Conductive substrate and manufacturing method for conductive substrate

Abstract

A conductive substrate having excellent conductivity and excellent migration suppressing performance, and a manufacturing method for the conductive substrate. The conductive substrate includes a substrate and a conductive thin wire that contains silver and is disposed on the substrate, where a ratio of an amount of iodine atoms to an amount of silver atoms, which is detected in a case where a surface of the conductive thin wire is measured by a fluorescent X-ray analysis method, is 0.035 to 0.100.

What is claimed is: 
     
         1 . A conductive substrate comprising:
 a substrate; and   a conductive thin wire that contains silver and is disposed on the substrate,   wherein a ratio of an amount of iodine atoms to an amount of silver atoms, which is detected in a case where a surface of the conductive thin wire is measured by a fluorescent X-ray analysis method, is 0.035 to 0.100.   
     
     
         2 . The conductive substrate according to  claim 1 ,
 wherein a line width of the conductive thin wire is 0.1 μm or more and less than 5.0 μm.   
     
     
         3 . The conductive substrate according to  claim 1 ,
 wherein in a vertical cross section of the conductive thin wire in a direction orthogonal to a direction in which the conductive thin wire extends, a ratio of a height of the conductive thin wire to a line width of the conductive thin wire is 0.6 or more and less than 1.5.   
     
     
         4 . The conductive substrate according to  claim 1 ,
 wherein a line width of the conductive thin wire is 0.1 μm or more and less than 5.0 μm, and   wherein in a vertical cross section of the conductive thin wire in a direction orthogonal to a direction in which the conductive thin wire extends, a ratio of a height of the conductive thin wire to a line width of the conductive thin wire is 0.6 or more and less than 1.5.   
     
     
         5 . The conductive substrate according to  claim 1 ,
 wherein the silver contained in the conductive thin wire has a particle shape.   
     
     
         6 . The conductive substrate according to  claim 1 ,
 wherein a line width of the conductive thin wire is 0.1 μm or more and less than 5.0 μm, and   wherein the silver contained in the conductive thin wire has a particle shape.   
     
     
         7 . The conductive substrate according to  claim 1 ,
 wherein in a vertical cross section of the conductive thin wire in a direction orthogonal to a direction in which the conductive thin wire extends, a ratio of a height of the conductive thin wire to a line width of the conductive thin wire is 0.6 or more and less than 1.5, and   wherein the silver contained in the conductive thin wire has a particle shape.   
     
     
         8 . The conductive substrate according to  claim 1 ,
 wherein a line width of the conductive thin wire is 0.1 μm or more and less than 5.0 μm,   wherein in a vertical cross section of the conductive thin wire in a direction orthogonal to a direction in which the conductive thin wire extends, a ratio of a height of the conductive thin wire to a line width of the conductive thin wire is 0.6 or more and less than 1.5, and   wherein the silver contained in the conductive thin wire has a particle shape.   
     
     
         9 . The conductive substrate according to  claim 1 ,
 wherein the substrate is a substrate having flexibility.   
     
     
         10 . The conductive substrate according to  claim 9 ,
 wherein a material constituting the substrate having flexibility is at least one selected from the group consisting of polyethylene terephthalate, a cycloolefin polymer, a cycloolefin copolymer, and polycarbonate.   
     
     
         11 . A manufacturing method for a conductive substrate, in which a conductive substrate including a substrate and a conductive thin wire that contains silver and is disposed on the substrate is manufactured, the manufacturing method for a conductive substrate comprising, in the following order:
 a step 1 of forming a thin wire-shaped metal-containing layer on the substrate; and   a step 2 of subjecting the metal-containing layer to an electroless plating treatment to form the conductive thin wire,   wherein a plating treatment liquid used for the electroless plating treatment contains potassium iodide and a reducing agent,   a content of the reducing agent in the plating treatment liquid is 60 mmol/L or less, and   C KI /C R ×1,000≤0.7 is satisfied in a case where contents of the potassium iodide and the reducing agent in the plating treatment liquid are denoted as C KI  mmol/L and C R  mmol/L, respectively.   
     
     
         12 . The manufacturing method for a conductive substrate according to  claim 11 ,
 wherein the electroless plating treatment is an electroless silver plating treatment.