Wire bonding apparatus and semiconductor package manufactured using the same

Abstract

A capilary of a wire bonding apparatus including: a body having a wire hole formed in an inner central region of the body and through a length of the body, and a wire discharge portion disposed at a lower end portion of the body and including an injection hole in an outer circumference of the wire discharge portion.

What is claimed is: 
     
         1 . A capillary of a wire bonding apparatus, the capillary comprising:
 a body having a wire hole formed in an inner central region of the body and through a length of the body; and   a wire discharge portion disposed at a lower end portion of the body and comprising an injection hole in an outer circumference of the wire discharge portion.   
     
     
         2 . The capillary of  claim 1 , wherein the wire discharge portion comprises:
 a pressing portion disposed at a lower end portion of the wire discharge portion and inclined upward toward an outward direction of the wire discharge portion in at least one region; and   a gas injection surface extending upward from the pressing portion,   wherein an outer end of the injection hole is disposed on the gas injection surface.   
     
     
         3 . The capillary of  claim 2 , wherein an inclination of a lower end portion of the gas injection surface is greater than an inclination of the pressing portion with respect to a direction orthogonal to a vertical direction. 
     
     
         4 . The capillary of  claim 2 , wherein a height from an outer end portion of the pressing portion to the injection hole is greater than a height of an inner end of the pressing portion. 
     
     
         5 . The capillary of  claim 1 , wherein an inner end portion of the injection hole is connected to the wire hole. 
     
     
         6 . The capillary of  claim 5 , further comprising an inlet flow passage that passes through the body and connects the wire hole to an outer surface of the body. 
     
     
         7 . The capillary of  claim 6 , wherein the inlet flow passage is inclined downward to the inner end portion. 
     
     
         8 . The capillary of  claim 6 , wherein an inlet-side fastening auxiliary portion is formed in an area in which an outer end portion of the inlet flow passage is disposed on an outer surface of the body, and the inlet-side fastening auxiliary portion comprises a groove structure inwardly recessed or a protrusion structure outwardly protruding. 
     
     
         9 . The capillary of  claim 8 , wherein the wire bonding apparatus comprises:
 a spool supplying a wire to the capillary;   a driving member movable in a three-dimensional space and including a driving body having a fastening space in which the capillary is coupled; and   a supply passage connected to the fastening space and formed in the driving body.   
     
     
         10 . The capillary of  claim 9 , wherein a supply-side fastening auxiliary portion formed on a surface facing the fastening space has a protrusion structure or a groove structure corresponding to the inlet-side fastening auxiliary portion formed in the driving body. 
     
     
         11 . The capillary of  claim 1 , wherein the body includes an inlet flow passage having a first end disposed on an outer surface of the body and a second end connected to an inner end portion of the injection hole. 
     
     
         12 . The capillary of  claim 11 , wherein the inlet flow passage comprises:
 an inlet portion including an outer end exposed to an external space through an outer surface of the body;   a connection portion connected to an inner end portion of the inlet portion; and   a distribution portion connected to the connection portion and an inner end portion of the injection hole.   
     
     
         13 . The capillary of  claim 12 , wherein the distribution portion is formed in a ring shape. 
     
     
         14 . A wire bonding apparatus comprising:
 a capillary for discharging a wire;   a spool for supplying the wire to the capillary; and   a driving member coupled to the capillary and movable in a three-dimensional space,   wherein the capillary comprises:   a body having a wire hole formed in an inner central region of the body and through a length of the body, and through which the wire is discharged; and   a wire discharge portion disposed at a lower portion of the body,   wherein the wire discharge portion comprises:   a pressing portion disposed at a lower end portion of the wire discharge portion and inclined upward toward an outward direction the wire discharge portion in at least one region; and   a gas injection surface extending upward from the pressing portion and having an outer circumference at which an outer end of an injection hole for spraying gas is disposed.   
     
     
         15 . The wire bonding apparatus of  claim 14 , wherein a height from an outer end portion of the pressing portion to the injection hole is greater than a height of an inner end of the pressing portion. 
     
     
         16 . A semiconductor package comprising:
 a substrate having a substrate-side junction portion;   an electronic device attached to the substrate and having a device-side junction portion; and   a connection wire having a first end portion bonded to the substrate-side junction portion and a second end portion bonded to the device-side junction portion,   wherein the connection wire has a roughness change region having lower roughness than a region adjacent to at least one of the first end portion and the second end portion.   
     
     
         17 . The semiconductor package of  claim 16 , wherein the roughness change region is disposed adjacent to a stitch bond region of the connection wire. 
     
     
         18 . The semiconductor package of  claim 17 , wherein the roughness change region has a lower roughness than a region disposed in an opposite direction based on a cross-section crossing a length direction of the connection wire. 
     
     
         19 . The semiconductor package of  claim 17 , wherein a roughness of a central region of the roughness change region is lower than that of an outer region thereof. 
     
     
         20 . The semiconductor package of  claim 17 , wherein the roughness change region is spaced apart from an end of the connection wire by about 28 μm to about 31 μm.