Method of manufacturing micro-led display

Abstract

Provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (LEDs) to a plurality of wells of an interposer through a fluidic self assembly (FSA) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro LEDs and the plurality of wells, and a fourth operation of transferring the plurality of micro LEDs to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.

What is claimed is: 
     
         1 . A method of manufacturing a display, the method comprising:
 a first operation of transferring a plurality of micro LEDs to a plurality of wells of an interposer through a fluidic self-assembly (FSA) process, the interposer comprising a blister layer in each of the plurality of wells;   a second operation of aligning a driving substrate on the interposer; and   a third operation of transferring the plurality of micro LEDs to the driving substrate by radiating a laser beam to the blister layer.   
     
     
         2 . The method of  claim 1 , wherein the driving substrate comprises a first region to which micro LEDs among the plurality of micro LEDs are transferred and a second region to which a micro LED among the plurality of micro LEDs is not transferred, and
 wherein the first operation, the second operation, and the third operation are performed on a portion of the second region.   
     
     
         3 . The method of  claim 1 , wherein the plurality of wells have a depth of 0.5 to 1.5 times a thickness of one of the plurality of micro LEDs. 
     
     
         4 . The method of  claim 1 , wherein the laser active blister layer is activated and swell in directions away from the interposer when the laser beam is radiated onto the blister layer. 
     
     
         5 . The method of  claim 1 , wherein the third operation further comprises fixing the plurality of micro LEDs to the driving substrate based on at least one of soldering, anisotropic conductive film (ACF), and attachment using a lead wire. 
     
     
         6 . The method of  claim 1 , wherein the second operation further comprises aligning the driving substrate on the interposer based on align markers, and
 wherein the align markers are at least one of separate marks or pixel positions on the interposer and the driving substrate.   
     
     
         7 . The method of  claim 1 , further comprising, after the third operation, cleaning surfaces of the interposer. 
     
     
         8 . The method of  claim 1 , wherein the first operation further comprises:
 supplying a suspension comprising the plurality of micro LEDs to the interposer;   positioning the plurality of micro LEDs at the plurality of wells through at least one of a blade, a roller, or an absorbing member; and   removing the suspension.   
     
     
         9 . The method of  claim 8 , wherein the plurality of micro LEDs are supplied to the interposer based on at least one of a method of spraying the suspension comprising the plurality of micro LEDs onto the interposer, a dispensing method, an inkjet dot method, or a method of flowing the suspension to the interposer. 
     
     
         10 . The method of  claim 8 , wherein the positioning comprises scanning at least one of the blade, the roller, or the absorbing member on the interposer, and
 wherein the scanning is performed through one or a combination of reciprocating motion, translational motion, rotational motion, rolling motion, rubbing motion, and spinning motion of at least one of the blade, the roller, or the absorbing member.   
     
     
         11 . The method of  claim 8 , wherein the suspension comprises one or a combination of a plurality of liquids including water, alcohol, polyol, ketone, halocarbon, acetone, flux, and organic solvents. 
     
     
         12 . The method of  claim 1 , wherein the driving substrate comprises electrode pads electrically connected to the plurality of micro LEDs and thin-film transistors (TFTs) electrically connected to the electrode pads. 
     
     
         13 . The method of  claim 1 , further comprising providing a passivation layer on the driving substrate to which the plurality of micro LEDs are transferred. 
     
     
         14 . The method of  claim 13 , further comprising providing a color conversion layer on the passivation layer. 
     
     
         15 . The method of  claim 1 , the wells each includes a well bottom, a well sidewall, and the blister layer over the well bottom.