Pad conditioning disk with compressible circumferential layer

Abstract

Pad conditioning disks are described. In particular, pad conditioning disks includes discrete abrasive elements and a circumferential compressible layer are described. When uncompressed, the maximum height of the circumferential compressible layer is greater than the maximum height of the discrete abrasive elements, which may provide more even wafer removal rates for in-situ polishing processes.

What is claimed is: 
     
         1 . A pad conditioning disk, comprising:
 a substantially circular carrier layer;   at least one discrete abrasive element disposed nearer to an edge than a center of the carrier layer;   at least one circumferential compressible layer at least partially surrounding the at least one discrete abrasive element;   wherein the at least one discrete abrasive element has a maximum height h 1  above the carrier layer;   wherein the at least one circumferential compressible layer has a maximum height h 2  above the carrier layer; and   wherein, when uncompressed, h 2 >h 1 .   
     
     
         2 . The pad conditioning disk of  claim 1 , wherein the at least one circumferential compressible layer covers at least 300 degrees of arc of the substantially circular carrier layer at at least one radius r. 
     
     
         3 . The pad conditioning disk of  claim 1 , wherein the at least one circumferential compressible layer covers 360 degrees of the substantially circular carrier layer at at least one radius r. 
     
     
         4 . The pad conditioning disk of  claim 1 , wherein the at least one circumferential compressible layer defines at least one channel from the center of the carrier layer to the edge of the carrier layer wherein the height is less than h 2 . 
     
     
         5 . The pad conditioning disk of  claim 4 , wherein the at least one circumferential compressible layer defines at least one channel from the center of the carrier layer to the edge of the carrier layer wherein the height is less than h 1 . 
     
     
         6 . The pad conditioning disk of  claim 4 , wherein the at least one channel is straight. 
     
     
         7 . The pad conditioning disk of  claim 4 , wherein the at least one channel is curved. 
     
     
         8 . The pad conditioning disk of  claim 1 , wherein the at least one circumferential compressible layer includes a foam layer. 
     
     
         9 . The pad conditioning disk of  claim 8 , wherein the at least one circumferential compressible layer includes a top layer. 
     
     
         10 . The pad conditioning disk of  claim 9 , wherein the top layer includes one or more of nylon, polyetheretherketone, polycarbonate, polystyrene, or polyphenylene sulfide. 
     
     
         11 . The pad conditioning disk of  claim 1 , wherein the at least one circumferential compressible layer includes a spring mechanism.