Wafer polishing system

Abstract

Disclosed in the present invention is a wafer polishing system, comprising at least a polishing unit, which comprises a fixed working station and at least two polishing modules, wherein the polishing modules are located on two sides of the fixed working station; each polishing module comprises a polishing platform and a polishing arm, which can drive a wafer to move relative to the polishing platform, so as to implement a polishing process; the polishing arms of the polishing modules on the two sides are located in a diagonal direction of the fixed working station; and the polishing arms can respectively swing between the fixed working station and the polishing platforms to transfer the wafer, and movement regions of the polishing arms having an overlapping portion.

1 . A wafer polishing system, comprising:
 at least one polishing unit;   wherein, the polishing unit comprises a fixed working position and at least two polishing modules located on two sides of the fixed working position;   each of the polishing modules comprises a polishing platform and a polishing arm capable of driving a wafer to rotate with respect to the polishing platform to implement a polishing process;   the polishing arms of the polishing modules on the two sides are located in a diagonal direction of the fixed working position and are able to swing between the fixed working position and the polishing platforms to transfer the wafer respectively, and movement areas of the polishing arms have an overlap.   
     
     
         2 . The wafer polishing system according to  claim 1 , wherein after the polishing arm of one polishing module obtains the wafer from the fixed working position, the polishing process is completed, and the wafer is placed back to the fixed working position along a first trajectory; after the polishing arm of the other polishing module obtains the wafer from the fixed working position, the polishing process is completed, and the wafer is placed back to the fixed working position along a second trajectory; and the first trajectory and the second trajectory are approximately S-shaped. 
     
     
         3 . The wafer polishing system according to  claim 1 , wherein an overlap of the movement areas is eye-shaped, and a central axis of the fixed working position passes through a centre of the overlap. 
     
     
         4 . The wafer polishing system according to  claim 2 , wherein the first trajectory and the second trajectory are movement trajectories of a centre of the wafer and have only one point of tangency. 
     
     
         5 . The wafer polishing system according to  claim 1 , wherein a swing angle of the polishing arm is less than 180°. 
     
     
         6 . The wafer polishing system according to  claim 1 , wherein the fixed working position is configured as a height-adjustable structure, and when the fixed working position does not interact with the polishing arm for wafer loading or unloading, the fixed working position is located below a plane where the polishing platform is located. 
     
     
         7 . The wafer polishing system according to  claim 1 , wherein the polishing unit comprises two polishing modules; after a first polishing arm obtains the wafer from the fixed working position, the wafer is polished on a first polishing platform; after one polishing module completes the polishing process, the first polishing arm places the wafer back to the fixed working position and rotates away from the fixed working position, a second polishing arm obtains the wafer from the fixed working position, and the wafer is polished on a second polishing platform; and at the same time, another wafer is placed on the fixed working position. 
     
     
         8 . The wafer polishing system according to  claim 7 , wherein after placing the polished wafer back to the fixed working position, the first polishing arm further rotates to a cleaning position to be cleaned; and after placing the polished wafer back to the fixed working position, the second polishing arm further rotates to a cleaning position to be cleaned. 
     
     
         9 . The wafer polishing system according to  claim 1 , wherein the polishing unit comprises two said polishing modules; after a first polishing arm obtains the wafer from the fixed working position, the wafer is polished on a first polishing platform; and at the same time, another wafer is placed on the fixed working position, a second polishing arm obtains the wafer from the fixed working position, and the wafer is polished on a second polishing platform. 
     
     
         10 . The wafer polishing system according to  claim 1 , wherein a number of the polishing unit is three, the three polishing units are adjacently arranged in a vertical direction, and each polishing unit is provided with two polishing modules. 
     
     
         11 . The wafer polishing system according to  claim 10 , wherein a connecting line between centres of the polishing platforms of the two polishing modules in each polishing unit intersects with a central axis of the fixed working position.