Chip attach film, semiconductor package including the same, and method of manufacturing semiconductor package

Abstract

A chip attach film includes an adhesive layer, and a filler dispersed in the adhesive layer and including an organic material, wherein a thickness of the adhesive layer is about 0.5 μm to about 3 μm, and wherein an average particle diameter of the filler is equal to or greater than about 0.8 times the thickness of the adhesive layer, and less than about 1 times the thickness of the adhesive layer.

1 . A chip attach film comprising:
 an adhesive layer; and   a filler dispersed in the adhesive layer and including an organic material,   wherein a thickness of the adhesive layer is about 0.5 μm to about 3 μm, and   wherein an average particle diameter of the filler is equal to or greater than about 0.8 times the thickness of the adhesive layer, and less than about 1 times the thickness of the adhesive layer.   
     
     
         2 . The chip attach film of  claim 1 , wherein a content of the filler is about 0.01 parts by weight to about 2 parts by weight based on 100 parts by weight of the chip attach film. 
     
     
         3 . The chip attach film of  claim 1 , wherein the filler comprises a monodisperse filler of a spherical shape. 
     
     
         4 . The chip attach film of  claim 1 , wherein the filler comprises a thermoplastic polymer. 
     
     
         5 . The chip attach film of  claim 4 , wherein the thermoplastic polymer comprises polystyrene, polyurethane, or polymethylmethacrylate. 
     
     
         6 . The chip attach film of  claim 1 , wherein the adhesive layer comprises a binder polymer and a thermosetting polymer. 
     
     
         7 . The chip attach film of  claim 6 , wherein a content of the binder polymer is about 10 parts by weight to about 40 parts by weight based on 100 parts by weight of the chip attach film. 
     
     
         8 . The chip attach film of  claim 6 , wherein a content of the thermosetting polymer is about 20 parts by weight to about 60 parts by weight based on 100 parts by weight of the chip attach film. 
     
     
         9 . A semiconductor package comprising:
 a substrate;   a first semiconductor chip on the substrate;   a chip stack which is on the substrate and includes a plurality of second semiconductor chips stacked in a second direction, and is spaced apart from the first semiconductor chip in a first direction; and   a bonding wire connected to the chip stack and the substrate,   wherein the chip stack further comprises a chip attach film between the stacked plurality of second semiconductor chips, and   wherein the chip attach film comprises: an adhesive layer; and a filler dispersed in the adhesive layer and comprising an organic material, a thickness of the chip attach film is about 0.5 μm to about 3 μm, and an average particle diameter of the filler is equal to or greater than about 0.8 times the thickness of the chip attach film and less than about 1 times the thickness of the chip attach film.   
     
     
         10 . The semiconductor package of  claim 9 , wherein a content of the filler is about 0.01 parts by weight to about 2 parts by weight based on 100 parts by weight of the chip attach film. 
     
     
         11 . The semiconductor package of  claim 9 , wherein the filler comprises a monodisperse filler having a spherical shape. 
     
     
         12 . The semiconductor package of  claim 9 , wherein the filler comprises a thermoplastic polymer, and the thermoplastic polymer comprises polystyrene, polyurethane, or polymethylmethacrylate. 
     
     
         13 . The semiconductor package of  claim 9 , wherein the filler comprises an organic material having a glass transition temperature of about 120° C. or less. 
     
     
         14 . The semiconductor package of  claim 9 ,
 wherein the adhesive layer comprises binder polymer and thermosetting polymer, a content of the binder polymer is about 10 parts by weight to about 40 parts by weight based on 100 parts by weight of the chip attach film, and a content of the thermosetting polymer is about 20 parts by weight to about 60 parts by weight based on 100 parts by weight of the chip attach film.   
     
     
         15 . The semiconductor package of  claim 14 ,
 wherein the binder polymer comprises a thermoplastic polymer, and the thermoplastic polymer comprises acryl-based polymer or phenoxy-based polymer.   
     
     
         16 . The semiconductor package of  claim 14 , wherein the thermosetting polymer comprises an epoxy-based polymer. 
     
     
         17 . A method of manufacturing a semiconductor package, the method comprising:
 mounting a first semiconductor chip on a substrate;   forming a chip stack spaced apart in a first direction from the first semiconductor chip on the substrate;   forming a bonding wire connected to the chip stack and the substrate; and   forming a molding layer on the first semiconductor chip, the chip stack, and the bonding wire,   wherein the forming of the chip stack comprises stacking a plurality of second semiconductor chips in a second direction including a chip attach film formed on one surface of the plurality of second semiconductor chips, and   wherein the chip attach film comprises: an adhesive layer; and a filler dispersed in the adhesive layer and comprising an organic material, a thickness of the chip attach film is about 0.5 μm to about 3 μm, and an average particle diameter of the filler is equal to or greater than about 0.8 times the thickness of the chip attach film and less than about 1 times the thickness of the chip attach film.   
     
     
         18 . The method of  claim 17 ,
 wherein the stacking of the plurality of second semiconductor chips in the second direction comprises performing a thermo-compression process, and the thermo-compression process is performed at a temperature equal to or greater than a glass transition temperature of the filler.   
     
     
         19 . The method of  claim 17 , wherein a content of the filler is about 0.01 parts by weight to about 2 parts by weight based on 100 parts by weight of the chip attach film. 
     
     
         20 . The method of  claim 17 , wherein the filler comprises a monodisperse filler having a spherical shape. 
     
     
         21 - 24 . (canceled)