Polishing apparatus

Abstract

A technology that can clean a bottom surface of a dresser while inhibiting a cleaning solution discharged from a cleaning nozzle from splashing in a direction of a polishing pad. A polishing apparatus 1 includes a polishing table 2, a top ring 3, a dresser 10, at least one cleaning nozzle 20, and a dresser rotation mechanism 32. The at least one cleaning nozzle discharges a cleaning solution Lq in a fan shape and in a direction away from a polishing pad Pd, and an intersection point IP where a discharge central axis XL2 of the cleaning solution intersects with a bottom surface 11 of the dresser is positioned closer to the at least one cleaning nozzle than a center line CL1 of the bottom surface of the dresser. The at least one cleaning nozzle discharges the cleaning solution such that a part of the cleaning solution discharged from the cleaning nozzle and contacting the bottom surface of the dresser moves and passes through the center C1 of the bottom surface of the dresser.

1 . A polishing apparatus comprising:
 a polishing table configured to hold a polishing pad for polishing a substrate;   a top ring configured to hold the substrate;   a dresser configured to dress the polishing pad, the dresser being movable between a dressing position in which the dresser is positioned above the polishing pad and a standby position in which the dresser is not positioned above the polishing pad;   at least one cleaning nozzle configured to discharge a cleaning solution from below the dresser to a bottom surface of the dresser to clean the bottom surface when the dresser is in the standby position; and   a dresser rotation mechanism configured to rotate the dresser during cleaning of the dresser with the cleaning solution, wherein   the at least one cleaning nozzle discharges the cleaning solution in a fan shape and in a direction away from the polishing pad,   an intersection point where a discharge central axis as a central axis of a fan shape of the discharged cleaning solution intersects with the bottom surface of the dresser is positioned closer to the at least one cleaning nozzle than the center line of the bottom surface of the dresser, and the center line is perpendicular to the discharge central axis, in a plan view, and   the at least one cleaning nozzle discharges the cleaning solution such that a part of the cleaning solution discharged from the cleaning nozzle and brought into contact with the bottom surface of the dresser moves and passes through the center of the bottom surface of the dresser.   
     
     
         2 . The polishing apparatus according to  claim 1 , wherein
 the at least one cleaning nozzle includes a plurality of cleaning nozzles.   
     
     
         3 . The polishing apparatus according to  claim 2 , wherein
 the plurality of cleaning nozzles discharge the cleaning solution such that when the cleaning solution discharged from the plurality of cleaning nozzles contacts the bottom surface of the dresser, the pressure applied to the bottom surface from the cleaning solution is partially increased.   
     
     
         4 . The polishing apparatus according to  claim 3 , wherein
 the plurality of cleaning nozzles are arranged such that the cleaning solution discharged from the plurality of cleaning nozzles contacts an entire surface of the bottom surface of the rotating dresser, or contacts a portion of the bottom surface of the rotating dresser and subsequently moves over the entire surface of the bottom surface.