherein a lower end of the third member is positioned below the connection port,   the third member is a cover that surrounds at least a part around the rotating shaft,   the second member has a wall having an end face,   the third member has a wall having an opposing end face that contacts the end face or faces the end face with a minute gap,   the end face extends at an angle with respect to a thickness direction of the wall of the second member, and   the opposing end face extends at an angle with respect to a thickness direction of the wall of the third member.   
     
     
         12 . The semiconductor processing device according to  claim 10 , further comprising:
 a stopper member fixed to the first member for supporting the rotary joint in a non-rotatable manner.   
     
     
         13 . The semiconductor processing device according to  claim 1 , wherein
 the second member comprises a resin member.   
     
     
         14 . The semiconductor processing device according to  claim 1 , wherein
 the first rod-shaped member is a bolt,   the first elastic member is an O-ring, and   the first member comprises:
 a frame, and 
 a plate nut fixing the first rod-shaped member to the frame. 
   
     
     
         15 . A polishing device,
 the polishing device being a semiconductor processing device according to  claim 1 , the polishing device comprising:
 a polishing table configured to attachably mount a polishing pad for polishing a substrate, and 
 a top ring for holding the substrate and polishing the substrate while pressing the substrate against the polishing pad.