Power module structure

Abstract

A power module structure is provided. The power module structure includes a substrate, a chip, a first metal structure, a second metal structure and a packaging material. The chip, the first metal structure and the second metal structure are disposed on the substrate. From a cross-sectional view, the width of the first metal structure is greater than the width of the second metal structure. The packaging material covers the substrate and the chip, and the portions of the first metal structure and the second metal structure are exposed from the upper surface of the packaging material.

What is claimed is: 
     
         1 . A power module structure, comprising:
 a substrate;   a chip disposed on the substrate;   a first metal structure disposed on the substrate;   a second metal structure disposed on the substrate, wherein, from a cross-sectional view, the first metal structure has a larger width than that of the second metal structure; and   a packaging material covering the substrate and the chip, wherein portions of the first metal structure and the second metal structure are exposed from an upper surface of the packaging material.   
     
     
         2 . The power module structure as claimed in  claim 1 , wherein the substrate comprises aluminum oxide. 
     
     
         3 . The power module structure as claimed in  claim 1 , wherein the chip comprises a power component. 
     
     
         4 . The power module structure as claimed in  claim 1 , wherein the first metal structure and the second metal structure comprise copper, silver or aluminum. 
     
     
         5 . The power module structure as claimed in  claim 1 , wherein upper surfaces of the first metal structure and the second metal structure are on the same plane as the upper surface of the packaging material. 
     
     
         6 . The power module structure as claimed in  claim 1 , wherein upper surfaces of the first metal structure and the second metal structure are higher than the upper surface of the packaging material. 
     
     
         7 . The power module structure as claimed in  claim 1 , wherein upper surfaces of the first metal structure and the second metal structure are lower than the upper surface of the packaging material. 
     
     
         8 . The power module structure as claimed in  claim 1 , further comprising another first metal structure disposed on the substrate, wherein a portion of the other first metal structure is exposed from the upper surface of the packaging material. 
     
     
         9 . The power module structure as claimed in  claim 8 , wherein, from a top view, the first metal structure and the other first metal structure have different areas. 
     
     
         10 . The power module structure as claimed in  claim 8 , wherein, from a top view, the first metal structure and the other first metal structure have different shapes. 
     
     
         11 . The power module structure as claimed in  claim 10 , wherein, from a top view, the first metal structure and the other first metal structure comprise a rectangle, a triangle or a circle in shape. 
     
     
         12 . The power module structure as claimed in  claim 1 , wherein, from a cross-sectional view, the first metal structure comprises a rectangle or an irregular shape. 
     
     
         13 . The power module structure as claimed in  claim 1 , wherein the first metal structure further comprises a through hole.