US2025085252A1PendingUtilityA1

Integrated ion sensing apparatus and methods

Assignee: ANALOG DEVICES INTERNATIONAL UNLIMITED COPriority: May 15, 2017Filed: Sep 16, 2024Published: Mar 13, 2025
Est. expiryMay 15, 2037(~10.8 yrs left)· nominal 20-yr term from priority
G01N 27/4163G01N 27/414G01N 27/26G01N 27/30G01N 27/333
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Claims

Abstract

An integrated ion-sensitive probe is provided. In an example, an ion-sensitive probe can include a semiconductor substrate and a first passive electrode attached to the semiconductor substrate. The first passive electrode can be configured to contact a solution and to provide a first electrical voltage as function of a concentration of an ion within the solution. In certain examples, a passive reference electrode can be co-located on the semiconductor substrate. In some examples, processing electronics can be integrated on the semiconductor substrate.

Claims

exact text as granted — not AI-modified
1 .- 26 . (canceled) 
     
     
         27 . An apparatus for sensing a concentration of a material, the apparatus comprising:
 a substrate;   a plurality of electrodes integrated with the substrate and configured to contact a solution and to detect a measurable electrical response when in contact with the solution; and   a cavity configured to expose the solution to the plurality of electrodes, wherein the cavity comprises at least one channel configured to guide the solution to the plurality of electrodes;   a reference electrode structure integrated with the substrate, the reference electrode structure configured to hold a reference material;   wherein the apparatus is configured to selectively activate or expose at least one electrode of the plurality of electrodes.   
     
     
         28 . The apparatus of  claim 27 , further comprising a barrier positioned over the plurality of electrodes, an opening of the barrier configured to move between at least a first position where the plurality of electrodes are not exposed to the external environment and a second position where the plurality of electrodes are exposed to the external environment. 
     
     
         29 . The apparatus of  claim 27 , further comprising a plurality of heating elements in communication with the plurality of electrodes, the heating elements configured to selectively rupture a membrane of each of the plurality of electrodes to expose each of the plurality of electrodes to the solution. 
     
     
         30 . The apparatus of  claim 27 , further comprising a conditioning element positioned adjacent or proximate to the at least one channel, the conditioning element configured to control fluid flow within the at least one channel and cause vibration in the at least one channel to prevent or remove fouling of the at least one channel. 
     
     
         31 . The apparatus of  claim 27 , further comprising active electronics integrated with the substrate, the active electronics configured to detect fouling by measuring an output impedance of the apparatus. 
     
     
         32 . The apparatus of  claim 27 , wherein the at least one channel comprises one or more lateral channels and one or more vertical channels, the vertical channels configured to allow the solution to flow through one or more layers of the substrate. 
     
     
         33 . The apparatus of  claim 27 , wherein the substrate comprises a temperature sensor, the temperature sensor comprising two or more structures, each of the two or more structures configured to measure a material property in response to temperature such that a ratio of the material property of each of the two or more structures is related to temperature. 
     
     
         34 . An apparatus for sensing a concentration of a material, the apparatus comprising:
 an integrated semiconductor substrate;   a plurality of sensing elements in communication with the integrated semiconductor substrate and configured to detect a measurable electrical response when in contact with a solution;   one or more channels configured to guide the solution to the plurality of sensing elements;   one or more conditioning elements in communication with the one or more channels and configured to control fluid flow within the one or more channels;   electronics in communication with the integrated semiconductor substrate and configured to wirelessly communicate the concentration of an ion within the solution as sensed by the plurality of sensing elements; and   processing electronics integrated with the semiconductor substrate and configured to encrypt sensor data from the apparatus.   
     
     
         35 . The apparatus of  claim 34 , wherein the one or more conditioning elements comprises a piezoelectric material, the piezoelectric material configured to cause vibration in the one or more channels to prevent fouling of the one or more channels. 
     
     
         36 . The apparatus of  claim 34 , wherein the one or more conditioning elements comprises a thermal element configured to heat or cool a surrounding environment. 
     
     
         37 . The apparatus of  claim 36 , wherein the thermal element is configured to selectively rupture a membrane of each of the plurality of sensing elements to expose each of the plurality of sensing elements to the solution. 
     
     
         38 . The apparatus of  claim 36 , further comprising computer-readable media having higher-level language code operable to configure an electronic device to sense a concentration or presence of a material. 
     
     
         39 . An apparatus for sensing a concentration or presence of a material, the apparatus comprising:
 a plurality of sensing elements configured to contact a solution and to detect a measurable electrical response when in contact with the solution;   one or more channels in fluid communication with the external environment and configured to guide the solution to the plurality of sensing elements;   one or more conditioning elements in communication with the one or more channels; and   active electronics in communication with the plurality of sensing elements, wherein the active electronics is configured to,   monitor fouling of the one or more channels;   control fluid flow within the one or more channels; and   activate the one or more conditioning elements to prevent or eliminate fouling of the one or more channels.   
     
     
         40 . The apparatus of  claim 39 , wherein the one or more conditioning elements comprises a piezoelectric material, the piezoelectric material configured to cause vibration in the one or more channels to prevent or remove fouling of the one or more channels. 
     
     
         41 . The apparatus of  claim 39 , wherein the one or more conditioning elements comprises a thermal element configured to heat or cool a surrounding environment. 
     
     
         42 . The apparatus of  claim 39 , further comprising an integrated semiconductor substrate in communication with the plurality of sensing elements. 
     
     
         43 . An apparatus for sensing a concentration of a material, the apparatus comprising:
 an integrated semiconductor substrate;   a plurality of sensing elements in communication with the integrated semiconductor substrate and configured to contact a solution and to detect a measurable electrical response when in contact with the solution; and   decoding circuitry comprising logic configured to,   generate a signal indicative of a state of the plurality of sensing elements; and   selectively expose at least one sensing element of the plurality of sensing elements based on fouling of at least one sensing element of the plurality of sensing elements.   
     
     
         44 . The apparatus of  claim 43 , further comprising:
 one or more channels configured to guide the solution to the plurality of sensing elements; and   one or more conditioning elements in communication with the one or more channels.   
     
     
         45 . The apparatus of  claim 43 , further comprising electronics in communication with the integrated semiconductor substrate and configured to wirelessly communicate the concentration of an ion within the solution as sensed by the plurality of sensing elements. 
     
     
         46 . The apparatus of  claim 43 , processing electronics in communication with the integrated semiconductor substrate and configured to encrypt sensor data from the apparatus.

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