Circuit module

Abstract

A circuit module of the present disclosure includes a first circuit board, a second circuit board, a first electronic component, and one or more first solder balls. The first circuit board includes a first positive main surface and a first negative main surface. The first electronic component includes a third positive main surface and a third negative main surface. The one or more first solder balls have an ellipsoidal shape. The one or more first solder balls are located in an inter-board region between the first circuit board and the second circuit board. The first solder ball electrically connects the first circuit board and the second circuit board. The third positive main surface of the first electronic component is in contact with the first negative main surface of the first circuit board.

1 . A circuit module comprising:
 a first circuit board including a first positive main surface and a first negative main surface arranged in a Z-axis direction, the first positive main surface being located in a positive direction of a Z-axis with respect to the first negative main surface;   a second circuit board including a second positive main surface and a second negative main surface arranged in the Z-axis direction, the second circuit board being located in a negative direction of the Z-axis with respect to the first circuit board and overlapping the first circuit board when viewed in the Z-axis direction, the second positive main surface being located in the positive direction of the Z-axis with respect to the second negative main surface;   a first electronic component mounted on the second positive main surface, the first electronic component including a third positive main surface and a third negative main surface arranged in the Z-axis direction, the third positive main surface being located in the positive direction of the Z-axis with respect to the third negative main surface; and   one or more first solder balls each having an ellipsoidal shape, the one or more first solder balls being located in an inter-board region between the first circuit board and the second circuit board and electrically connecting the first circuit board and the second circuit board,   wherein the circuit module has a structure of (A) or (B):   (A) the third positive main surface of the first electronic component is in contact with the first negative main surface of the first circuit board,   (B) the circuit module further comprising a second electronic component mounted on the first negative main surface, the second electronic component including a fourth positive main surface and a fourth negative main surface arranged in the Z-axis direction, the fourth positive main surface being located in the positive direction of the Z-axis with respect to the fourth negative main surface,   wherein the third positive main surface of the first electronic component is in contact with the fourth negative main surface of the second electronic component.   
     
     
         2 . The circuit module according to  claim 1 , further comprising a first sealing resin provided in the inter-board region so as to be in contact with the first negative main surface and the second positive main surface and cover surfaces of the one or more first solder balls. 
     
     
         3 . The circuit module according to  claim 2 ,
 wherein the circuit module further includes:   a second sealing resin covering the first positive main surface; and   a shield conductor covering a positive main surface of the second sealing resin, a side surface of the second sealing resin located in a direction orthogonal to the Z-axis direction, a side surface of the first circuit board located in the direction orthogonal to the Z-axis direction, a side surface of the first sealing resin located in the direction orthogonal to the Z-axis direction, and a side surface of the second circuit board located in the direction orthogonal to the Z-axis direction.   
     
     
         4 . The circuit module according to  claim 3 , wherein at least one of the one or more first solder balls is in contact with the shield conductor. 
     
     
         5 . The circuit module according to  claim 1 ,
 wherein the circuit module further includes one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board, and   wherein a size of the one or more first solder balls is larger than a size of the one or more second solder balls.   
     
     
         6 . The circuit module according to  claim 1 ,
 wherein the circuit module further includes:   one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board; and   a third sealing resin covering the second negative main surface, wherein the one or more second solder balls each have a bottom surface being a plane orthogonal to the Z-axis direction, and   wherein the bottom surface of the one or more second solder balls is included in one plane together with a negative main surface of the third sealing resin.   
     
     
         7 . The circuit module according to  claim 2 ,
 wherein the circuit module further includes:   a second sealing resin covering the second negative main surface; and   a shield conductor covering a negative main surface of the second sealing resin, a side surface of the second sealing resin located in a direction orthogonal to the Z-axis direction, a side surface of the first circuit board located in the direction orthogonal to the Z-axis direction, a side surface of the first sealing resin located in the direction orthogonal to the Z-axis direction, and a side surface of the second circuit board located in the direction orthogonal to the Z-axis direction.   
     
     
         8 . The circuit module according to  claim 7 , wherein at least one of the one or more first solder balls is in contact with the shield conductor. 
     
