Footwear Sensing Systems Formed as a Sockliner or Insole Component

Abstract

Footwear sensor systems and products containing them (e.g., sockliners, footwear uppers, foot support systems, articles of footwear, etc.) may include: (i) a base component having a processor mount region; (ii) a sensor system overlaying at least a portion of the base component, the sensor system including a sensor element and a connector component located adjacent the processor mount region; and (iii) a moderator plate at least partially covering the connector component and including an opening that at least partially overlays the processor mount region. Such footwear sensing systems further may include one or more of: (a) a filler element located between the moderator plate and the sensor system (if needed); (b) a cover member overlaying the base component, sensor system, and moderator plate; (c) a charging component; (d) a processing system located in the processor mount region; and/or (e) one or more other sensors.

What is claimed is: 
     
         1 . A sockliner, comprising:
 a base component including a first major surface and a processor mount region;   a sensor system overlaying at least a portion of the first major surface, the sensor system including a first sensor element, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; and   a moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region.   
     
     
         2 . The sockliner according to  claim 1 , wherein the moderator plate further includes a second opening that aligns with the first sensor element. 
     
     
         3 . The sockliner according to  claim 2 , wherein the first sensor element is a heel sensor. 
     
     
         4 . The sockliner according to  claim 1 , wherein a forwardmost edge of the moderator plate is located in a midfoot region of the sockliner. 
     
     
         5 . The sockliner according to  claim 1 , wherein the first major surface of the base component has a recess defined in it, wherein the sensor system includes a base member on which the first sensor element and the first electrical conductor are mounted, and wherein the base member of the sensor system is received in the recess. 
     
     
         6 . The sockliner according to  claim 5 , further comprising a filler element included in the recess, wherein the filler element extends between the moderator plate and the sensor system. 
     
     
         7 . The sockliner according to  claim 6 , wherein the filler element further covers the first sensor element and the first electrical conductor. 
     
     
         8 . The sockliner according to  claim 1 , further comprising a cover member overlaying the first major surface of the base component, the sensor system, and the moderator plate. 
     
     
         9 . The sockliner according to  claim 1 , wherein the sensor system further includes a charging component. 
     
     
         10 . The sockliner according to  claim 9 , wherein the sensor system includes a base member on which the first sensor element and the first electrical conductor are mounted, wherein at least a portion of the charging component is provided on the base member, wherein a portion of the base member on which at least the portion of the charging component is provided includes an arm that extends beyond a perimeter edge of the base component. 
     
     
         11 . The sockliner according to  claim 1 , wherein the sensor system defines a through hole opening positioned adjacent the connector component and at least partially aligning with the processor mount region and the first opening of the moderator plate. 
     
     
         12 . The sockliner according to  claim 11 , wherein the connector component includes a connector device exposed in the through hole opening of the sensor system and in the first opening of the moderator plate. 
     
     
         13 . The sockliner according to  claim 1 , further comprising a processing system located in the processor mount region and electrically connected to the connector component of the sensor system. 
     
     
         14 . The sockliner according to  claim 13 , wherein the processing system further includes at least one of an accelerometer or gyroscope sensor. 
     
     
         15 . The sockliner according to  claim 13 , wherein the processing system includes an electronic module having a connector that engages with the connector component of the sensing system. 
     
     
         16 . The sockliner according to  claim 15 , wherein the base component includes a second major surface opposite the first major surface, the second major surface providing access to the processor mount region, wherein a surface of the electronic module is exposed at the second major surface of the base component. 
     
     
         17 . The sockliner according to  claim 1 , wherein the sockliner includes a topmost surface and a bottommost surface opposite the topmost surface, and wherein a thickness dimension of the sockliner measured directly from the topmost surface to the bottommost surface through at least 75% of a surface area of the topmost surface is less than 8 mm. 
     
     
         18 . A footwear upper, comprising:
 an upper member including one or more parts forming an interior chamber having a bottom surface; and   a sockliner received in the interior chamber and supported by the bottom surface of the upper member, wherein the sockliner comprises:
 a base component including a first major surface and a processor mount region; 
 a sensor system overlaying at least a portion of the first major surface, the sensor system including a first sensor element, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; and 
 a moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region. 
   
     
     
         19 . An article of footwear, comprising:
 an upper member including one or more parts forming an interior chamber having a bottom component, the bottom component having a top surface and a bottom surface opposite the top surface;   a sole structure engaged with the bottom surface; and   a sockliner received in the interior chamber and supported by the top surface, wherein the sockliner comprises:
 a base component including a first major surface and a processor mount region; 
 a sensor system overlaying at least a portion of the first major surface, the sensor system including a first sensor element, a connector component located adjacent the processor mount region, and a first electrical conductor connecting the first sensor element and the connector component; and 
 a moderator plate partially overlaying the sensor system and the first major surface, the moderator plate at least partially covering the connector component and including a first opening that at least partially overlays the processor mount region. 
   
     
     
         20 . The article of footwear according to  claim 19 , wherein the bottom component of the upper member completely separates the sockliner from the sole structure.