US2025189136A1PendingUtilityA1

Heat Pump System for Computer Servers, Components thereof and Methods of Using the Same

Assignee: BOYD JOHN EDWARDPriority: Jan 10, 2012Filed: Feb 6, 2025Published: Jun 12, 2025
Est. expiryJan 10, 2032(~5.5 yrs left)· nominal 20-yr term from priority
Inventors:John Boyd
F24H 1/06F24D 11/002F24B 9/00F24D 2220/0207F24D 2200/065F24D 2200/10F24B 1/183F24D 3/02
76
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Claims

Abstract

Heat transfer systems for computer server(s) employing a heat transfer means (e.g., circulating fluid, thermally conductive material, etc.) to transfer heat from the heat source (e.g., computer server(s), fireplace, wood stove or other heat source) to a remote location of a home, residence, building or other structure.

Claims

exact text as granted — not AI-modified
1 . A heat transfer system for transferring thermal energy from a heat source to a heat radiator, said heat transfer system comprising:
 (a) at least one heat sink adapted to receive thermal energy from said heat source, wherein the heat source is a computer server at a location and said at least one heat sink is adapted to be placed adjacent to or placed on top of said computer server;   (b) a heat radiator adapted to convey thermal energy from the computer server to a different location;   (c) a conduit for transferring heat from said at least one heat sink to said heat radiator; and   (d) at least one pump to move a fluid around a circuit including said conduit, said at least one heat sink and heat radiator, wherein the pump is not incorporated within the at least one heat sink;   wherein said conduit has a length greater than 8 feet; and   wherein said at least one heat sink comprises an inlet for receiving a heat transfer fluid and an outlet for emitting said heat transfer fluid and wherein said at least one heat sink comprises passages therein for internally flowing said heat transfer fluid.   
     
     
         2 . The heat transfer system of  claim 1 , wherein said at least one heat sink is metallic or graphite. 
     
     
         3 . The heat transfer system of  claim 1 , wherein said at least one heat sink is a metallic block. 
     
     
         4 . The heat transfer system of  claim 1 , wherein said at least one heat sink is an aluminum or graphite block. 
     
     
         5 . The heat transfer system of  claim 1 , wherein said at least one heat sink is a metallic block or a graphite block having at least two dimensions greater than 20 inches. 
     
     
         6 . The heat transfer system of  claim 1 , further comprising a thermometer displaying or indicating the temperature of the heat transfer fluid. 
     
     
         7 . The heat transfer system of  claim 1 , further comprising at least one pressure release valve. 
     
     
         8 . The heat transfer system of  claim 1 , further comprising at least one heat sensor for detecting the temperature of the heat transfer fluid within said heat transfer system. 
     
     
         9 . The heat transfer system of  claim 1 , wherein said conduit comprises a first conduit for transferring the heat transfer liquid from said at least one heat sink to said heat radiator and a second conduit for transferring said heat transfer liquid from said heat radiator to said at least one heat sink. 
     
     
         10 . The heat transfer system of  claim 1 , comprising multiple pumps for circulating the heat transfer fluid around a circuit including said conduit, said at least one heat sink and heat radiator. 
     
     
         11 . The heat transfer system of  claim 1 , further comprising sensing elements and the system is configured to permit feedback from the sensing elements to increase or decrease the heat transfer fluid flow. 
     
     
         12 . The heat transfer system of  claim 1 , wherein said heat transfer fluid has a thermal conductivity equal or greater than 0.6 W/(m·K). 
     
     
         13 . The heat transfer system of  claim 1 , wherein said heat transfer fluid comprises water and ethylene glycol. 
     
     
         14 . The heat transfer system of  claim 1 , wherein the at least one pump is a centrifugal pump or magnetically levitated impeller pump. 
     
     
         15 . A heat transferring system comprising a plurality of the heat transfer systems of  claim 1 . 
     
     
         16 . The heat transferring system of  claim 15 , wherein the plurality of the heat transfer systems are configured in parallel with each other. 
     
     
         17 . The heat transferring system of  claim 15 , wherein the plurality of the heat transfer systems are configured in series with each other. 
     
     
         18 . The heat transferring system of  claim 15 , wherein said plurality of heat transfer systems transfer heat from computer servers generating excess heat within a facility to outside the facility. 
     
     
         19 . A heat transfer system for transferring thermal energy from a heat source to a heat radiator, said heat transfer system comprising:
 (a) at least one heat sink adapted to receive thermal energy from said heat source, wherein the heat source is a computer server at a location and said at least one heat sink is adapted to be placed adjacent to or placed on top of said computer server;   (b) a heat radiator adapted to transfer thermal energy from said computer server to a remote location;   (c) a conduit for transferring heat from said at least one heat sink to said heat radiator; and   (d) at least one pump to move a fluid around a circuit including said conduit, said at least one heat sink and heat radiator, wherein the pump is not incorporated within the at least one heat sink;   wherein said conduit has a length greater than 20 feet; and   wherein said at least one heat sink comprises an inlet for receiving a heat transfer fluid and an outlet for emitting said heat transfer fluid and wherein said at least one heat sink comprises passages therein for internally flowing said heat transfer fluid.

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