Plating apparatus and substrate cleaning method

Abstract

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

1 . A substrate cleaning method comprising:
 an opening step of moving a door arranged in an opening of a side wall of a tubular cover member arranged above a plating tank to open the opening;   a first moving step of moving a substrate cleaning member to a cleaning position between a plating tank and a substrate through the opening opened by the opening step;   a substrate cleaning step of discharging a cleaning liquid toward a surface to be plated of the substrate from the substrate cleaning member;   a second moving step of moving the substrate cleaning member to a retracted position retracted from the cleaning position between the substrate and the plating tank after the substrate cleaning step; and   a closing step of moving the door to the opening of the side wall of the cover member to close the opening after the second moving step.   
     
     
         2 . The substrate cleaning method according to  claim 1 , wherein
 the opening step is configured to rotationally move a door for opening and closing the opening toward an inside of the cover member.   
     
     
         3 . The substrate cleaning method according to  claim 1 , wherein
 the opening step is configured to slidingly move a door for opening and closing the opening along a circumferential direction of the side wall of the cover member.   
     
     
         4 . The substrate cleaning method according to  claim 1 , wherein
 the opening step is configured to slidingly move a door for opening and closing the opening in a vertical direction along the side wall of the cover member.