Multilayer electronic component

Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and external electrodes including connection portions disposed on the third and fourth surfaces, respectively, and band portions extending from the respective connection portions onto a portion of the first surface and a portion of the second surface. The external electrodes each include an electrode layer connected to one of the internal electrodes, and a first plating layer disposed on the electrode layer, and a metal layer including a conductive metal and glass is interposed between the electrode layer and the body in the band portions.

What is claimed is: 
     
         1 . A multilayer electronic component comprising:
 a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface, connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface, connected to the first to fourth surfaces and opposing each other in a third direction; and   external electrodes including connection portions disposed on the third and fourth surfaces, and band portions extending from the respective connection portions onto at least one of a portion of the first surface or a portion of the second surface,   wherein the external electrodes each include an electrode layer connected to one of the internal electrodes, and a first plating layer disposed on the electrode layer, and   a metal layer including a conductive metal and glass is interposed between the electrode layer and the body in the band portions.   
     
     
         2 . The multilayer electronic component of  claim 1 , wherein the band portions are arranged to extend from the connection portions onto portions of the first, second, fifth, and sixth surfaces. 
     
     
         3 . The multilayer electronic component of  claim 2 , wherein the metal layer is disposed only on the first surface and the second surface. 
     
     
         4 . The multilayer electronic component of  claim 1 , wherein the metal layer is disposed on only one of the first surface and the second surface. 
     
     
         5 . The multilayer electronic component of  claim 2 , wherein the metal layer is also disposed on the first, second, fifth, and sixth surfaces. 
     
     
         6 . The multilayer electronic component of  claim 5 , wherein the metal layer is disposed to surround the first, second, fifth, and sixth surfaces. 
     
     
         7 . The multilayer electronic component of  claim 1 , wherein the metal layer is continuously disposed on at least one of the first surface or the second surface from one end to the other end of the body in the third direction. 
     
     
         8 . The multilayer electronic component of  claim 1 , wherein a portion of the metal layer is disposed beyond one end of the electrode layer in the second direction in the band portion. 
     
     
         9 . The multilayer electronic component of  claim 8 , wherein the first plating layer covers the portion of the metal layer disposed beyond the one end of the electrode layer in the second direction. 
     
     
         10 . The multilayer electronic component of  claim 8 , wherein, if a total length of the metal layer is ‘a’, and a length of the portion of the metal layer disposed beyond the one end of the electrode layer in the second direction is ‘b’, b/a is 0.5 or more and 1.0 or less. 
     
     
         11 . The multilayer electronic component of  claim 1 , wherein the metal layer is disposed in the band portion to not exceed one end of the first plating layer in the second direction. 
     
     
         12 . The multilayer electronic component of  claim 1 , wherein the first plating layer comprises Cu. 
     
     
         13 . The multilayer electronic component of  claim 1 , wherein the electrode layer comprises a conductive metal and glass,
 wherein the first plating layer includes the same metal as the conductive metal included in the electrode layer, and   the external electrode further includes a Ni plating layer disposed on the first plating layer and a Sn plating layer disposed on the Ni plating layer.   
     
     
         14 . The multilayer electronic component of  claim 1 , wherein the conductive metal included in the metal layer comprises one or more of Sn, Pd, Au, Ni, or Cu.