Multilayer electronic component

Abstract

A multilayer electronic component may include: a body including a dielectric layer and internal electrodes, the body having opposing first and second surfaces and opposing third and fourth surfaces; a first external electrode including a first connection portion on the third surface, and a first band portion extending from the first connection portion to the first surface; a second external electrode including a second connection portion on the fourth surface, and a second band portion extending from the second connection portion to the first surface; and an insulating layer disposed on the second surface to extend onto the first and second band portions. The first and second external electrodes may include an electrode layer and a plating layer on the electrode layer, and the insulating layer may be in contact with the electrode layer in the first and second band portions and may cover an end of the electrode layer.

What is claimed is: 
     
         1 . A multilayer electronic component, comprising:
 a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;   a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface;   a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; and   an insulating layer disposed on the second surface to extend onto the first and second band portions,   wherein the first and second external electrodes include an electrode layer and a plating layer disposed on the electrode layer, and   the insulating layer is in contact with the electrode layer in the first and second band portions and is disposed to cover an end of the electrode layer.   
     
     
         2 . The multilayer electronic component of  claim 1 , wherein an end of the insulating layer is in contact with an end of the plating layer in the first and second band portions. 
     
     
         3 . The multilayer electronic component of  claim 1 , wherein the electrode layer comprises a base electrode layer disposed to be in contact with the body and a conductive resin layer disposed on the base electrode layer and including a conductive metal and a resin. 
     
     
         4 . The multilayer electronic component of  claim 3 , wherein the conductive resin layer is disposed to cover the base electrode layer. 
     
     
         5 . The multilayer electronic component of  claim 3 , wherein an end of the insulating layer is disposed to contact the base electrode layer in the first and second band portions. 
     
     
         6 . The multilayer electronic component of  claim 3 , wherein an end of the insulating layer is in contact with an end of the plating layer on the conductive resin layer of the first and second band portions. 
     
     
         7 . The multilayer electronic component of  claim 3 , wherein the base electrode layer comprises glass. 
     
     
         8 . The multilayer electronic component of  claim 3 , wherein the insulating layer comprises a resin. 
     
     
         9 . The multilayer electronic component of  claim 8 , wherein the resin included in the insulating layer is at least one of an epoxy resin, a silicone resin, a fluorine resin, an acrylic resin, and ethyl cellulose. 
     
     
         10 . The multilayer electronic component of  claim 8 , wherein the resin included in the insulating layer is the same type as the resin included in the conductive resin layer. 
     
     
         11 . The multilayer electronic component of  claim 1 , wherein the insulating layer comprises a ceramic material. 
     
     
         12 . The multilayer electronic component of  claim 11 , wherein the ceramic material included in the insulating layer is at least one of TiO 2 , BaTiO 3 , Al 2 O 3 , BaO, (PbZr x Ti 1-x O 3 ) (0<x<1), SiC, MgO, and SiO 2 . 
     
     
         13 . The multilayer electronic component of  claim 1 , wherein, La 1 >Lb 1  is satisfied, in which La 1  is an average length from a distal end of the first band portion to an extension line of the third surface in the second direction, and Lb 1  is an average length from the distal end of the first band portion to a distal end of the insulating layer disposed on the first external electrode in the second direction. 
     
     
         14 . The multilayer electronic component of  claim 13 , wherein the average lengths La 1  and Lb 1  satisfy 0.2≤Lb 1 /La 1 ≤0.8. 
     
     
         15 . The multilayer electronic component of  claim 1 , wherein an average thickness of the plating layer is smaller than an average thickness of the insulating layer. 
     
     
         16 . The multilayer electronic component of  claim 15 , wherein the average thickness of the plating layer is 2 to 10 μm, and the average thickness of the insulating layer is 2 to 10 μm. 
     
     
         17 . The multilayer electronic component of  claim 1 , wherein an end of the insulating layer is in contact with an end of the plating layer in the first and second band portions, and a step is formed in a region in which the end of the insulating layer and the end of the plating layer are in contact with each other. 
     
     
         18 . A multilayer electronic component, comprising:
 a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;   a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface;   a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; and   an insulating layer disposed on the second surface to extend onto the first and second band portions to partially cover the first and second band portions,   wherein the first and second external electrodes include a plating layer extending in a partial region of the first and second band portions.   
     
     
         19 . The multilayer electronic component of  claim 18 , wherein an end of the insulating layer is in contact with an end of the plating layer in the first and second band portions. 
     
     
         20 . The multilayer electronic component of  claim 18 , wherein the insulating layer comprises a resin. 
     
     
         21 . The multilayer electronic component of  claim 18 , wherein the insulating layer comprises a ceramic material. 
     
     
         22 . The multilayer electronic component of  claim 21 , wherein the ceramic material included in the insulating layer is at least one of TiO 2 , BaTiO 3 , Al 2 O 3 , BaO, (PbZr x Ti 1-x O 3 ) (0<x<1), SiC, MgO, and SiO 2 . 
     
     
         23 . The multilayer electronic component of  claim 18 , wherein, La 1 >Lb 1  is satisfied, in which La 1  is an average length from a distal end of the first band portion to an extension line of the third surface in the second direction, and Lb 1  is an average length from the distal end of the first band portion to a distal end of the insulating layer disposed on the first external electrode in the second direction. 
     
     
         24 . The multilayer electronic component of  claim 23 , wherein the average lengths La 1  and Lb 1  satisfy 0.2≤Lb 1 /La 1 ≤0.8. 
     
     
         25 . The multilayer electronic component of  claim 18 , wherein the insulating layer and the plating layer in the first and second band portions do not overlap with each other in the first direction.