Polishing head and polishing carrier apparatus having the same

Abstract

A polishing head may include a substrate carrier detachably secured to a driving shaft and to pressurize and rotate a substrate, the substrate carrier includes a flexible membrane, wherein the flexible membrane includes a main thin film having a first surface to be in contact with the substrate and a second surface opposite to the first surface and a plurality of vertical thin films extending from the main thin film in a vertical direction to define a plurality of pressurizing chambers that are divided along a radial direction about a central axis; a plurality of temperature elements disposed under the plurality of pressurizing chambers in the main thin film and configured to apply local heat to the substrate; and a plurality of pressure elements respectively disposed on the plurality of temperature elements in the main thin film and configured to apply local pressure to the main thin film.

1 . A polishing head, comprising:
 a substrate carrier configured to be detachably secured to a driving shaft and to pressurize and rotate a substrate, the substrate carrier including a flexible membrane, the flexible membrane including a main thin film having a first surface to be in contact with the substrate and a second surface opposite to the first surface, a plurality of vertical thin films extending from the second surface of the main thin film in a vertical direction, and a plurality of pressurizing chambers divided along a radial direction and about a central axis by the plurality of vertical thin films;   a plurality of temperature elements in the main thin film and under the plurality of pressurizing chambers, the plurality of temperature elements configured to apply local heat to the substrate; and   a plurality of pressure elements in the main thin film and respectively on the plurality of temperature elements, the plurality of pressure elements configured to apply local pressure to the main thin film.   
     
     
         2 . The polishing head of  claim 1 , wherein each of the plurality of pressurizing chambers of the flexible membrane includes a plurality of sub-regions sequentially arranged in a circumferential direction, and
 wherein the main thin film has a plurality of cavities corresponding to the plurality of sub-regions.   
     
     
         3 . The polishing head of  claim 2 , wherein the plurality of temperature elements are respectively in the plurality of cavities. 
     
     
         4 . The polishing head of  claim 1 , wherein the plurality of temperature elements each include
 a plurality of flexible structures including flexible polymer;   a plurality of first electrodes between the plurality of flexible structures; and   a plurality of semiconductors between the plurality of first electrodes.   
     
     
         5 . The polishing head of  claim 1 , wherein the plurality of pressure elements each include,
 a plurality of second electrodes; and   a piezoelectric structure between the plurality of second electrodes, the piezoelectric structure including a piezoelectric polymer.   
     
     
         6 . The polishing head of  claim 1 , wherein the flexible membrane provides a plurality of recesses respectively over the plurality of temperature elements, the plurality of recesses configured to supply a thermal regulation fluid to the plurality of temperature elements. 
     
     
         7 . The polishing head of  claim 6 , wherein, when viewed in a cross-sectional view, each of the plurality of temperature elements includes
 a base portion adjacent to a lower surface of the main thin film such that the base portion is between the lower surface of the main thin film and a respective one of the plurality of pressure elements;   a pair of first extension portions extending in the vertical direction from the base portion toward the plurality of recesses; and   a pair of second extension portions over the plurality of pressure elements and extending from the pair of first extension portions toward a central extension line of each of the plurality of recesses.   
     
     
         8 . The polishing head of  claim 7 , wherein the plurality of temperature elements define a plurality of openings respectively defined by a pair of end surfaces of the pair of second extension portions facing each other, the plurality of openings respectively between a corresponding recess of the plurality of recesses and a corresponding pressure element of the plurality of pressure elements. 
     
     
         9 . (canceled) 
     
     
         10 . The polishing head of  claim 1 , wherein the flexible membrane includes a plurality of sub-regions under the plurality of pressurizing chambers and dividing a lower surface of the main thin film into a plurality of unit regions arranged in a plurality of columns and a plurality of rows, and
 wherein the main thin film defines a plurality of cavities under the plurality of sub-regions and corresponding to the plurality of sub-regions.   
     