     
         9 . The circuit module according to  claim 1 ,
 wherein the circuit module further includes one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the first positive main surface of the first circuit board, and   wherein a size of the one or more first solder balls is larger than a size of the one or more second solder balls.   
     
     
         10 . The circuit module according to  claim 1 ,
 wherein the circuit module includes:   one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the first positive main surface of the first circuit board; and   a third sealing resin covering the first positive main surface,   wherein the one or more second solder balls each have a bottom surface being a plane orthogonal to the Z-axis direction, and   wherein the bottom surface of the one or more second solder balls is included in one plane together with a positive main surface of the third sealing resin.   
     
     
         11 . The circuit module according to  claim 1 ,
 wherein the circuit module further includes one or more third solder balls each having an ellipsoidal shape, located in the inter-board region between the first circuit board and the second circuit board, and electrically connecting the first circuit board and the second circuit board,   wherein the one or more first solder balls are in contact with a mounting electrode of the second circuit board,   wherein the one or more third solder balls are in contact with a mounting electrode of the first circuit board,   wherein the one or more first solder balls and the one or more third solder balls are arranged in the Z-axis direction and are in contact with each other, and   wherein a contact portion where the one or more first solder balls and the one or more third solder balls are in contact with each other is surrounded by an outer edge of the one or more first solder balls and an outer edge of the one or more third solder balls when viewed in the Z-axis direction.   
     
     
         12 . The circuit module according to  claim 2 ,
 wherein the circuit module further includes one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board, and   wherein a size of the one or more first solder balls is larger than a size of the one or more second solder balls.   
     
     
         13 . The circuit module according to  claim 3 ,
 wherein the circuit module further includes one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board, and   wherein a size of the one or more first solder balls is larger than a size of the one or more second solder balls.   
     
     
         14 . The circuit module according to  claim 4 ,
 wherein the circuit module further includes one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board, and   wherein a size of the one or more first solder balls is larger than a size of the one or more second solder balls.   
     
     
         15 . The circuit module according to  claim 2 ,
 wherein the circuit module further includes:   one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board; and   a third sealing resin covering the second negative main surface, wherein the one or more second solder balls each have a bottom surface being a plane orthogonal to the Z-axis direction, and   wherein the bottom surface of the one or more second solder balls is included in one plane together with a negative main surface of the third sealing resin.   
     
     
         16 . The circuit module according to  claim 3 ,
 wherein the circuit module further includes:   one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board; and   a third sealing resin covering the second negative main surface, wherein the one or more second solder balls each have a bottom surface being a plane orthogonal to the Z-axis direction, and   wherein the bottom surface of the one or more second solder balls is included in one plane together with a negative main surface of the third sealing resin.   
     
     
         17 . The circuit module according to  claim 4 ,
 wherein the circuit module further includes:   one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board; and   a third sealing resin covering the second negative main surface, wherein the one or more second solder balls each have a bottom surface being a plane orthogonal to the Z-axis direction, and   wherein the bottom surface of the one or more second solder balls is included in one plane together with a negative main surface of the third sealing resin.   
     
     
         18 . The circuit module according to  claim 5 ,
 wherein the circuit module further includes:   one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the second negative main surface of the second circuit board; and   a third sealing resin covering the second negative main surface, wherein the one or more second solder balls each have a bottom surface being a plane orthogonal to the Z-axis direction, and   wherein the bottom surface of the one or more second solder balls is included in one plane together with a negative main surface of the third sealing resin.   
     
     
         19 . The circuit module according to  claim 2 ,
 wherein the circuit module further includes one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the first positive main surface of the first circuit board, and   wherein a size of the one or more first solder balls is larger than a size of the one or more second solder balls.   
     
     
         20 . The circuit module according to  claim 7 ,
 wherein the circuit module further includes one or more second solder balls each having an ellipsoidal shape, the one or more second solder balls being provided on the first positive main surface of the first circuit board, and   wherein a size of the one or more first solder balls is larger than a size of the one or more second solder balls.