Chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the same

Abstract

A chemical mechanical polishing pad includes a body having a cylindrical shape and extending in a vertical direction, the body including a plurality of first grooves extending downward in the vertical direction from an upper surface of the body, and a plurality of second grooves extending downward in the vertical direction inside the body. Each of the plurality of first grooves is exposed upward in the vertical direction from the upper surface of the body, each of the plurality of second grooves is located inside the body such that upper ends of the plurality of second grooves is below the upper surface of the body, and at least two of the plurality of first grooves have different depths from each other.

What is claimed is: 
     
         1 . A chemical mechanical polishing pad comprising:
 a body having a cylindrical shape and extending in a vertical direction, the body comprising:
 a plurality of first grooves extending downward in the vertical direction from an upper surface of the body; and 
 a plurality of second grooves extending downward in the vertical direction inside the body, 
   wherein each of the plurality of first grooves is exposed upward in the vertical direction from the upper surface of the body,   wherein each of the plurality of second grooves is inside the body such that an upper surface of each of the plurality of second grooves is below the upper surface of the body, and   wherein at least two of the plurality of first grooves have depths different from each other.   
     
     
         2 . The chemical mechanical polishing pad of  claim 1 , wherein the upper surfaces of at least two of the plurality of second grooves are at different vertical levels from each other. 
     
     
         3 . The chemical mechanical polishing pad of  claim 1 , wherein at least one of the plurality of first grooves and at least one of the plurality of second grooves overlap each other in a horizontal direction. 
     
     
         4 . The chemical mechanical polishing pad of  claim 1 , wherein at least one of the plurality of first grooves has a triangular cross-section on a vertical plane and at least one of the plurality of second grooves has a triangular cross-section on the vertical plane. 
     
     
         5 . The chemical mechanical polishing pad of  claim 1 , wherein at least one of the plurality of first grooves has a circular cross-section on a vertical plane and at least one of the plurality of second grooves has a circular cross-section on the vertical plane. 
     
     
         6 . The chemical mechanical polishing pad of  claim 1 , wherein at least some of the plurality of second grooves are arranged from each other in the horizontal direction, and,
 wherein, when comparing vertical levels of the upper surfaces of the at least some of the plurality of second grooves to each other, the vertical levels continuously increase or decrease in the horizontal direction.   
     
     
         7 . The chemical mechanical polishing pad of  claim 1 , wherein each of the plurality of first grooves and the plurality of second grooves has a spiral cross-section on a horizontal plane. 
     
     
         8 . The chemical mechanical polishing pad of  claim 7 , wherein each of the plurality of first grooves and each of the plurality of second grooves have a same width as each other on the spiral cross-section of the horizontal plane. 
     
     
         9 . The chemical mechanical polishing pad of  claim 1 , wherein the body, the plurality of first grooves, and the plurality of second grooves are integral with each other. 
     
     
         10 . The chemical mechanical polishing pad of  claim 1 , wherein the body comprises at least one of polyurethane and acrylonitrile butadiene styrene copolymer (ABS) resins. 
     
     
         11 . The chemical mechanical polishing pad of  claim 1 , wherein a lower surface of each of the plurality of first grooves is at a same vertical level as a vertical level of the upper surface of at least one of the plurality of second grooves. 
     
     
         12 . A chemical mechanical polishing apparatus comprising:
 a plate configured to rotate about a vertical axis;   a chemical mechanical polishing pad on an upper surface of the plate;   a polishing head facing the chemical mechanical polishing pad in a vertical direction; and   a slurry supply above the plate, spaced apart from the polishing head in a horizontal direction, and configured to discharge polishing slurry toward an upper surface of the chemical mechanical polishing pad,   wherein the chemical mechanical polishing pad comprises a body including:
 a plurality of first grooves extending downward in the vertical direction from the upper surface of the chemical mechanical polishing pad; and 
 a plurality of second grooves extending downward in the vertical direction inside the body such that an upper surface of each of the plurality of second grooves is below an upper surface of the body, 
   wherein at least two of the plurality of first grooves have different depths in the vertical direction from each other, and   wherein the upper surfaces of at least two of the plurality of second grooves are at different vertical levels from each other.   
     
     
         13 . The chemical mechanical polishing apparatus of  claim 12 , wherein each of the plurality of first grooves and the plurality of second grooves has a spiral cross-section on a horizontal plane. 
     
     
         14 . The chemical mechanical polishing apparatus of  claim 12 , wherein at least one of the plurality of second grooves is below one of the plurality of first grooves, and
 wherein the one of the plurality of first grooves and the at least one of the plurality of second grooves each other in the vertical direction.   
     
     
         15 . The chemical mechanical polishing apparatus of  claim 14 , wherein the one of the plurality of first grooves overlaps three of the plurality of second grooves in the vertical direction. 
     
     
         16 . The chemical mechanical polishing apparatus of  claim 12 , further comprising a pad cleaner above the chemical mechanical polishing pad and configured to clean the chemical mechanical polishing pad. 
     
     
         17 . The chemical mechanical polishing apparatus of  claim 12 , wherein at least one of the plurality of first grooves has a triangular cross-section on a vertical plane and at least one of the plurality of second grooves has a triangular cross-section on the vertical plane. 
     
     
         18 . A chemical mechanical polishing apparatus comprising:
 a plate configured to rotate about a vertical axis;   a chemical mechanical polishing pad on an upper surface of the plate;   a polishing head facing the chemical mechanical polishing pad in a vertical direction;   a slurry supply above the plate, spaced apart from the polishing head in a horizontal direction, and configured to discharge polishing slurry toward an upper surface of the chemical mechanical polishing pad; and   a pad cleaner above the chemical mechanical polishing pad and configured to clean the chemical mechanical polishing pad,   wherein the chemical mechanical polishing pad comprises a body comprising:
 a plurality of first grooves extending downward in the vertical direction from the upper surface of the chemical mechanical polishing pad; and 
 a plurality of second grooves extending downward in the vertical direction inside the body such that upper surfaces of each of the plurality of second grooves are below an upper surface of the body, 
   wherein at least two of the plurality of first grooves have different depths in the vertical direction from each other, and   wherein the upper surfaces of at least two of the plurality of second grooves are at different vertical levels from each other,   wherein at least one of the plurality of first grooves and at least one of the plurality of second grooves overlap each other in the horizontal direction, and   wherein each of the plurality of first grooves and the plurality of second grooves has a spiral cross-section on an horizontal plane.   
     
     
         19 . The chemical mechanical polishing apparatus of  claim 18 , wherein the plurality of second grooves are below each of the plurality of first grooves. 
     
     
         20 . The chemical mechanical polishing apparatus of  claim 18 , wherein at least one of the plurality of first grooves has a triangular cross-section on a vertical plane and at least one of the plurality of second grooves has a triangular cross-section on the vertical plane.