US2025092485A1PendingUtilityA1
Hot stamping component and manufacturing method therefor
Est. expiryMay 31, 2042(~15.8 yrs left)· nominal 20-yr term from priority
C21D 8/00C21D 8/02C22C 38/24C22C 38/26C22C 38/28C22C 38/38C22C 38/32C22C 38/60C22C 38/002C22C 38/04C22C 38/02C21D 3/04C23C 2/12C23C 2/06C23C 2/02C23C 2/0224C23C 2/29C23C 2/28C23C 2/40C21D 1/76C21D 7/13C21D 9/0068C21D 1/18C21D 1/673C21D 2211/008C21D 8/0257B21D 37/16B21D 22/208B21D 53/88C21D 9/46B21D 22/022C21D 6/008C21D 6/005C21D 6/002C22C 38/48C22C 38/50C21D 8/0273C21D 8/0236C21D 8/0226B21D 22/02C21D 9/48C21D 8/005
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Claims
Abstract
A hot stamping component includes: a base material; a decarburization layer located on the base material; and an inner oxide layer located on the decarburization layer, wherein the hot stamping component has a tensile strength (TS) of 1350 MPa to 1680 MPa, and a hardness of the hot stamping component within a depth of 50 μm from a surface of the hot stamping component in a plate thickness direction of the hot stamping component and an average hardness of the hot stamping component satisfy Relational Expression 1.(A/B)≤0.7<RelationalExpression1>(In Relational Expression 1, A denotes the hardness (Hv(≤50 μm)) within the depth of 50 μm in the plate thickness direction of the hot stamping component, and B denotes the average hardness (Hv(avg.)) of the hot stamping component.)
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A hot stamping component comprising:
a base material; a decarburization layer located on the base material; and an inner oxide layer located on the decarburization layer, wherein the hot stamping component has a tensile strength (TS) of about 1350 MPa to 1680 MPa, and wherein a hardness of the hot stamping component within a depth of about 50 μm from a surface of the hot stamping component in a plate thickness direction of the hot stamping component and an average hardness of the hot stamping component satisfy Relational Expression 1.
(
A
/
B
)
≤
0
.
7
<
Relational
Expression
1
>
(In Relational Expression 1, A denotes the hardness (Hv(≤50 μm)) within the depth of 50 μm in the plate thickness direction of the hot stamping component, and B denotes the average hardness (Hv(avg.)) of the hot stamping component.)
2 . The hot stamping component of claim 1 , wherein a depth of the inner oxide layer satisfies Relational Expression 2.
C
≤
5
μ
m
<
Relational
Expression
2
>
(In Relational Expression 2, C denotes the depth of the inner oxide layer in the plate thickness direction of the hot stamping component.)
3 . The hot stamping component of claim 1 , wherein the hot stamping component has a VDA bending angle of about 60° or more.
4 . The hot stamping component of claim 1 , wherein the hot stamping component has a yield strength (YP) of about 900 MPa to 1300 MPa and an elongation (EL) of 4% to 10%.
5 . The hot stamping part of claim 1 , wherein the hot stamping component has a microstructure with a martensite fraction of about 90% or more.
6 . The hot stamping component of claim 1 , further comprising a plating layer located on the inner oxide layer.
7 . The hot stamping component of claim 6 , wherein a thickness of the plating layer is about 10 μm to 30 μm.
8 . A method of manufacturing a hot stamping component, comprising:
forming a blank by cutting a plated steel sheet having a plating layer formed on at least one surface of a base material; and heating the blank in a heating furnace having a plurality of sections with different temperature ranges, wherein the heating of the blank comprises: a multi-stage heating step of heating the blank stepwise; and a soaking step of heating the stepwise heated blank to a temperature of Ac1 to about 910° C., wherein a hardness of the hot stamping component within a depth of about 50 μm from a surface of the hot stamping component in a plate thickness direction of the hot stamping component and an average hardness of the hot stamping component satisfy Relational Expression 3.
(
A
/
B
)
≤
0
.
7
<
Relational
Expression
3
>
(In Relational Expression 3, A denotes the hardness (Hv(≤50 μm)) within the depth of 50 μm in the plate thickness direction of the hot stamping component, and B denotes the average hardness (Hv(avg.)) of the hot stamping component.)
9 . The method of manufacturing a hot stamping component of claim 8 , wherein a dew point of an annealing furnace of the base material is about −15° C. to +15° C.
10 . The method of manufacturing a hot stamping component of claim 8 , wherein an annealing temperature of the base material is about 750° C. to 900° C.
11 . The method of manufacturing a hot stamping component of claim 8 , further comprising:
after the heating of the blank, transferring the heated blank; forming a molded body by pressing the transferred blank with a mold; and cooling the formed molded body.
12 . The method of manufacturing a hot stamping component of claim 11 , wherein the hot stamping component further comprises:
a decarburization layer formed on the base material; and an inner oxide layer formed on the decarburization layer.
13 . The method of manufacturing a hot stamping component of claim 12 , wherein a depth of the inner oxide layer satisfies Relational Expression 4.
C
≤
5
μ
m
<
Relational
Expression
4
>
(In Relational Expression 4, C denotes the depth of the inner oxide layer in the plate thickness direction of the hot stamping component.)
14 . A hot stamping component, comprising:
a base material including carbon (C), silicon (Si), manganese (Mn), chromium (Cr), boron (B), and other elements, wherein the base material has a microstructure with a martensite fraction of about 90% or more; a decarburization layer located on the base material; an inner oxide layer located on the decarburization layer; and a plating layer located on the inner oxide layer,
wherein the hot stamping component satisfies the following conditions:
a tensile strength (TS) of about 1350 MPa to 1680 MPa;
a VDA bending angle of about 60° or more;
Relational
Expression
3
:
(
A
/
B
)
≤
0.7
,
and
Relational
Expression
4
:
C
≤
5
μ
m
.
(In Relational Expression 3, A denotes the hardness (Hv(≤50 μm)) within the depth of 50 μm in the plate thickness direction of the hot stamping component, and B denotes the average hardness (Hv(avg.)) of the hot stamping component.)
(In Relational Expression 4, C denotes the depth of the inner oxide layer in the plate thickness direction of the hot stamping component.)
15 . The hot stamping component of claim 14 , wherein the decarburization layer is softer than the base material and has an average hardness of 70% or less compared to the average hardness at an about ¼ plate thickness of the hot stamping component.
16 . The hot stamping component of claim 14 , wherein the plating layer is a zinc (Zn)-based or aluminum (Al)-based layer with a thickness of about 10 μm to 30 μm, providing corrosion resistance and preventing toughness reduction.
17 . The hot stamping component of claim 14 , wherein the depth of the decarburization layer is controlled to improve the toughness of the component, without increasing the risk of liquid metal embrittlement (LME) during high-temperature forming.
18 . The hot stamping component of claim 14 , wherein the hardness ratio (A/B) ensures that the hot stamping component maintains high toughness and high-temperature formability, reducing surface cracks during forming.
19 . The hot stamping component of claim 14 , wherein the component has a yield strength (YP) of about 900 MPa to 1300 MPa and an elongation (EL) of about 4% to 10%.
20 . The hot stamping component of claim 14 , wherein the plating layer, decarburization layer, and inner oxide layer provide a layered structure, enhancing both corrosion resistance and bendability under VDA standards.Join the waitlist — get patent alerts
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