Display panel and display module
Abstract
The present disclosure relates to a display panel including a flexible substrate, where the flexible substrate includes a first side and a second side opposite to each other, an OLED device is arranged on the first side of the flexible substrate, and a heat dissipation functional film layer is directly attached to the flexible substrate at The second side, or, a thermal conductive film layer and a heat dissipation functional film layer are sequentially arranged on the flexible substrate at the second side in a direction away from the flexible substrate, and the thermal conductive film layer includes at least one sub-thermal conductive film layer arranged in a laminated manner. The present disclosure further relates to a display module.
Claims
exact text as granted — not AI-modified1 . A display panel comprising a flexible substrate, wherein the flexible substrate comprises a first side and a second side opposite to each other, an OLED device is arranged on the first side of the flexible substrate, and a heat dissipation functional film layer is directly attached to the flexible substrate at the second side, or, a thermal conductive film layer and a heat dissipation functional film layer are sequentially arranged on the flexible substrate at the second side in a direction away from the flexible substrate, and the thermal conductive film layer comprises at least one sub-thermal conductive film layer arranged in a laminated manner.
2 . The display panel according to claim 1 , wherein the heat dissipation functional film layer comprises a high thermal conductivity adhesive made of one or more of acrylic resin, a silicon-based material, a thermal conductive silicone grease, or a liquid metal.
3 . The display panel according to claim 2 , wherein the heat dissipation functional film layer further comprises a metal layer on a side of the high thermal conductivity adhesive away from the flexible substrate.
4 . The display panel according to claim 1 , wherein the heat dissipation functional film layer comprises one or more layer films made of Al, Cu, a graphite sheet or Nano copper-carbon.
5 . The display panel according to claim 1 , wherein the thermal conductive film layer comprises one or two film layers of a bottom film layer, an embossed tape layer, or a buffer layer.
6 . The display panel according to claim 5 , wherein the thermal conductive film layer comprises the bottom film layer and/or the embossed tape layer arranged in a laminated manner, and the buffer layer is arranged on a side of the heat dissipation functional film layer away from the flexible substrate.
7 . The display panel according to claim 1 , wherein a heat insulating layer is arranged on a side of the heat dissipation functional film layer away from the flexible substrate.
8 . The display panel according to claim 1 , wherein the heat dissipation functional film layer comprises a vapor chamber.
9 . The display panel according to claim 8 , wherein a plurality of cooling columns is arranged on a side of the vapor chamber away from the flexible substrate.
10 . The display panel according to claim 9 , wherein the display panel comprises a flexible printed circuit board electrically connected via a chip on film, the flexible printed circuit board is bent to the side of the vapor chamber away from the flexible substrate, an orthographic projection of the flexible printed circuit board onto the vapor chamber is located in a first region, and the cooling columns are located in a second region on the vapor chamber adjacent to the first region.
11 . The display panel according to claim 10 , wherein heights of the cooling columns in a direction perpendicular to the flexible substrate sequentially increase in a direction from the second region to the first region.
12 . The display panel according to claim 9 , wherein a sectional area of at least one cooling column in a direction parallel to the flexible substrate gradually decreases in a direction away from the flexible substrate.
13 . The display panel according to claim 10 , wherein a distribution density of the cooling columns sequentially increases in a direction from the second region to the first region.
14 . The display panel according to claim 10 , wherein the flexible substrate is a curved surface structure that is at least bent in a first direction, and along the first direction, a distribution density of the cooling columns gradually increases from both ends of the vapor chamber to the middle of the vapor chamber.
15 . The display panel according to claim 14 , wherein an area of orthographic projections of the cooling columns at a middle region of the vapor chamber onto the vapor chamber is a first area, an area of orthographic projections of the cooling columns at an edge region of the vapor chamber onto the vapor chamber is a second area, and the first area is greater than the second area.
16 . The display panel according to claim 10 , wherein the flexible printed circuit board is connected to the vapor chamber by a connection element.
17 . The display panel according to claim 16 , wherein at least one cooling column serves as the connection element.
18 . A display module comprising a cover plate, the display panel according to claim 1 , and an optical film layer between the cover plate and the display panel, wherein
a temperature at a first position t 1 on a light-exiting side of the OLED device meets the following formula:
t
1
=
t
∞
+
q
0
R
2
R
1
+
R
2
*
1
h
a temperature at a second position t 2 on a backlight side of the OLED device meets the following formula:
t
2
=
t
∞
+
q
0
R
1
R
1
+
R
2
*
1
h
R
=
∑
xi
λ
i
+
1
h
R1 or R2 is obtained from the following formula:
q 0 is obtained from the following formula: q 0 =p/s
wherein q 0 is a total heat flow density, p is a heat power of the display panel, s is a heat dissipation area of the display panel, R1 is a thermal resistance of the light-exiting side of the OLED device, R2 is a thermal resistance of the backlight side of the OLED device, x is a distance between the first position or the second position and the OLED device, A is a thermal conductivity of each film layer between the first position or the second position and the OLED device, h is an air convective heat transfer coefficient, and t ∞ is an ambient temperature.
19 . The display module according to claim 18 , wherein the heat dissipation functional film layer comprises a vapor chamber.
20 . The display module according to claim 19 , wherein a plurality of cooling columns is arranged on a side of the vapor chamber away from the flexible substrate.Join the waitlist — get patent alerts
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