Microelectronic assemblies with crack-healing materials for glass cores

Abstract

Various techniques for alleviating the negative effects of crack formation and propagation in glass, and related devices and methods, are disclosed. In one aspect, a microelectronic assembly includes a glass core having a structure of a crack-healing material on its edge, where the crack-healing material includes carbon, e.g., as a part of an organic monomer, oligomer, or a polymer, or as a part of a carbide of an inorganic material such as boron, titanium, or silicon. In another aspect, a microelectronic assembly includes a glass core in which particles that include an inorganic crack-healing material are dispersed, where the material includes carbon or boron, and a volume occupied by the particles is between about 5% and about 55% of the volume of the glass core. Formation of a crack in the glass core may activate the crack-healing material, causing it to at least partially fill the crack.

1 . A microelectronic assembly, comprising:
 a glass core having a first face, a second face opposite the first face, and an edge between an end of the first face and an end of the second face; and   an edge structure having a portion on the edge of the glass core, the edge structure comprising carbon.   
     
     
         2 . The microelectronic assembly according to  claim 1 , wherein the edge structure includes a polymer having a molecular weight below about 50 kilodaltons. 
     
     
         3 . The microelectronic assembly according to  claim 1 , wherein the edge structure includes at least one of an amide, a carbonate, a styrene, or an ethylene. 
     
     
         4 . The microelectronic assembly according to  claim 3 , wherein:
 the edge structure includes a monomer or an oligomer comprising the amide,   the glass core further includes an opening, and   the opening includes a polymer comprising repeating units of the amide.   
     
     
         5 . The microelectronic assembly according to  claim 3 , wherein:
 the edge structure includes a monomer or an oligomer comprising the carbonate,   the glass core further includes an opening, and   the opening includes a polymer comprising repeating units of the carbonate.   
     
     
         6 . The microelectronic assembly according to  claim 3 , wherein:
 the edge structure includes a monomer or an oligomer comprising the styrene,   the glass core further includes an opening, and   the opening includes a polymer comprising repeating units of the styrene.   
     
     
         7 . The microelectronic assembly according to  claim 3 , wherein:
 the edge structure includes a monomer or an oligomer comprising the ethylene,   the glass core further includes an opening, and   the opening includes a polymer comprising repeating units of the ethylene.   
     
     
         8 . The microelectronic assembly according to  claim 1 , wherein the edge structure includes an inorganic material, carbon is part of the inorganic material, and the inorganic material further includes a metal. 
     
     
         9 . The microelectronic assembly according to  claim 1 , wherein the edge structure includes an inorganic material, carbon is part of the inorganic material, and the inorganic material further includes a metalloid. 
     
     
         10 . The microelectronic assembly according to  claim 9 , wherein the glass core further includes an opening extending from the edge into the glass core, wherein the opening includes the metalloid, carbon, and oxygen. 
     
     
         11 . The microelectronic assembly according to  claim 1 , wherein the edge structure has a first portion at the first face, a second portion at the second face, and the portion on the edge of the glass core is a third portion, wherein the third portion is attached to the first portion and the second portion. 
     
     
         12 . The microelectronic assembly according to  claim 11 , wherein the first portion extends over the first face to a distance from the edge that is less than about 10% of a width of the glass core. 
     
     
         13 . The microelectronic assembly according to  claim 11 , wherein:
 the edge structure is one of a plurality of edge structures,   the edge is one of a plurality of edges of the glass core, and   the edge structures are connected in a ring along the plurality of edges of the glass core.   
     
     
         14 . A microelectronic assembly, comprising:
 a glass panel comprising a first glass core, a second glass core, and a saw street between the first glass core and the second glass core,   wherein:
 the glass panel has a first face, a second face opposite the first face, and a plurality of openings along the saw street, and 
 an individual opening of the plurality of openings is an opening extending from the first face towards the second face of the glass core and comprising a polymer or an inorganic material comprising carbon or boron. 
   
     
     
         15 . The microelectronic assembly according to  claim 14 , wherein the opening is a via or a trench. 
     
     
         16 . A microelectronic assembly, comprising:
 a rectangular prism volume; and   a component coupled to the rectangular prism volume,   wherein:
 the component is one of an integrated circuit (IC) die, a package substrate, or a redistribution layer, 
 the rectangular prism volume includes particles comprising an inorganic material, 
 the inorganic material includes carbon or boron, and 
 a volume occupied by the particles is between about 5% and about 55% of a volume of the rectangular prism volume. 
   
     
     
         17 . The microelectronic assembly according to  claim 16 , wherein one or more of the particles are at least partially enclosed by a layer comprising polystyrene, alkylene, imide, or vinyl pyrrolidone. 
     
     
         18 . The microelectronic assembly according to  claim 16 , wherein one or more of the particles are at least partially enclosed by a layer comprising nitrogen or oxygen. 
     
     
         19 . The microelectronic assembly according to  claim 16 , wherein:
 the particles are first particles, and   the microelectronic assembly further includes second particles comprising one or more of ruthenium, platinum, vanadium, palladium, cobalt, titanium, or nickel.   
     
     
         20 . The microelectronic assembly according to  claim 19 , wherein a volume occupied by the second particles is between about 0.5% and about 30% of the volume of the rectangular prism volume.