Connecting system and electrical connector for chip module
Abstract
A connecting system and an electrical connector for a chip module are provided. The connecting system includes the chip module and the electrical connector. The chip module includes a chip substrate. The chip substrate has a plurality of first conductive pads arranged in a matrix manner. The electrical connector includes a first output end and a second output end. The first output end is configured to connect with a plurality of external cables, and the second output end has a plurality of conductive contact parts arranged in the matrix manner. The second output end of the electrical connector is disposed face-to-face with the chip module. The conductive contact parts are electrically connected to the first conductive pads of the chip substrate.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An electrical connector, comprising:
a main body having a first output end and a second output end, the first output end being configured to have a multi-layer stepped shape, and the second output end being configured to directly face a chip module; a plurality of conductive terminals received in the main body, each of the plurality of conductive terminals having a connecting portion exposed outside of the first output end of the main body, and a conductive contact part exposed outside of the second output end of the main body; wherein the conductive contact parts are configured to correspondingly connect with a plurality of conductive pads of the chip module; and a plurality of external cables correspondingly disposed on the second output end of the main body, and connecting to the connecting portions of the plurality of conductive terminals
2 . The electrical connector according to claim 1 , further comprising an adapter board, wherein the adapter board is received in the main body and adjacent to a bottom portion of the main body, the adapter board has an upper surface and a lower surface, the upper surface includes a plurality of upper contacts, the lower surface includes a plurality of lower contacts, the plurality of upper contacts are respectively and electrically connected to the plurality of lower contacts, the connecting portions of the plurality of conductive terminals are electrically connected to the plurality of upper contacts of the adapter board, and the plurality of lower contacts are exposed outside of the main body and are configured to contact the conductive pads of the chip module.
3 . The electrical connector according to claim 2 , wherein the first output end has a plurality of output ports, the plurality of output ports are formed to have a stepped shape and face toward a same direction, and a cross-sectional area of one of the output ports that is adjacent to the adapter board is larger than a cross-sectional area of one of the output ports that is distant from the adapter board.
4 . The electrical connector according to claim 3 , wherein the output port has a first output interface and a second output interface, and an obtuse angle is formed between the first output interface and the second output interface.
5 . The electrical connector according to claim 2 , wherein an area of the adapter board is smaller than or equal to an area of the chip module.
6 . The electrical connector according to claim 2 , wherein the plurality of lower contacts of the adapter board are electrically connected to a plurality of signal terminals of the chip module.
7 . The electrical connector according to claim 1 , wherein a plurality of fixing portions are formed on a bottom portion of the main body.
8 . A connecting system, comprising:
a chip module including a chip substrate, the chip substrate having a plurality of first conductive pads arranged in a matrix manner; and an electrical connector including:
a first output end being configured to connect with a plurality of external cables; and
a second output end having a plurality of conductive contact parts arranged in the matrix manner;
wherein the second output end of the electrical connector is disposed face-to-face with the chip module, and the conductive contact parts are electrically connected to the first conductive pads of the chip substrate.
9 . The connecting system according to claim 8 , wherein one end of the chip module has a protruding portion, and the protruding portion has a plurality of second conductive pads that are arranged in one row or two rows.
10 . The connecting system according to claim 8 , further comprising a fixing frame, wherein the chip module and the electrical connector are fixed to the fixing frame, and the electrical connector and the chip module are oppositely disposed on two sides of the fixing frame.
11 . The connecting system according to claim 8 , further comprising a cooling device, wherein the cooling device is disposed on the chip module, and the cooling device and the electrical connector are respectively disposed on two opposite sides of the chip module.Join the waitlist — get patent alerts
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