Chemical mechanical polishing apparatus

Abstract

A chemical mechanical polishing apparatus, including one or more components, where one or more of the components have a surface-treating layer formed using a fluoropolyether group-containing compound.

1 . A chemical mechanical polishing apparatus, comprising one or more components,
 wherein one or more of the components have a surface-treating layer formed using a fluoropolyether group-containing compound.   
     
     
         2 . The chemical mechanical polishing apparatus according to  claim 1 , wherein the fluoropolyether group-containing compound comprises a fluoropolyether group-containing silane compound. 
     
     
         3 . The chemical mechanical polishing apparatus according to  claim 2 , wherein the fluoropolyether group-containing silane compound comprises at least one fluoropolyether group-containing silane compound represented by the following formula (1) or (2):
   R F1   α —X A —R Si   β   (1)
     R Si   γ —X A —R F2 —X A —R Si   γ   (2)
   
       wherein
 R F1  is each independently at each occurrence Rf 1 —R F —O q —; 
 R F2  is —Rf 2   p —R F —O q —; 
 Rf 1  is each independently at each occurrence a C 1-16  alkyl group optionally substituted with one or more fluorine atoms; 
 Rf 2  is a C 1-6  alkylene group optionally substituted with one or more fluorine atoms; 
 R F  is each independently at each occurrence a divalent fluoropolyether group; 
 p is 0 or 1; 
 q is each independently at each occurrence 0 or 1; 
 R Si  is each independently at each occurrence a monovalent group containing a Si atom to which a hydroxy group, a hydrolyzable group, a hydrogen atom or a monovalent organic group is bonded; 
 at least one R Si  is a monovalent group containing a Si atom to which a hydroxy group or a hydrolyzable group is bonded; 
 X A  is each independently a single bond or a di- to decavalent organic group; 
 α is an integer of 1 to 9; 
 β is an integer of 1 to 9; and 
 γ is each independently an integer of 1 to 9. 
 
     
     
         4 . The chemical mechanical polishing apparatus according to  claim 1 , wherein a thickness of the surface-treating layer is 1 nm or more and 20 nm or less. 
     
     
         5 . The chemical mechanical polishing apparatus according to  claim 1 ,
 wherein the chemical mechanical polishing apparatus comprises a surface plate, a rotating shaft connected to the surface plate, a polishing pad disposed on the surface plate, a polishing head disposed on the polishing pad, an arm part of the polishing head to fix the polishing head, a polishing slurry supply part, an arm part of the polishing slurry supply part to fix the polishing slurry supply part, a polishing part cover, and a discharge groove, and   wherein one or more selected from the group consisting of the surface plate, the polishing head, and the polishing slurry supply part have a surface-treating layer.   
     
     
         6 . The chemical mechanical polishing apparatus according to  claim 1 ,
 wherein the chemical mechanical polishing apparatus comprises a surface plate, a rotating shaft connected to the surface plate, a polishing pad disposed on the surface plate, a polishing head disposed on the polishing pad, an arm part of the polishing head to fix the polishing head, a polishing slurry supply part, an arm part of the polishing slurry supply part to fix the polishing slurry supply part, a polishing part cover, a discharge groove, a conditioner disc disposed on the polishing pad, and an arm part of the conditioner disc to fix the conditioner disc, and   wherein one or more selected from the group consisting of the surface plate, the rotating shaft, the polishing head, the arm part of the polishing head, the polishing slurry supply part, the arm part of the polishing slurry supply part, the polishing part cover, the discharge groove, and the arm part of the conditioner disc have a surface-treating layer.   
     
     
         7 . A method for treating a chemical mechanical polishing apparatus, the method comprising applying a surface-treating agent to a surface of one or more components of the chemical mechanical polishing apparatus to form a surface-treating layer, wherein the surface-treating agent comprises a fluoropolyether group-containing compound. 
     
     
         8 . A surface-treating agent, comprising a fluoropolyether group-containing compound,
 wherein the surface-treating agent is used to form a surface-treating layer by being applied to a surface of one or more components comprised in the chemical mechanical polishing apparatus.