Semiconductor test apparatus

Abstract

A semiconductor test apparatus includes a base plate, side supporters provided as three or more on a lower surface of the base plate, an elastic cylinder and a side stopper provided on a lower surface of each of the side supporters, a center stopper provided laterally apart from the side supporters on the lower surface of the base plate, a stopper foot provided at one end of the center stopper, a foot supporter provided at one end of the stopper foot, a top plate disposed under the base plate to contact the elastic cylinder and the side stopper, the top plate including a center hole in a center portion thereof, and a substrate cover provided under the top plate, wherein the center stopper and the side stopper are selectively locked.

What is claimed is: 
     
         1 . A semiconductor test apparatus comprising:
 a base plate;   a plurality of side supporters on a lower surface of the base plate;   an elastic cylinder and a side stopper on a lower surface of each of the plurality of side supporters;   a center stopper laterally spaced apart from the plurality of side supporters on the lower surface of the base plate;   a stopper foot at one end of the center stopper;   a foot supporter at one end of the stopper foot;   a top plate under the base plate and configured to contact the elastic cylinder and the side stopper, wherein the top plate comprises a center hole in a center portion thereof; and   a substrate cover under the top plate,   wherein the center stopper and the side stopper are configured to be selectively locked.   
     
     
         2 . The semiconductor test apparatus of  claim 1 , further comprising a pneumatic valve and a pneumatic regulator,
 wherein the pneumatic valve is connected to the pneumatic regulator through a second supply line, the pneumatic regulator is connected to the center stopper through a third supply line, and the pneumatic regulator is connected to the side stopper through a fourth supply line.   
     
     
         3 . The semiconductor test apparatus of  claim 2 , further comprising a controller and a pneumatic supply,
 wherein the controller is connected with each of the pneumatic valve and the pneumatic regulator through a control line, and the pneumatic supply is connected with the pneumatic valve through a first supply line.   
     
     
         4 . The semiconductor test apparatus of  claim 1 ,
 wherein the elastic cylinder and the side stopper are on the top plate at the lower surface of the base plate and are at an inner portion of a shape where the top plate overlaps the lower surface of the base plate, and   wherein the elastic cylinder and the side stopper are respectively provided in the plurality of side supporters to protrude vertically in a downward direction.   
     
     
         5 . The semiconductor test apparatus of  claim 4 ,
 wherein the center stopper comprises a center body and a first piston,   wherein the stopper foot comprises a ball and a connector,   wherein the ball is at one end of the first piston, the connector contacts at least a portion of the ball, and the connector is configured to rotate or to be inclined with respect to the ball, and   wherein a lower surface of the connector is connected with the foot supporter at a position opposite to a position of the ball.   
     
     
         6 . The semiconductor test apparatus of  claim 5 , wherein the foot supporter comprises a supporter groove inward recessed in a surface of the foot supporter facing the top plate. 
     
     
         7 . The semiconductor test apparatus of  claim 5 , further comprising a supporting guide on the lower surface of the base plate,
 wherein the supporting guide comprises a guide support and a center guide, and wherein the center guide is configured to perform a rectilinear motion with respect to the guide support and is connected with the first piston.   
     
     
         8 . The semiconductor test apparatus of  claim 5 , further comprising a plurality of Belleville springs on the lower surface of the top plate,
 wherein the plurality of Belleville springs are arranged uniformly around the center hole.   
     
     
         9 . The semiconductor test apparatus of  claim 5 , further comprising a supporting frame on one surface of the base plate,
 wherein the supporting frame comprises a first supporting frame and a second supporting frame, and   wherein the first supporting frame is perpendicular to the second supporting frame.   
     
     
         10 . The semiconductor test apparatus of  claim 9 , wherein the center stopper is coupled to the supporting frame and is under the supporting frame. 
     
     
         11 . The semiconductor test apparatus of  claim 10 , further comprising a center stopper connector coupled to each of the supporting frame and the center body, wherein the center stopper connector is configured to fix the center stopper. 
     
     
         12 . The semiconductor test apparatus of  claim 5 ,
 wherein the plurality of side supporters comprises four side supporters, and   wherein an elastic modulus of each of the elastic cylinders is in a range of 20 N/mm to 60 N/mm.   
     
     
         13 . The semiconductor test apparatus of  claim 5 ,
 wherein a supporting force of the center stopper is in a range of 2,500 N to 3,500 N, and   wherein a supporting force of the side stopper is in a range of 400 N to 800 N.   
     
     
         14 . A semiconductor test apparatus comprising:
 a base plate;   a plurality of side supporters on a lower surface of the base plate;   an elastic cylinder and a side stopper on a lower surface of each of the plurality of side supporters;   a supporting frame comprising a first supporting frame and a second supporting frame intersecting with each other at the lower surface of the base plate;   a center stopper at a position at which the first supporting frame intersects with the second supporting frame, wherein the center stopper is laterally spaced apart from the plurality of side supporters;   a top plate under the base plate and connected with the elastic cylinder and the side stopper, wherein the top plate comprises a center hole under the center stopper;   a substrate cover under the top plate;   an upper zero insertion force (ZIF) connector on a lower surface of the top plate; and   a lower ZIF connector on an upper surface of the substrate cover and coupled to the upper ZIF connector.   
     
