US2025010425A1PendingUtilityA1
Polishing device, polishing method, and machine part
Est. expiryMar 31, 2042(~15.7 yrs left)· nominal 20-yr term from priority
B24B 1/00B24B 27/0076B24B 19/03B24B 29/005B24B 41/04B24B 9/065B24B 47/12B24B 19/02B24B 29/00B24B 37/042
67
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A polishing device according to an embodiment comprises: a supporting unit for supporting a polishing tool, a stage for holding an object to be polished; a first drive unit for causing the support unit and the stage to move relative to one another along a shape of a polishing surface of the object to be polished, and a second drive unit for causing the support unit to control synchronously with the first drive unit such that one predetermined end of a polishing member attached to the polishing tool faces in a movement direction of the polishing member.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A polishing device comprising:
a supporting unit supporting a polishing tool; a stage holding an object to be polished; a first drive unit moving the supporting unit and the stage relative to each other along a shape of a polished surface of the object to be polished; and a second drive unit synchronized with the first drive unit and controlling the supporting unit so that one predetermined end of a polishing member attached to the polishing tool faces in a movement direction of the polishing member.
2 . The polishing device according to claim 1 , wherein the first drive unit moves the supporting unit and the stage relative to each other in a non-circular pattern along the shape of the polishing surface.
3 . The polishing device according to claim 1 , further comprising a jig holding the polishing member, wherein:
the polishing member includes a first polishing member and a second polishing member different from the first polishing member; the jig presses the first polishing member with a first pressing strength in a first step using the first polishing member, and presses the second polishing member with a second pressing strength in a second step using the second polishing member; and the first pressing strength is lower than the second pressing strength.
4 . The polishing device according to claim 3 , wherein the first polishing member is a brush, and the second polishing member is a sponge.
5 . A polishing method for a polishing surface on a hard anodized aluminum, the polishing method comprising:
a first step of polishing the polishing surface with a first polishing member at a first pressing strength; and a second step of polishing the polishing surface with a second polishing member at a second pressing strength after the first step, wherein the first pressing strength is lower than the second pressing strength.
6 . The polishing method for the polishing surface on the hard anodized aluminum according to claim 5 , wherein the second step comprises:
pressing the second polishing member onto the polishing surface and moving the second polishing member and the polishing surface relative to each other; and controlling the second polishing member so that one end of the second polishing member faces in a movement direction of the second polishing member.
7 . The polishing method for the polishing surface on the hard anodized aluminum according to claim 5 , wherein the first polishing member is a brush, and the second polishing member is a sponge.
8 . The polishing method for the polishing surface on the hard anodized aluminum according to claim 5 , wherein
the first polishing member and the second polishing member are held by a jig, and the jig includes a first spring that presses the first polishing member in the first step and a second spring that presses the second polishing member in the second step, the first pressing strength and the second pressing strength are controlled by a spring constant of the first spring and a spring constant of the second spring.
9 . The polishing method for the polishing surface on the hard anodized aluminum according to claim 8 , wherein the spring constant of the first spring and the spring constant of the second spring are different from each other.
10 . The polishing method for the polishing surface on the hard anodized aluminum according to claim 9 , wherein the spring constant of the second spring is greater than the spring constant of the first spring.
11 . The polishing method for the polishing surface on the hard anodized aluminum according to claim 10 , further comprising, after the first step and before the second step, replacing the first spring in the jig used in the first step with a second spring to be used in the second step.
12 . A machine part comprising:
a hard anodized aluminum surface; and a polishing surface on a part of the hard anodized aluminum surface, wherein a waviness of the polishing surface is 0.2 μm or less and a surface roughness of the polishing surface is 0.4 μm or less.
13 . The machine part according to claim 12 , wherein a standard deviation of the waviness of the polishing surface is 0.2 μm or less, and a standard deviation of the surface roughness is 0.3 μm or less.
14 . The machine part according to claim 12 , wherein the waviness of the polishing surface is 0.1 μm or less.Join the waitlist — get patent alerts
Track US2025010425A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.