Circuit module

Abstract

A circuit module that includes: a substrate; a stud electrode on a surface of the substrate; a molding resin on the surface of the substrate and covering a periphery of the stud electrode, the molding resin including: a first main surface adjacent the surface of the substrate; and a second main surface opposed to the first main surface, the molding resin including a recess in the second main surface, the recess being located such that an end surface and a side surface of the stud electrode are exposed in the recess from the molding resin; and a plating layer on the exposed side surface of the stud electrode.

1 . A circuit module comprising:
 a substrate;   a stud electrode on a surface of the substrate;   a molding resin on the surface of the substrate and covering a periphery of the stud electrode, the molding resin including: a first main surface adjacent the surface of the substrate; and a second main surface opposed to the first main surface, the molding resin including a recess in the second main surface, the recess being located such that an end surface and a side surface of the stud electrode are exposed in the recess from the molding resin; and   a plating layer on the exposed side surface of the stud electrode.   
     
     
         2 . The circuit module according to  claim 1 , wherein the plating layer is also on the exposed end surface of the stud electrode. 
     
     
         3 . The circuit module according to  claim 2 , wherein the exposed end surface of the stud electrode is located on a same plane as the second main surface of the molding resin. 
     
     
         4 . The circuit module according to  claim 1 , wherein the exposed end surface of the stud electrode is located on a same plane as the second main surface of the molding resin. 
     
     
         5 . The circuit module according to  claim 2 , wherein the exposed end surface of the stud electrode is located closer to the substrate as compared to the second main surface of the molding resin. 
     
     
         6 . The circuit module according to  claim 1 , wherein the exposed end surface of the stud electrode is located closer to the substrate as compared to the second main surface of the molding resin. 
     
     
         7 . The circuit module according to  claim 1 , wherein a height of the exposed side surface of the stud electrode in a thickness direction of the molding resin is 5% to 30% of a thickness of the molding resin. 
     
     
         8 . The circuit module according to  claim 1 , wherein a height of the exposed side surface of the stud electrode in a thickness direction of the molding resin is 10% to 25% of a thickness of the molding resin. 
     
     
         9 . The circuit module according to  claim 1 , wherein a depth of the recess in a thickness direction of the molding resin is 10% to 50% of a thickness of the molding resin. 
     
     
         10 . The circuit module according to  claim 1 , wherein a depth of the recess in a thickness direction of the molding resin is 20% to 45% of a thickness of the molding resin. 
     
     
         11 . The circuit module according to  claim 1 , wherein the stud electrode comprises a porous body. 
     
     
         12 . The circuit module according to  claim 11 , wherein the porous body has an internal porosity of 5 vol % to 40 vol %. 
     
     
         13 . The circuit module according to  claim 11 , wherein the porous body has an internal porosity of 10 vol % to 35 vol %. 
     
     
         14 . The circuit module according to  claim 6 , wherein the stud electrode comprises a porous body. 
     
     
         15 . The circuit module according to  claim 14 , wherein the porous body has an internal porosity of 5 vol % to 40 vol %. 
     
     
         16 . The circuit module according to  claim 14 , wherein the porous body has an internal porosity of 10 vol % to 35 vol %. 
     
     
         17 . The circuit module according to  claim 1 , wherein an area inside a contour of a bottom surface of the recess of the second main surface as viewed from a direction perpendicular to the second main surface is 0.03 mm to 0.30 mm. 
     
     
         18 . The circuit module according to  claim 1 , wherein the recess has a tapered shape.