Wiring Substrate, Electronic Element and Electronic Apparatus

Abstract

A wiring substrate, an electronic element and an electronic apparatus is provided according to the disclosure, the wiring substrate includes: a base substrate; connection lines located on the substrate, wherein at least two connection lines are configured to transmit different signals; a plurality of pads, wherein any two pads are distributed at intervals, and the pads include first pads; a first pad group composed of at least three first pads; wherein the connection lines include a first type of connection line, which includes a plurality of branch portions, different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.

The invention claimed is: 
     
         1 . A wiring substrate, comprising:
 a base substrate;   connection lines located on the base substrate, wherein at least two of the connection lines are configured to transmit different signals;   a plurality of pads, wherein any two of the pads are distributed at intervals, and the pads comprise first pads; and   a first pad group composed of at least three of the first pads;   wherein the connection lines comprise a first type of connection line, and the first type of connection line comprises a plurality of branch portions, wherein different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.   
     
     
         2 . The wiring substrate according to  claim 1 , wherein the plurality of branch portions of a same first type of connection line extend along a same direction, and an extension length is at least 400 μm. 
     
     
         3 . The wiring substrate according to  claim 1 , wherein the plurality of branch portions of a same first type of connection line and a plurality of the first pads respectively connected with the plurality of branch portions are arranged along a first direction, the plurality of branch portions extend along a second direction, and the first direction and the second direction have an included angle. 
     
     
         4 . The wiring substrate according to  claim 1 , wherein the connection lines further comprise a second type of connection line, the second type of connection line is configured to connect two of the first pads in one of first pad groups, and an orthographic projection of the second type of connection line on the substrate is within an orthographic projection of a region wherein the first pad group is located on the substrate. 
     
     
         5 . The wiring substrate according to  claim 4 , wherein two of the first pads connected by the second type of connection line are arranged along a first direction, and the second type of connection line extends along the first direction. 
     
     
         6 . The wiring substrate according to  claim 1 , wherein the pads further comprise second pads, the wiring substrate further comprises a second pad group composed of two of the second pads, the connection lines further comprise a third type of connection line configured to be connected at least to one of the first pads, and a length of the third type of connection line is at least 400 μm. 
     
     
         7 . The wiring substrate according to  claim 1 , wherein a difference between line widths of any connection line at various places is less than 15% in a direction perpendicular to an extension direction of the connection line. 
     
     
         8 . The wiring substrate according to  claim 7 , wherein a difference between line widths of any two of the connection lines is less than 15% in a direction perpendicular to an extension direction of the connection lines. 
     
     
         9 . The wiring substrate according to  claim 1 , wherein the wiring substrate further comprises signal lines, and each of the signal lines is coupled to at least one of the connection lines. 
     
     
         10 . The wiring substrate according to  claim 9 , wherein a difference between a line width of a signal line in a direction perpendicular to an extension direction of the signal line and a line width of a connection line coupled to the signal line in a direction perpendicular to an extension direction of the connection line is less than 15%. 
     
     
         11 . The wiring substrate according to  claim 9 , wherein the pads further comprise second pads, the wiring substrate further comprises a second pad group composed of two of the second pads, and the connection lines further comprise a fourth type of connection line, the fourth type of connection line is configured to connect one of the second pads with a signal line. 
     
     
         12 . The wiring substrate according to  claim 9 , wherein a signal line and a connection lines coupled to the signal line are of an integral structure. 
     
     
         13 . The wiring substrate according to  claim 9 , wherein any two adjacent branch portions corresponding to a same first pad group have a first spacing in a direction perpendicular to an extension direction of the branch portions, a minimum spacing between two adjacent signal lines is a second spacing, and a ratio of the first spacing to the second spacing is between 0.9 and 1.1. 
     
     
         14 . An electronic element, wherein the electronic element is connected to a pad of the wiring substrate according to  claim 1 . 
     
     
         15 . The electronic element according to  claim 14 , wherein the electronic element comprises a functional layer and a pin located on the functional layer, the pin comprises a recess portion arching towards the functional layer, the recess portion gradually decreases in a direction close to the functional layer, and a ratio of an area of an orthographic projection of an end face of the recess portion close to the functional layer on the functional layer to an area of an orthographic projection of the pin on the functional layer is less than or equal to 30%. 
     
     
         16 . The electronic element according to  claim 15 , wherein there is a first distance between a center of an orthographic projection of the recess potion on the functional layer and a center of the orthographic projection of the pin on the functional layer, and a ratio of the first distance to a radial length of the pin is less than 20%. 
     
     
         17 . The electronic element according to  claim 15 , wherein the electronic element further comprises a connection structure located at a side of the pin away from the functional layer, the connection structure fills the recess portion, and a thickness of the connection structure is greater than or equal to 15 μm and less than or equal to 25 μm. 
     
     
         18 . The electronic element according to  claim 14 , wherein the electronic element comprises a micro driver chip, the micro driver chip is connected to the first pad group. 
     
     
         19 . An electronic apparatus, comprising the wiring substrate according to  claim 1  and an electronic element connected to a pad of the wiring substrate. 
     
     
         20 . The electronic apparatus according to  claim 19 , further comprising a micro light emitting device connected to a second pad group.