US2024359288A1PendingUtilityA1

Method of using polishing pad

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Assignee: TAIWAN SEMICONDUCTOR MFG CO LTDPriority: Dec 14, 2016Filed: Jul 12, 2024Published: Oct 31, 2024
Est. expiryDec 14, 2036(~10.4 yrs left)· nominal 20-yr term from priority
Inventors:Chunhung ChenJung-Yu LiSheng-Chen WangShih-Sian Huang
B24B 49/12B24B 37/005B24B 53/017B24B 37/10B24B 37/22B24B 37/24B24B 37/26B24B 37/107
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Claims

Abstract

A method of using a polishing pad includes applying a slurry in a first region of the polishing pad. The method further includes spreading the slurry across the first region of the polishing pad at a first rate. The method further includes spreading the slurry across a second region at a second rate different from the first rate, wherein the second region is farther from a center of the polishing pad than the first region. The method further includes spreading the slurry across a third region at a third rate different from the second rate, wherein the second region is between the third region and the first region.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of using a polishing pad, the method comprising:
 applying a slurry in a first region of the polishing pad;   spreading the slurry across the first region of the polishing pad at a first rate;   spreading the slurry across a second region at a second rate different from the first rate, wherein the second region is farther from a center of the polishing pad than the first region; and   spreading the slurry across a third region at a third rate different from the second rate, wherein the second region is between the third region and the first region.   
     
     
         2 . The method of  claim 1 , further comprising rotating the polishing pad, wherein the rotating the polishing pad causes the spreading of the slurry across the first region. 
     
     
         3 . The method of  claim 1 , wherein the first region has a first porosity, and the second region has a second porosity different from the first region. 
     
     
         4 . The method of  claim 1 , wherein the first region has a first groove having a first depth, the second region has a second groove having a second depth different from the first depth, and the third region has a third groove having the first depth. 
     
     
         5 . The method of  claim 1 , wherein the first region has a first groove having a first width, the second region has a second groove having a second width different from the first width, and the third region has a third groove having the first width. 
     
     
         6 . The method of  claim 1 , wherein the first region has a first groove having a first depth, the second region has a second groove having a second depth different from the first depth, and the third region has a third groove having a third depth different from the second depth. 
     
     
         7 . The method of  claim 1 , wherein the first region has a first groove having a first width, the second region has a second groove having a second width different from the first width, and the third region has a third groove having a third width different from the second width. 
     
     
         8 . A method of using a polishing pad, the method comprising:
 applying a slurry to a first location on the polishing pad;   rotating the polishing pad;   spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region has a first porosity;   spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region has a second porosity; and   spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region has a third porosity.   
     
     
         9 . The method of  claim 8 , wherein spreading the slurry across the first region comprises spreading the slurry across the first region comprises a plurality of first grooves. 
     
     
         10 . The method of  claim 9 , wherein spreading the slurry across the second region comprises spreading the slurry across the second region comprising a plurality of second grooves. 
     
     
         11 . The method of  claim 10 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region comprising a plurality of third grooves. 
     
     
         12 . The method of  claim 11 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region comprising the plurality of third grooves having a same depth as the plurality of first grooves. 
     
     
         13 . The method of  claim 11 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region comprising the plurality of third grooves having a different depth from the plurality of first grooves. 
     
     
         14 . The method of  claim 11 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region comprising the plurality of third grooves having a same width as the plurality of first grooves. 
     
     
         15 . The method of  claim 11 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region comprising the plurality of third grooves having a different width from the plurality of first grooves. 
     
     
         16 . A method of using a polishing pad, the method comprising:
 applying a slurry to a first location on the polishing pad;   rotating the polishing pad;   spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region comprises a plurality of first grooves, and each of the plurality of first grooves has a first width and a first depth;   spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region comprises a plurality of second grooves, and each of the plurality of second grooves has a second width and a second depth; and   spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region comprises a plurality of third grooves, each of the plurality of third grooves has a third width and a third depth, and the third width is different from at least one of the first width or the second width.   
     
     
         17 . The method of  claim 16 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region comprising the plurality of third grooves having the third depth different from at least one of the first depth or the second depth. 
     
     
         18 . The method of  claim 16 , wherein spreading the slurry across the second region comprises spreading the slurry across the second region comprising the plurality of second grooves having the second depth different from the first depth. 
     
     
         19 . The method of  claim 16 , wherein spreading the slurry across the second region comprises spreading the slurry across the second region comprising the plurality of second grooves having the second width different from the first width. 
     
     
         20 . The method of  claim 16 , wherein spreading the slurry across the third region comprises spreading the slurry across the third region having a third porosity different from a first porosity of the first region and a second porosity of the second region.

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