Resistor for plating apparatus, and plating apparatus

Abstract

A resistor and the like capable of enhancing uniformity of a plating film formed on a substrate are provided. A resistor for a plating apparatus, for adjusting an electric field, the resistor being disposed between an anode and a holder holding a target object to be plated in the plating apparatus, is provided. The resistor for the plating apparatus includes a first resistance member having a first surface and including a plurality of first through holes formed open on the first surface, and a second resistance member having a second surface and including a plurality of second through holes formed open on the second surface, the first resistance member and the second resistance member are arranged with the first surface and the second surface facing each other, and a size of overlap between the plurality of first through holes and the plurality of second through holes is variable.

1 . A resistor for a plating apparatus, for adjusting an electric field, the resistor being disposed between an anode and a holder holding a target object to be plated in the plating apparatus, the resistor comprising:
 a first resistance member having a first surface and including a plurality of first through holes formed open on the first surface, and   a second resistance member having a second surface and including a plurality of second through holes formed open on the second surface,   wherein the first resistance member and the second resistance member are arranged with the first surface and the second surface facing each other, and a size of overlap between the plurality of first through holes and the plurality of second through holes is variable.   
     
     
         2 . The resistor for the plating apparatus according to  claim 1 , wherein one of the first resistance member and the second resistance member is configured to be movable or rotatable with respect to the other along the first surface or the second surface. 
     
     
         3 . The resistor for the plating apparatus according to  claim 1 , wherein the second resistance member is disposed to cover a part of a side surface of the first resistance member on a side on which the second resistance member is disposed. 
     
     
         4 . The resistor for the plating apparatus according to  claim 3 , wherein third through holes are formed in a third surface of the side surface of the first resistance member, the third surface being not covered with the second resistance member. 
     
     
         5 . The resistor for the plating apparatus according to  claim 4 , wherein in the first resistance member, the first surface is formed on an outer peripheral side of the third surface. 
     
     
         6 . The resistor for the plating apparatus according to  claim 5 , wherein the first resistance member includes a first portion having a first outer diameter and a second portion having a second outer diameter smaller than the first outer diameter, the first surface is formed on the first portion, and the third surface is formed on the second portion. 
     
     
         7 . The resistor for the plating apparatus according to  claim 1 , comprising:
 a plurality of second resistance members arranged to face the first surface of the first resistance member.   
     
     
         8 . A plating apparatus comprising:
 a plating tank,   an anode disposed in the plating tank,   a holder holding a target object to be plated, and   the resistor for the plating apparatus according to  claim 1 .   
     
     
         9 . The plating apparatus according to  claim 8 , further comprising:
 a drive mechanism that moves or rotates one of the first resistance member and the second resistance member with respect to the other.