Polishing head and polishing system

Abstract

A polishing head capable of accurately controlling a thickness profile of a wafer is disclosed. The polishing head includes a plurality of pressure actuators, an actuator operation controller, an actuator support portion, and an clastic holder. The actuator operation controller is mounted on a head main body.

What is claimed is: 
     
         1 . A polishing head, comprising:
 a plurality of pressure actuators configured to independently press a specific portion of a substrate;   an actuator operation controller configured to control an operation of each of the pressure actuators, the actuator operation controller being mounted on a head main body;   the head main body comprising an actuator support portion configured to support the pressure actuators; and   an elastic holder configured to hold the actuator support portion.   
     
     
         2 . The polishing head according to  claim 1 , wherein the pressure actuators are arranged along a radial direction and a circumferential direction of the actuator support portion. 
     
     
         3 . The polishing head according to  claim 1 , wherein the elastic holder comprises a bag-shaped airbag. 
     
     
         4 . The polishing head according to  claim 3 , wherein the airbag comprises a plurality of pressurized chambers arranged concentrically. 
     
     
         5 . The polishing head according to  claim 1 , wherein the elastic holder comprises an elastic sheet fixed to the head main body. 
     
     
         6 . The polishing head according to  claim 1 , wherein the polishing head comprises a linear guide member configured to restrict a movement direction of the actuator support portion to a direction along a pressing direction of the pressing actuator. 
     
     
         7 . The polishing head according to  claim 1 , wherein the actuator operation controller is mounted on the actuator support portion. 
     
     
         8 . The polishing head according to  claim 1 , wherein the actuator operation controller is mounted on a flange portion of the head main body. 
     
     
         9 . The polishing head according to  claim 1 , wherein the head main body has a space formed between the elastic holder and a flange portion of the head main body, and
 wherein the actuator operation controller is arranged in the space.   
     
     
         10 . A polishing head, comprising:
 a plurality of pressure actuators configured to independently press a specific portion of a substrate;   a head main body comprising an actuator support portion configured to support the pressure actuators;   an elastic holder configured to hold the actuator support portion; and   an elastic cover configured to cover the pressure actuators.   
     
     
         11 . The polishing head according to  claim 10 , wherein the elastic cover is configured to form a suction space of the elastic cover between the pressure actuators adjacent to each other among the pressure actuators by forming a vacuum inside the elastic cover, thereby adsorbing the substrate. 
     
     
         12 . The polishing head according to  claim 10 , wherein the pressure actuators are arranged along a radial direction and a circumferential direction of the actuator support portion. 
     
     
         13 . The polishing head according to  claim 10 , wherein the elastic holder comprises a bag-shaped airbag. 
     
     
         14 . The polishing head according to  claim 13 , wherein the airbag comprises a plurality of pressurized chambers arranged concentrically. 
     
     
         15 . The polishing head according to  claim 10 , wherein the elastic holder comprises an elastic sheet fixed to the head main body. 
     
     
         16 . The polishing head according to  claim 10 , wherein the polishing head comprises a linear guide member configured to restrict a movement direction of the actuator support portion to a direction along a pressing direction of the pressing actuator. 
     
     
         17 . The polishing head according to  claim 10 , wherein the polishing head comprises an actuator operation controller configured to control an operation of each of the pressure actuators, and
 wherein the actuator operation controller is mounted on the head main body.   
     
     
         18 . A polishing system, comprising:
 forming a suction space of an elastic cover between pressure actuators adjacent to each other among the pressure actuators by forming a vacuum inside the elastic cover covering the pressure actuators, thereby adsorbing a substrate, the pressure actuators being configured to independently press a specific portion of the substrate;   transporting the substrate above a polishing surface of a polishing pad while the substrate is adsorbed;   supplying a pressurized fluid to an elastic holder, the elastic holder holding an actuator support portion supporting the pressure actuators, to bring the pressure actuators together with the actuator support portion into close proximity to the polishing surface; and   operating at least one of the pressure actuators through an actuator operation controller mounted on the actuator support portion to press the substrate against the polishing surface.