Garments including electronic panels having substrates with attached conductive wire
Abstract
Embodiments of the present the disclosure relate to apparatuses, systems ( 100 ), and methods for flexible electronic panels ( 102 ) that can be incorporated into various garments ( 104 ). In an exemplary embodiment the electronic panel ( 102 ) comprises a substrate ( 118 ) and an electrically conductive wire ( 120 ) attached to the substrate ( 118 ). Exemplary embodiments include a garment ( 104 ) comprising a plurality of panels ( 102, A′,A″,A′″,Bl,B″). In aspects, a first panel ( 102 ) is a unitary panel extending from a first appendage of the garment ( 104 ) to a second appendage of the garment ( 104 ). Additionally, at least the first panel ( 102 ) comprises at least one conductive wire ( 120 ) and wherein the remaining plurality of panels (A′,A″,A′″,BI,B″) form the remainder of the garment ( 104 ).
Claims
exact text as granted — not AI-modified1 . A garment comprising:
a plurality of panels, wherein a first panel comprises:
a unitary substrate extending from a first appendage of the garment to a second appendage of the garment; and
at least one conductive wire attached to the substrate; and
wherein the remaining plurality of panels form the remainder of the garment; and wherein the garment is free from a seam extending across the first panel.
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9 . The garment of claim 1 , wherein the conductive wire is attached to the unitary substrate by one or more of potting material, adhesive, stitches, or interleaving with fibers of the substrate.
10 . The garment of claim 1 , wherein the first panel further comprises a layer of material attached to the unitary substrate to define a tunnel, wherein the conductive wire is located within the tunnel.
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12 . The garment of claim 1 , wherein the unitary substrate defines a tunnel, wherein the conductive wire is located within the tunnel.
13 . The garment of claim 12 wherein the tunnel is defined by woven filaments of the substrate.
14 . The garment of claim 12 wherein the tunnel is defined by a folded portion of the substrate, optionally an edge of the substrate, attached to the substrate, wherein the folded portion is optionally attached to the substrate by stitching.
15 . The garment of claim 1 , wherein the wire comprises an insulated wire.
16 . The garment of claim 1 , wherein the wire comprises a multi-conductor wire.
17 . The garment of claim 16 , wherein the multi-conductor wire comprises a ribbon wire.
18 . The garment of claim 16 , wherein the multi-conductor wire comprises a bundled or twisted wire.
19 . The garment of claim 1 , wherein the wire defines a serpentine path.
20 . The garment of claim 19 wherein the wire defines a serpentine path, optionally a sinusoidal or zig-zag path, in an x-y plane of the substrate.
21 . The garment of claim 19 wherein the wire defines a coiled path.
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27 . The garment of claim 1 , wherein the first panel further comprises an electrical connection coupled to the at least one conductive wire and configured to releasably couple to one or more electronic components.
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35 . The garment of claim 1 , wherein the first panel further comprises a conductive connection configured to route electricity or electrical signals from the first panel to a second panel.
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40 . A method of manufacturing a garment including a plurality of panels, the method comprising:
providing a unitary substrate; providing a conductive wire; attaching the conductive wire to the unitary substrate to form a first panel; coupling the first panel to a second panel of the plurality of panels at a seam; coupling any remaining panels to the first panel and/or the second panel to form the garment; and wherein the first panel is devoid of any seams extending: laterally across a portion of the panel, longitudinally across a portion of the panel, or a combination thereof.
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44 . The method of claim 40 , wherein attaching the conductive wire to the unitary substrate comprises one or more of potting, adhering, stitching, or interleaving with fibers of the unitary substrate, or extending the conductive wire through a tunnel on the unitary substrate.Join the waitlist — get patent alerts
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