     
         11 . A polishing head, comprising:
 a substrate carrier configured to be detachably secured to a driving shaft and to pressurize and rotate a substrate, the substrate carrier including a plurality of fluid passages that penetrate from an upper surface of the substrate carrier to a lower surface of the substrate carrier, the plurality of fluid passages spaced apart in a radial direction with respect to a central axis;   a flexible membrane clamped to a lower portion of the substrate carrier, the flexible membrane including a main thin film, a plurality of vertical thin films extending from the main thin film in a vertical direction, and a plurality of pressurizing chambers defined by the plurality of vertical thin films, each of the plurality of pressurizing chambers connected to a corresponding fluid passage of the plurality of fluid passages, wherein the main thin film includes a plurality of main regions divided along the radial direction with respect to the central axis and a plurality of sub-regions sequentially arranged in a circumferential direction with respect to the central axis and provided within the plurality of main regions;   a plurality of temperature elements respectively in the plurality of sub-regions of the main thin film and configured to apply local heat to the substrate; and   a plurality of pressure elements respectively in the plurality of temperature elements and configured to apply local pressure to the main thin film.   
     
     
         12 . The polishing head of  claim 11 , wherein the main thin film includes a plurality of cavities corresponding to the plurality of sub-regions, and
 wherein the plurality of temperature elements and the plurality of pressure elements are respectively in the plurality of cavities.   
     
     
         13 . The polishing head of  claim 11 , wherein the plurality of sub-regions are divided along at least one extension line passing through a center of the lower surface of the main thin film. 
     
     
         14 . The polishing head of  claim 13 , wherein the flexible membrane include a plurality of electrodes on the lower surface of the main thin film, the plurality of electrodes arranged along the at least one extension line and electrically connected to the plurality of pressure elements and the plurality of temperature elements. 
     
     
         15 . The polishing head of  claim 11 , wherein the plurality of temperature elements each include
 a plurality of flexible structures including flexible polymer;   a plurality of first electrodes between the plurality of flexible structures; and   a plurality of semiconductors between the plurality of first electrodes.   
     
     
         16 . The polishing head of  claim 11 , wherein the plurality of pressure elements each include
 a plurality of second electrodes; and   a piezoelectric structure between the plurality of second electrodes, the piezoelectric structure including a piezoelectric polymer.   
     
     
         17 . The polishing head of  claim 11 , wherein the flexible membrane define a plurality of recesses respectively over the plurality of temperature elements and configured to supply a thermal regulation fluid to the plurality of temperature elements. 
     
     
         18 . The polishing head of  claim 11 , wherein a width of each of the plurality of pressure elements has a first length, and a width of each of the plurality of temperature elements has a second length, and
 wherein the first length and the second length are the same.   
     
     
         19 . The polishing head of  claim 11 , wherein a width of each of the plurality of pressure elements has a first length, and a width of each of the plurality of temperature elements has a second length, and
 wherein a width of a contact surface between each of the plurality of pressure elements and each of the plurality of temperature elements is less than the second length.   
     
     
         20 . The polishing head of  claim 11 , wherein each of the plurality of temperature elements respectively surround a corresponding pressure element of the plurality of pressure elements, and
 wherein each of the plurality of temperature elements define a plurality of openings exposing upper surfaces of the plurality of pressure elements.   
     
     
         21 . A polishing head, comprising:
 a substrate carrier configured to be detachably secured to a driving shaft and to pressurize and rotate a substrate, the substrate carrier including a plurality of fluid passages that penetrate from an upper surface of the substrate carrier to a lower surface of the substrate carrier, the plurality of fluid passages spaced apart in a radial direction with respect to a central axis;   a flexible membrane clamped to a lower portion of the substrate carrier, the flexible membrane including a main thin film, a plurality of vertical thin films extending from the main thin film in a vertical direction, and a plurality of pressurizing chambers defined by the plurality of vertical thin films, each of the plurality of pressurizing chambers connected to a corresponding fluid passage of the plurality of fluid passages, wherein the main thin film includes a plurality of main regions divided along the radial direction with respect to the central axis and a plurality of sub-regions in the plurality of main regions such that a lower surface of the main thin film is divided into a plurality of unit regions, the plurality of unit regions arranged in a plurality of columns and a plurality of rows;   a plurality of temperature elements respectively in the plurality of sub-regions of the main thin film and configured to apply local heat to the substrate; and   a plurality of pressure elements respectively in the plurality of temperature elements and configured to apply local pressure to the main thin film.   
     
     
         22 .- 30 . (canceled)