Electronic device including substrate including coating layer

Abstract

An electronic device comprises: a first housing; a second housing; a hinge structure comprising a hinge rotatably connecting the first housing with the second housing; and a substrate including a flexible portion, a rigid portion, and a stepped portion arranged at a boundary between the flexible portion and the rigid portion. The substrate comprises: a first conductive layer arranged in the flexible portion and the rigid portion; a first coating layer arranged on a portion of the first conductive layer corresponding to the rigid portion; a second conductive layer arranged on the first coating layer in the rigid portion; and a second coating layer arranged on the second conductive layer. A portion of the boundary of the first coating layer is aligned in the stepped portion.

What is claimed is: 
     
         1 . An electronic device comprising:
 a first housing;   a second housing;   a hinge structure comprising a hinge rotatably connecting the first housing and the second housing; and   a substrate, extending from an inside of the first housing across the hinge structure to an inside of the second housing, the substrate including:
 a flexible portion, 
 a rigid portion, and 
 a stepped portion disposed at a boundary between the flexible portion and the rigid portion, 
   wherein the substrate includes:
 a first conductive layer disposed in the flexible portion and the rigid portion, 
 a first coating layer disposed on a portion of the first conductive layer corresponding to the rigid portion, 
 a second conductive layer disposed on the first coating layer in the rigid portion, and 
 a second coating layer disposed on the second conductive layer, and 
   wherein a portion of a boundary of the first coating layer is aligned with the stepped portion.   
     
     
         2 . The electronic device of  claim 1 ,
 wherein the rigid portion includes:
 a first rigid portion disposed closer to the first housing of the first housing and the second housing, and 
 a second rigid portion disposed closer to the second housing of the first housing and the second housing. 
   
     
     
         3 . The electronic device of  claim 2 ,
 wherein the flexible portion is disposed between the first rigid portion and the second rigid portion.   
     
     
         4 . The electronic device of  claim 2 ,
 wherein the first coating layer includes:
 a first portion disposed on a first region of the first conductive layer corresponding to the first rigid portion in the first conductive layer, and 
 a second portion disposed on a second region of the first conductive layer corresponding to the second rigid portion in the first conductive layer, and 
   wherein the first portion of the first coating layer and the second portion of the first coating layer are spaced apart each other.   
     
     
         5 . The electronic device of  claim 1 ,
 wherein the substrate includes a non-conductive layer disposed between the first coating layer and the first conductive layer, and   wherein a thickness of the non-conductive layer disposed in the flexible portion corresponds to a thickness of the non-conductive layer disposed in the rigid portion.   
     
     
         6 . The electronic device of  claim 5 ,
 wherein the non-conductive layer is exposed to an outside of the substrate in the flexible portion of the substrate, and is disposed in an inside of the substrate in the rigid portion of the substrate.   
     
     
         7 . The electronic device of  claim 1 ,
 wherein the rigid portion of the substrate includes a conducive via electrically connecting the first conductive layer and the second conductive layer, and   wherein the substrate includes a third conductive layer, disposed between the second coating layer and the second conductive layer, connected to the conductive via.   
     
     
         8 . The electronic device of  claim 7 ,
 wherein the second coating layer includes an opening exposing the third conductive layer.   
     
     
         9 . The electronic device of  claim 8 ,
 wherein the substrate is connected to a first printed circuit board (PCB) in the first housing and a second PCB in the second housing, through the opening.   
     
     
         10 . The electronic device of  claim 1 ,
 wherein a material of the first coating layer is the same material as a material of the second coating layer.   
     
     
         11 . The electronic device of  claim 1 ,
 wherein a material of the first coating layer and a material of the second coating layer comprise a photo solder resist (PSR) ink.   
     
     
         12 . The electronic device of  claim 11 , further comprising:
 a first PCB disposed in the first housing; and   a second PCB disposed in the second housing,   wherein the substrate is connected to the first PCB and the second PCB.   
     
     
         13 . The electronic device of  claim 12 ,
 wherein at least a portion of the substrate is disposed in the hinge structure.   
     
     
         14 . The electronic device of  claim 1 , further comprising a display,
 wherein the first housing includes:
 a first surface facing the display, and 
 a second surface opposite to the first surface, 
   wherein the second housing includes:
 a third surface facing the display, and 
 a fourth surface opposite to the third surface, and 
   wherein the hinge structure is configured to provide an unfolded state of the electronic device in which a direction of the first surface of the first housing corresponds to a direction of the third surface of the second housing, or a folded state of the electronic device in which the first surface of the first housing faces the third surface of the second housing, by rotatably connecting the first housing and the second housing.   
     
     
         15 . The electronic device of  claim 14 ,
 wherein a shape of at least a portion of the flexible portion of the substrate is configured to be deformed based on a state change of the electronic device.   
     
     
         16 . A method of manufacturing of a substrate including:
 disposing a first conductive layer on a dielectric film;   disposing a non-conductive layer on the first conductive layer;   coating a first coating layer on the non-conductive layer;   disposing a rigid portion including a second conductive layer on a portion of the first coating layer;   forming a via hole in the rigid portion and removing a smear of the via hole;   coating a second coating layer on the second conductive layer; and   removing a portion of the first coating layer disposed in a flexible portion different from the rigid portion, in the first coating layer.   
     
     
         17 . The method of  claim 16 , further comprising forming an opening by removing a portion of the second coating layer. 
     
     
         18 . The method of  claim 16 , further comprising disposing a third conductive layer, between the second coating layer and the second conductive layer, and extending to the via hole. 
     
     
         19 . The method of  claim 16 ,
 wherein a material of the first coating layer is the same material as a material of the second coating layer.   
     
     
         20 . The method of  claim 16 ,
 wherein a material of the first coating layer and a material of the second coating layer comprise a photo solder resist (PSR) ink.