US2024429108A1PendingUtilityA1

Joined body, method of manufacturing joined body, and method of evaluating organic residues of joined body

Assignee: MITSUBISHI MATERIALS CORPPriority: Sep 9, 2021Filed: Sep 2, 2022Published: Dec 26, 2024
Est. expirySep 9, 2041(~15.1 yrs left)· nominal 20-yr term from priority
H10W 90/734H10W 72/07336H10W 72/071H10P 74/203B23K 35/262B23K 31/125B23K 1/0016B23K 35/3013B23K 35/0244C22C 5/02C22C 13/00B23K 2101/40H05K 2203/0285H05K 2203/107H05K 3/4644G01N 21/33H05K 3/363H01L 2224/83801H01L 2224/32225H01L 24/83H01L 24/32H01L 22/12H05K 3/3465
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Claims

Abstract

What is provided is a joined body in which a first member and a second member are joined through a solder layer therebetween, in which the joined body is dipped in isopropanol to extract organic residues contained in the joined body, a UV absorption spectrum of an extract having the extracted organic residues is measured, the obtained UV absorption spectrum is normalized with the absorbance set to 100 at a wavelength of 207 nm, and the absorbance at a wavelength of 300 nm obtained from the normalized UV absorption spectrum is 4 or less.

Claims

exact text as granted — not AI-modified
1 . A joined body in which a first member and a second member are joined through a solder layer therebetween,
 wherein the joined body is dipped in isopropanol to extract organic residues contained in the joined body, a UV absorption spectrum of an extract having the extracted organic residues is measured, the obtained UV absorption spectrum is normalized with an absorbance set to 100 at a wavelength of 207 nm, and an absorbance at a wavelength of 300 nm obtained from the normalized UV absorption spectrum is 4 or less.   
     
     
         2 . A method of manufacturing a joined body in which a first member and a second member are joined through a solder layer therebetween, the method comprising:
 a laminating step of laminating the first member and the second member through the solder material therebetween;   a bonding step of heating and solder-bonding the first member and the second member laminated through the solder material therebetween;   an ultrasonic cleaning step of subjecting the first member and the second member joined together to ultrasonic cleaning; and   an ultraviolet irradiation step of applying ultraviolet rays after the ultrasonic cleaning step,   wherein the joined body is dipped in isopropanol to extract organic residues contained in the joined body, a UV absorption spectrum of an extract having the extracted organic residues is measured, the obtained UV absorption spectrum is normalized with an absorbance set to 100 at a wavelength of 207 nm, and an absorbance at a wavelength of 300 nm obtained from the normalized UV absorption spectrum is adjusted to 4 or less.   
     
     
         3 . A method of evaluating organic residues of a joined body in which a first member and a second member are joined through a solder layer therebetween, the method comprising:
 an extraction step of dipping the joined body in isopropanol to extract the organic residues of the joined body;   a UV absorption spectrum measurement step of measuring a UV absorption spectrum of an extract having the extracted organic residues;   a normalization step of normalizing the obtained UV absorption spectrum with an absorbance set to 100 at a wavelength of 207 nm;   an absorbance calculation step of calculating an absorbance at a wavelength of 300 nm from the normalized UV absorption spectrum; and   an evaluation step of evaluating an organic residue amount of the joined body from the calculated absorbance.

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