US2025130380A1PendingUtilityA1
Optical devices and methods of manufacture
Assignee: TAIWAN SEMICONDUCTOR MFG CO LTDPriority: Oct 23, 2023Filed: Feb 2, 2024Published: Apr 24, 2025
Est. expiryOct 23, 2043(~17.2 yrs left)· nominal 20-yr term from priority
G02B 6/4206G02B 6/4214G02B 6/428G02B 2006/12166G02B 2006/12147G02B 2006/12107G02B 2006/12111G02B 2006/12104G02B 2006/12038G02B 2006/12083G02B 6/13G02B 6/12007G02B 6/122G02B 6/4239G02B 6/12
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Claims
Abstract
Optical devices and methods of manufacture are presented in which glass interposers are incorporated with optical devices. In some embodiments a method includes forming a first optical package and then bonding the first optical package to a first glass interposer. The first glass interposer may then be connected to a second interposer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing an optical device, the method comprising:
forming a first optical package; and bonding the first optical package to a first glass interposer.
2 . The method of claim 1 , further comprising bonding a laser die to the first glass interposer.
3 . The method of claim 2 , wherein the first optical package comprises a multi-core edge coupler aligned with an output of the laser die.
4 . The method of claim 2 , wherein the laser die is optically coupled to the first optical package through the first glass interposer.
5 . The method of claim 1 , further comprising bonding the first glass interposer to a second glass interposer.
6 . The method of claim 5 , further comprising attaching a fiber array unit to the second glass interposer.
7 . The method of claim 1 , further comprising attaching a fiber array unit to the second glass interposer.
8 . A method of manufacturing an optical device, the method comprising:
forming through vias through a glass material of an interposer; forming a first redistribution layer over the glass material, the first redistribution layer comprising conductive components and optical components; bonding a first optical device onto the first redistribution layer; and bonding a laser die to the first redistribution layer.
9 . The method of claim 8 , wherein the bonding the first optical device comprises a dielectric-to-dielectric and metal-to-metal bonding process.
10 . The method of claim 8 , wherein the bonding the first optical device comprises reflowing a conductive bump.
11 . The method of claim 8 , further comprising forming a first lens in the glass material using at least in part a laser ablation process.
12 . The method of claim 11 , further comprising forming a second redistribution layer on an opposite side of the glass material from the first redistribution layer, the second redistribution layer comprising:
second optical components; and a first mirror, wherein a second mirror is located within the first redistribution layer.
13 . The method of claim 8 , further comprising connecting a fiber array unit to the first optical device.
14 . The method of claim 8 , further comprising:
bonding a second interposer to the interposer, the second interposer comprising through vias extending through a second glass material; and connecting a fiber array unit to the second interposer.
15 . An optical device comprising:
a first interposer comprising a through via extending through a first glass material; and a first optical device bonded to the first interposer.
16 . The optical device of claim 15 , wherein the first optical device is a first optical package.
17 . The optical device of claim 15 , further comprising a laser die bonded to the first interposer, the laser die optically connected to the first optical device through the first interposer.
18 . The optical device of claim 15 , further comprising a laser die bonded to the first interposer, the laser die optically connected to the first optical device through a multi-core edge coupler located within the first optical device.
19 . The optical device of claim 15 , further comprising a second interposer bonded to the interposer.
20 . The optical device of claim 19 , further comprising a fiber array unit connected to the second interposer, wherein the second interposer comprises a second glass material.Join the waitlist — get patent alerts
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