Heat spreader with vapor chambers and manufacturing method thereof

Abstract

The present disclosure provides a heat spreader with vapor chambers and a manufacturing method thereof. The heat spreader with vapor chambers includes a first cover plate, a second cover plate being arranged to fit with the first cover plate to form an enclosed inner cavity, and a capillary structure arranged in the enclosed inner cavity. The first cover plate includes a first top wall extending perpendicular to the first direction and a first lateral wall extending along the first direction, the second cover plate includes a second top wall extending perpendicular to the first direction and a second lateral wall extending along the first direction, the first top wall, the first lateral wall, the second top wall and the second lateral wall form the enclosed inner cavity filled with cooling medium. The capillary structure is spaced from the first lateral wall and the second lateral wall to form vapor channels.

What is claimed is: 
     
         1 . A heat spreader with vapor chambers, comprising:
 a first cover plate being close to a heat source;   a second cover plate being arranged to be opposite to the first cover plate and fit with the first cover plate to form an enclosed inner cavity; and   a capillary structure arranged in the enclosed inner cavity;   wherein the heat spreader with vapor chambers has a first direction directing from the first cover plate to the second cover plate and a second direction perpendicular to the first direction;   wherein the first cover plate includes a first top wall extending perpendicular to the first direction and a first lateral wall extending from the first top wall towards the second cover plate along the first direction, the second cover plate includes a second top wall extending perpendicular to the first direction and a second lateral wall extending from the second top wall towards the first cover plate along the first direction, the first top wall, the first lateral wall, the second top wall and the second lateral wall fit with each other to form the enclosed inner cavity, and the enclosed inner cavity is filled with cooling medium; and   wherein the capillary structure is spaced from the first lateral wall and the second lateral wall to form vapor channels.   
     
     
         2 . The heat spreader with vapor chambers according to  claim 1 , wherein the capillary structure is arranged to contact with the first top wall and the second top wall along the first direction. 
     
     
         3 . The heat spreader with vapor chambers according to  claim 2 , wherein a distance between the capillary structure and the first lateral wall and a distance between the capillary structure and the second lateral wall increase along the first direction. 
     
     
         4 . The heat spreader with vapor chambers according to  claim 1 , wherein the capillary structure has a plurality of cubic through-hole structures, and a diameter of one respective cubic through-hole structure ranges from 80 μm to 300 μm. 
     
     
         5 . The heat spreader with vapor chambers according to  claim 4 , wherein porosity of the capillary structure ranges from 90% to 97%. 
     
     
         6 . The heat spreader with vapor chambers according to  claim 1 , wherein the capillary structure is made of high-porosity foam copper, nickel or titanium alloy. 
     
     
         7 . The heat spreader with vapor chambers according to  claim 1 , wherein the first cover plate and the second cover plate are made of one of copper, stainless steel, or titanium alloy. 
     
     
         8 . A method for manufacturing the heat spreader with vapor chambers according to  claim 1 , comprising:
 a cover plate obtaining operation, including manufacturing the first cover plate and the second cover plate by etching or stamping;   a capillary structure obtaining operation, including forming the capillary structure on a side of the first top wall of the first cover plate facing towards the second cover plate;   a cover plate fixing operation, including arranging the second cover plate on the first cover plate and fixing the first cover plate and the second cover plate to form the enclosed inner cavity and to obtain an intermediate component;   a stress removal operation, including performing high-temperature treatment on the intermediate component to remove stress; and   a cooling medium filling operation, including vacuumizing the enclosed inner cavity and injecting the cooling medium.