US2025092555A1PendingUtilityA1
Manufacturing method of roughened copper foil
Est. expirySep 19, 2043(~17.1 yrs left)· nominal 20-yr term from priority
C25D 7/0614C25D 5/48C25D 5/605C25D 3/38
60
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A manufacturing method of a roughened copper foil includes the following steps. A copper foil is provided. An electrolytic process is performed to form a roughening layer on the copper foil. An electrolyte solution in the electrolysis process includes copper ions in a range from 0.1 g/L to 20 g/L, sulfate ions in a range from 30 g/L to 120 g/L, and a coordination compound in a range from 0.1 g/L to 10 g/L.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A manufacturing method of a roughened copper foil, comprising:
providing a copper foil; and performing an electrolytic process to form a roughening layer on the copper foil, wherein an electrolyte solution in the electrolytic process comprises copper ions in a range from 0.1 g/L to 20 g/L, sulfate ions in a range from 30 g/L to 120 g/L, and a coordination compound in a range from 0.1 g/L to 10 g/L.
2 . The manufacturing method of a roughened copper foil according to claim 1 , wherein the coordination compound comprises a benzotriazole-based compound, a propanesulfonic acid-based compound, ethylenediaminetetraacetic acid or a combination thereof.
3 . The manufacturing method of a roughened copper foil according to claim 1 , wherein no other metal ions are further added to the electrolyte solution.
4 . The manufacturing method of a roughened copper foil according to claim 1 , wherein the electrolytic process comprises a first electrolytic process and a second electrolytic process, and a first concentration of the copper ions used in the first electrolytic process is lower than a second concentration of the copper ions used in the second electrolytic process.
5 . The manufacturing method of a roughened copper foil according to claim 4 , wherein the first concentration of the copper ions is from 0.1 g/L to 10 g/L, and the second concentration of the copper ions is from 1 g/L to 20 g/L.
6 . The manufacturing method of a roughened copper foil according to claim 1 , further comprising performing a silylation treatment process after the performing the electrolytic process.
7 . The manufacturing method of a roughened copper foil according to claim 1 , wherein the electrolytic process uses direct current.
8 . The manufacturing method of a roughened copper foil according to claim 1 , wherein a temperature of the electrolytic process is from 25° C. to 60° C.
9 . The manufacturing method of a roughened copper foil according to claim 1 , wherein current density of the electrolytic process is from 1 A/dm 2 to 120 A/dm 2 .
10 . The manufacturing method of a roughened copper foil according to claim 1 , wherein duration of the electrolytic process is from 1 second to 45 seconds.Join the waitlist — get patent alerts
Track US2025092555A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.