Electronic device, method for manufacturing electronic device, and lead frame

Abstract

An electronic device includes an electronic component provided with a first electrode pad, a die pad including an obverse surface facing in a first direction with the electronic component mounted on the obverse surface, a first lead, a second lead, and a first connection member electrically connecting the first electrode pad and the first lead to each other. The first lead and the second lead are disposed, as viewed in the first direction, on a same side of the die pad in a second direction perpendicular to the first direction. The first lead includes a first pad portion and a first extended portion. The first connection member is bonded to the first pad portion. The first extended portion extends from the first pad portion up to a position located between the die pad and the second lead as viewed in the first direction.

1 . An electronic device comprising:
 an electronic component provided with a first electrode pad;   a die pad including an obverse surface perpendicular to a first direction, the electronic component being mounted on the obverse surface;   a first lead spaced apart from the die pad in a second direction perpendicular to the first direction;   a second lead separated from the die pad and the first lead; and   a first connection member electrically connecting the first electrode pad and the first lead to each other,   wherein the first lead and the second lead are disposed on a same side of the die pad in the second direction,   as viewed in the first direction, the first lead includes a first extended portion extending in a third direction, the first lead including a first edge and a second edge that are spaced apart from each other in the third direction, the first edge belonging to the first extended portion and being closer to the die pad than is the second edge in the second direction, the first edge being smaller in length than the second edge in the second direction,   the first connection member is bonded to the first lead,   as viewed in the first direction, the second lead includes a third edge and a fourth edge that are spaced apart from each other in the third direction, the third edge being smaller in length than the fourth edge in the second direction, and   the first edge of the first extended portion is placed closer to the die pad than is the third edge of the second lead in the second direction.   
     
     
         2 . The electronic device according to  claim 1 , wherein the die pad comprises a protrusion extending in the third direction. 
     
     
         3 . The electronic device according to  claim 2 , further comprising a third lead formed with a plurality of external terminals. 
     
     
         4 . The electronic device according to  claim 3 , wherein the third lead is placed closer to the die pad than is the second lead in the second direction. 
     
     
         5 . The electronic device according to  claim 4 , further comprising a fourth lead and a fifth lead that are spaced apart from the die pad by a mutually equal distance in the second direction. 
     
     
         6 . The electronic device according to  claim 5 , wherein the fourth lead and the fifth lead have a same shape. 
     
     
         7 . The electronic device according to  claim 6 , further comprising a sixth lead, a seventh lead, an eighth lead, a ninth lead and a tenth lead that are opposite to the first lead with respect to the die pad in the second direction. 
     
     
         8 . The electronic device according to  claim 7 , wherein the sixth lead, the seventh lead, the eighth lead, the ninth lead and the tenth lead have a mutually same shape. 
     
     
         9 . The electronic device according to  claim 8 , wherein the sixth lead, the seventh lead, the eighth lead, the ninth lead and the tenth lead are spaced apart from the die pad by a mutually same distance in the second direction. 
     
     
         10 . The electronic device according to  claim 9 , further comprising a molding resin that covers the die pad and the electronic component. 
     
     
         11 . The electronic device according to  claim 10 , wherein the molding resin covers an entirety of the electronic component. 
     
     
         12 . The electronic device according to  claim 11 , wherein the electronic device is configured as a small outline package (SOP). 
     
     
         13 . The electronic device according to  claim 12 , wherein the electronic component comprises an active region. 
     
     
         14 . The electronic device according to  claim 13 , wherein the first to the tenth leads comprise respective intermediate portions that extend generally along the first direction. 
     
     
         15 . The electronic device according to  claim 14 , wherein the intermediate portions of the first to the fifth leads are aligned along the third direction. 
     
     
         16 . The electronic device according to  claim 15 , wherein the intermediate portions of the sixth to the tenth leads are aligned along the third direction. 
     
     
         17 . The electronic device according to  claim 16 , wherein the intermediate portions of the first to the tenth leads are disposed outside of the molding resin. 
     
     
         18 . The electronic device according to  claim 1 , wherein as viewed in the first direction, the fourth edge of the second lead is smaller in length than the second edge of the first lead in the second direction. 
     
     
         19 . The electronic device according to  claim 1 , wherein as viewed in the first direction, the second lead is smaller in maximum length than the first lead in the second direction. 
     
     
         20 . The electronic device according to  claim 1 , wherein as viewed in the first direction, the first edge, the second edge, the third edge and the fourth edge are parallel to the second direction.