Contact element of a mems relay

Abstract

A contact element of a MEMS relay. The contact element includes a defined number greater than one of electrically conductive contact bodies, wherein the contact bodies are arranged at least partially within a layer that is plastically deformable in a defined manner, wherein a hardness of the plastically deformable layer is less than a hardness of the contact bodies, wherein, by exerting a compressive force on the contact bodies, the contact bodies can be pressed into the plastically deformable layer and brought to a substantially uniform height level, and wherein the plastically deformable layer is arranged at least partially within an insulation layer.

1 - 15 . (canceled) 
     
     
         16 . A contact element of a MEMS relay, comprising:
 a defined number greater than one of electrically conductive contact bodies, wherein the contact bodies are arranged at least partially within an electrically conductive, plastically deformable layer, wherein a hardness of the plastically deformable layer is less than a hardness of the contact bodies, wherein, by applying a compressive force to the contact bodies, the contact bodies can be pressed into the plastically deformable layer and brought to a substantially uniform height level, and wherein the plastically deformable layer is arranged at least partially within an insulation layer.   
     
     
         17 . The contact element according to  claim 16 , wherein the contact bodies have elongated or round cross-sections. 
     
     
         18 . The contact element according to  claim 16 , wherein the plastically deformable layer is exposed at a top side. 
     
     
         19 . The contact element according to  claim 16 , wherein the plastically deformable layer is arranged entirely within the insulation layer, and wherein the contact bodies are arranged in recesses of the insulation layer and are connected to one another via the plastically deformable layer. 
     
     
         20 . The contact element according to  claim 16 , wherein the contact bodies are arranged on separated elements of the plastically deformable layer. 
     
     
         21 . The contact element according to  claim 20 , wherein the separated elements of the plastically deformable layer are at least partially exposed laterally. 
     
     
         22 . The contact element according to  claim 20 , wherein, within the separated elements of the plastically deformable layer, at least one hollow space is respectively formed, into which the plastically deformable layer can be pressed. 
     
     
         23 . The contact element according to  claim 16 , wherein the plastically deformable layer is made of a material including aluminum and/or copper and/or gold; and wherein the contact bodies are made of a material including tungsten and/or ruthenium and/or molybdenum. 
     
     
         24 . The contact element according to  claim 16 , wherein exposed surfaces of the contact bodies are approximately <2 μm and edge radii of the contact bodies are approximately <0.5 μm. 
     
     
         25 . The contact element according to  claim 16 , wherein the contact bodies are arranged at a distance of approximately <10 μm to one another. 
     
     
         26 . The contact element according to  claim 16 , wherein the contact bodies are arranged in an array. 
     
     
         27 . The contact element according to  claim 16 , wherein a total number of the contact bodies is such that it results in an electrical target resistance of the contact element. 
     
     
         28 . The contact element according to  claim 16 , wherein the contact bodies are coated with a material that substantially prevents oxide formation at a surface of the contact bodies. 
     
     
         29 . A method for producing a contact element for a MEMS relay, comprising the following steps:
 depositing and structuring a plastically deformable layer;   depositing an insulation layer onto the structured, plastically deformable layer;   introducing holes into the insulation layer;   filling the holes with an electrically conductive material;   carrying out a polishing step of the electrically conductive material with a stop on the insulation layer; and   removing the insulation layer.   
     
     
         30 . A method for leveling contact bodies of a contact element of a MEMS relay,
 wherein the contact element includes:
 a defined number greater than one of electrically conductive contact bodies, wherein the contact bodies are arranged at least partially within an electrically conductive, plastically deformable layer, wherein a hardness of the plastically deformable layer is less than a hardness of the contact bodies, wherein, by applying a compressive force to the contact bodies, the contact bodies can be pressed into the plastically deformable layer and brought to a substantially uniform height level, and wherein the plastically deformable layer is arranged at least partially within an insulation layer; 
   wherein the method comprises:
 applying a compressive force to the contact bodies and pressing the contact bodies into the plastically deformable layer of the contact element to a uniform height level of the contact bodies, wherein the application of the compressive force is caused by striking a contact structure of the MEMS relay that is arranged movably relative to the contact element, against the contact bodies.