Method of adjusting plating module

Abstract

There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.

What is claimed: 
     
         1 . An apparatus for plating, comprising:
 a plating module comprising a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element and being set to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and   a first moving mechanism configured to move the substrate holder and/or the plate.   
     
     
         2 . The apparatus for plating according to  claim 1 , further comprising:
 a paddle placed between the substrate holder and the plate to stir a plating solution, wherein   the first moving mechanism is configured to move the substrate holder and the paddle integrally relative to the plate.   
     
     
         3 . The apparatus for plating according to  claim 1 , further comprising:
 a paddle placed between the substrate holder and the plate to stir a plating solution; and   a second moving mechanism configured to move the paddle to be closer to and away from the substrate holder.   
     
     
         4 . The apparatus for plating according to  claim 1 , further comprising:
 a control module, wherein   the control module controls the first moving mechanism according to a film thickness distribution of the substrate plated in the plating module, so as to adjust the distance between the substrate holder and the plate.   
     
     
         5 . The apparatus for plating according to  claim 2 , further comprising:
 a control module, wherein   the control module controls the first moving mechanism to move the substrate holder and the paddle integrally, while keeping a distance between the substrate holder and the paddle constant.   
     
     
         6 . The apparatus for plating according to  claim 3 , further comprising:
 a control module, wherein   the control module controls the first moving mechanism and the second moving mechanism to move the substrate holder and the paddle, such as to keep a distance between the substrate holder and the paddle constant.   
     
     
         7 . The apparatus for plating according to  claim 1 , further comprising:
 a paddle placed between the substrate holder and the plate to stir a plating solution;   a driving mechanism configured to reciprocate the paddle parallel to the substrate; and   a control module, wherein   the control module controls the driving mechanism to adjust a moving velocity of the paddle, such as to keep constant a flow rate of the plating solution on a surface of the substrate by stirring with the paddle, before and after adjustment of a distance between the substrate holder and the plate.   
     
     
         8 . The apparatus for plating according to  claim 1 , further comprising:
 a paddle placed between the substrate holder and the plate to stir a plating solution;   a second moving mechanism configured to move the paddle to be closer to and away from the substrate holder;   a driving mechanism configured to reciprocate the paddle parallel to the substrate; and   a control module, wherein   the control module controls the second moving mechanism and the driving mechanism to move the paddle and to adjust a motion velocity of the paddle, such as to keep constant a flow rate of the plating solution on a surface of the substrate by stirring with the paddle, before and after adjustment of a distance between the substrate holder and the plate.