     
         15 . The semiconductor test apparatus of  claim 14 , further comprising:
 a stopper foot at one end of the center stopper; and   a foot supporter connected with one surface of the stopper foot,   wherein the stopper foot comprises a ball and a connector,   wherein the one end of the center stopper is inserted into and connected with the ball, and the connector is configured to surround at least a portion of a surface of the ball, and   wherein the foot supporter is connected to the connector on a surface opposite from a position of the ball.   
     
     
         16 . The semiconductor test apparatus of  claim 15 , further comprising a plurality of Belleville springs on the lower surface of the top plate and in a gap included in the upper ZIF connector,
 wherein each of the plurality of Belleville springs are fixed to the lower surface of the top plate, and a portion of each of the plurality of Belleville springs is configured to contact the lower ZIF connector or the substrate cover, and   wherein the plurality of Belleville springs are arranged uniformly around the center hole.   
     
     
         17 . The semiconductor test apparatus of  claim 16 , further comprising a card information unit at a center of the upper surface of the substrate cover,
 wherein the foot supporter comprises a supporter groove recessed to an inner portion of the foot supporter and provided in a surface of the foot supporter facing the top plate, and   wherein an area of a planar shape of the supporter groove is greater than an area of a planar shape of the card information unit.   
     
     
         18 . The semiconductor test apparatus of  claim 16 , further comprising:
 a pneumatic valve comprising a first pneumatic valve and a second pneumatic valve; and   a pneumatic regulator connected with the pneumatic valve through a supply line,   wherein the first pneumatic valve passes through the pneumatic regulator and is connected with the center stopper through a first supply line, and   wherein the second pneumatic valve passes through the pneumatic regulator and is connected with the side stopper through a second supply line.   
     
     
         19 . The semiconductor test apparatus of  claim 18 , further comprising a controller and a pneumatic supply,
 wherein the pneumatic supply is configured to supply pressurized air to the pneumatic valve, and   wherein the controller is electrically connected with the first pneumatic valve, the second pneumatic valve, and the pneumatic regulator and is configured to control opening or closing of the first pneumatic valve and the second pneumatic valve.   
     
     
         20 . A semiconductor test apparatus comprising:
 a base plate;   a plurality of side supporters on a lower surface of the base plate;   an elastic cylinder and a side stopper on a lower surface of each of the plurality of side supporters;   a supporting frame comprising a first supporting frame and a second supporting frame intersecting with each other at the lower surface of the base plate;   a center stopper at a position at which the first supporting frame intersects with the second supporting frame, wherein the center stopper is laterally spaced apart from the plurality of side supporters;   a top plate under the base plate and connected with the elastic cylinder and the side stopper, wherein the top plate comprises a center hole under the center stopper;   a substrate cover under the top plate;   an upper zero insertion force (ZIF) connector on a lower surface of the top plate;   a lower ZIF connector on an upper surface of the substrate cover and coupled to the upper ZIF connector;   a plurality of Belleville springs on the lower surface of the top plate and between the upper ZIF connector and the lower ZIF connector;   a stopper foot at one end of the center stopper, the stopper foot comprising a ball and a connector;   a foot supporter connected with one surface of the stopper foot;   a card information unit at a center of the upper surface of the substrate cover;   a pneumatic valve comprising a first pneumatic valve and a second pneumatic valve;   a pneumatic regulator connected with the pneumatic valve through a supply line;   a controller electrically connected with the first pneumatic valve, the second pneumatic valve, and the pneumatic regulator, wherein the controller is configured to control opening or closing of each of the first pneumatic valve and the second pneumatic valve; and   a pneumatic supply configured to supply pressurized air to the pneumatic valve,   wherein the one end of the center stopper is inserted into and connected with the ball, and the connector is configured to surround at least a portion of a surface of the ball,   wherein the foot supporter is provided as a unitary structure with a surface of the connector opposite from the ball,   wherein the plurality of Belleville springs are fixed to the lower surface of the top plate, a portion of each of the plurality of Belleville springs is configured to contact the lower ZIF connector or the substrate cover, and the plurality of Belleville springs are arranged uniformly around the center hole,   wherein the foot supporter comprises a supporter groove recessed to an inner portion of the foot supporter in a surface of the foot supporter facing the top plate, and an area of a planar shape of the supporter groove is greater than an area of a planar shape of the card information unit,   wherein the first pneumatic valve passes through the pneumatic regulator and is connected with the center stopper through a first supply line, and the second pneumatic valve passes through the pneumatic regulator and is connected with the side stopper through a second supply line, and   wherein an area of a planar shape of the center hole is greater than an area of a planar shape of the foot supporter.