Microelectronic package with raised connector for external component

Abstract

A semiconductor package is configured for electrically connecting an external component to a top surface of the semiconductor package. The semiconductor package includes a raised connector that extends from a lead frame portion, vertically through encapsulation material, and is exposed at the top surface. A semiconductor component is electrically connected to the lead frame portion. The raised connector includes a vertical column and a horizontal pad, contiguous with each other. The raised connector has a continuous core, which is electrically conductive, extending throughout the vertical column and throughout the horizontal pad. The vertical column is attached to the lead frame portion. A top surface of the horizontal pad is exposed at a top surface of the encapsulation material. The raised connector may include two or more vertical columns. The semiconductor package may include two or more raised connectors, each attached to the lead frame portion.

What is claimed is: 
     
         1 . A semiconductor package, including:
 a lead frame portion;   a semiconductor component electrically connected to the lead frame portion;   a raised connector including a vertical column and a horizontal pad contiguous with the vertical column, the raised connector having a continuous core extending throughout the vertical column and the horizontal pad, the continuous core being electrically conductive, the vertical column being attached to the lead frame portion; and   an encapsulation material contacting the lead frame portion and the raised connector, wherein the horizontal pad is exposed at a top surface of the encapsulation material.   
     
     
         2 . The semiconductor package of  claim 1 , further including an external component over a top surface of the encapsulation material, the external component being electrically connected to the horizontal pad. 
     
     
         3 . The semiconductor package of  claim 1 , wherein the raised connector has a textured surface contacting the encapsulation material. 
     
     
         4 . The semiconductor package of  claim 1 , wherein the lead frame portion has an alignment structure where the vertical column is attached. 
     
     
         5 . The semiconductor package of  claim 1 , wherein the raised connector includes a solderable material on the horizontal pad. 
     
     
         6 . The semiconductor package of  claim 1 , wherein the raised connector includes a solderable material surrounding the continuous core. 
     
     
         7 . The semiconductor package of  claim 1 , wherein:
 the vertical column is a first vertical column;   the raised connector further includes a second vertical column;   the second vertical column is attached to the lead frame portion; and   the continuous core extends throughout the second vertical column.   
     
     
         8 . The semiconductor package of  claim 1 , wherein:
 the raised connector is a first raised connector;   the vertical column is a first vertical column;   the horizontal pad is a first horizontal pad;   the continuous core is a first continuous core; and   the semiconductor package further includes a second raised connector including a second vertical column and a second horizontal pad contiguous with the second vertical column, the second raised connector having a second continuous core extending throughout the second vertical column and the second horizontal pad; wherein:   the second vertical column is attached to the lead frame portion;   the second horizontal pad is exposed at the top surface of the encapsulation material; and   the encapsulation material contacts the second raised connector.   
     
     
         9 . The semiconductor package of  claim 1 , wherein a pad thickness of the continuous core in the horizontal pad is greater than a bus thickness of the lead frame portion adjacent to the vertical column. 
     
     
         10 . The semiconductor package of  claim 1 , wherein a column width of the continuous core in the vertical column is greater than a bus thickness of the lead frame portion adjacent to the vertical column. 
     
     
         11 . A method of forming a semiconductor package, including:
 attaching a semiconductor component to a lead frame portion;   providing a raised connector including a vertical column and a horizontal pad connected to the vertical column, the raised connector having a continuous core extending throughout the vertical column and the horizontal pad, the continuous core being electrically conductive;   attaching the vertical column to the lead frame portion; and   forming an encapsulation material on the lead frame portion and the raised connector, wherein the horizontal pad is exposed at a top surface of the encapsulation material.   
     
     
         12 . The method of  claim 11 , wherein attaching the vertical column to the lead frame portion includes forming a solder connection between the vertical column and the lead frame portion. 
     
     
         13 . The method of  claim 11 , wherein the raised connector has a textured surface contacting the encapsulation material. 
     
     
         14 . The method of  claim 11 , wherein the lead frame portion has an alignment structure where the vertical column is attached. 
     
     
         15 . The method of  claim 11 , wherein the raised connector include solder surrounding the continuous core. 
     
     
         16 . The method of  claim 11 , further including attaching an external component over a top surface of the encapsulation material, and forming an electrical connection between the external component and the horizontal pad. 
     
     
         17 . The method of  claim 16 , wherein forming the electrical connection between the external component and the horizontal pad includes forming a solder connection between the external component and the horizontal pad. 
     
     
         18 . The method of  claim 11 , wherein a pad thickness of the continuous core in the horizontal pad is greater than a bus thickness of the lead frame portion adjacent to the vertical column. 
     
     
         19 . The method of  claim 11 , wherein a column width of the continuous core in the vertical column is greater than a bus thickness of the lead frame portion adjacent to the vertical column. 
     
     
         20 . The method of  claim 11 , wherein the lead frame portion is a first lead frame portion, and the raised connector is connected to a second lead frame portion, and further including separating the raised connector from the second lead frame portion after forming the encapsulation material on the lead frame portion and the raised connector.